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Atomic Layer Deposition of Hafnium and Zirconium Oxides Using Metal Amide Precursors

Hausmann, Dennis M., Kim, Esther, Becker, Jill, Gordon, Roy G.·2002·Chemistry of Materials

Abstract

Atomic layer deposition (ALD) of smooth and highly conformal films of hafnium and zirconium oxides was studied using six metal alkylamide precursors for hafnium and zirconium. Water was used as an oxygen source during these experiments. As deposited, these films exhibited a smooth surface with a measured roughness equivalent to that of the substrate on which they were deposited. These films also exhibited a very high degree of conformality: 100% step coverage on holes with aspect ratios greater than 35. The films were completely uniform in thickness and composition over the length of the deposition reactor. The films were free of detectable impurities and had the expected (2:1) oxygen-to-metal ratio. Films were deposited at substrate temperatures from 50 to 500 °C from precursors that were vaporized at temperatures from 40 to 140 °C. The precursors were found to be highly reactive with hydroxylated surfaces. Their vapor pressures were measured over a wide temperature range. Deposition reactor design and ALD cycle design using these precursors are discussed.

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Metadata

Authors
Hausmann, D. M., Kim, E., Becker, J., & Gordon, R. G.
Venue
Chemistry of Materials
Published
2002-09-21
Volume
14
Issue
10
Pages
4350-4358
ISSN
  • 0897-4756 (ISSN-L)
  • 1520-5002
OpenAlex
W2041246757
Cited by
542
References
0
FWCI
18.93
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Atomic Layer Deposition of Hafnium and Zirconium Oxides Using Metal Amide Precursors. https://app.cochat.ai/papers/10.1021/cm020357x
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Hausmann, D. M., Kim, E., Becker, J., & Gordon, R. G. (2002). Atomic Layer Deposition of Hafnium and Zirconium Oxides Using Metal Amide Precursors. Chemistry of Materials. https://doi.org/10.1021/cm020357x

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