Thermal Interface Materials: Historical Perspective, Status, and Future Directions
Abstract
With the continual increase in cooling demand for microprocessors, there has been an increased focus within the microelectronics industry on developing thermal solutions. Thermal interface materials (TIMs) play a key role in thermally connecting various components of the thermal solution. Review of the progress made in the area of TIMs in the past five years is presented. The focus is on the rheology-based modeling and design of polymeric TIMs due to their widespread use. Review of limited literature on the thermal performance of solders is also provided. Merits and demerits of using nanoparticles and nanotubes for TIM applications are also discussed. I conclude the paper with some directions for the future that I feel are relatively untouched and potentially very beneficial
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Most conventional thermal conductivity measurement techniques lack the spatial resolution to measure the temperature gradient/difference or the heat flux across a length scale below tens of microns.
“However, most of the conventional thermal conductivity measurement techniques lack the spatial resolution to measure the temperature gradient/difference or the heat flux across a length scale below tens of microns.”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [21]
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- Authors
- Prasher, R.
- Affiliations
- Intel (United States) (US)
- Corresponding author
- Prasher, R.
- ORCID
- Prasher, R.
- Venue
- Proceedings of the IEEE
- Published
- 2006-08
- Volume
- 94
- Issue
- 8
- Pages
- 1571-1586
- ISSN
- 0018-9219 (ISSN-L)
- 1558-2256
- OpenAlex
- W2049638322
- Cited by
- 927
- References
- 82
- Citations by year
- 2026: 61 · 2025: 56 · 2024: 45 · 2023: 54 · 2022: 49 · 2021: 54 · 2020: 63 · 2019: 68 · 2018: 61 · 2017: 61 · 2016: 59 · 2015: 40 · 2014: 50 · 2013: 49 · 2012: 33
- FWCI
- 12.00
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Proceedings of the IEEE (publishedVersion)
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Computational Mechanics › Heat Transfer and Numerical Methods
- Keywords
- thermal interface materials, CPU cooling, solder, thermal performance, nanoparticles, carbon nanotubes, thermal management
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