Student or educator? Sign up with your school email and get 6 months of Pro free.
Cited by 383

The DOI matches its Crossref record; 9 of the 9 references it cites were found in a registry or an index.

A Review of Three‐Dimensional Resistive Switching Cross‐Bar Array Memories from the Integration and Materials Property Points of View

Seok, Jun Yeong, Song, Seul Ji, Yoon, Jung Ho, Yoon, Kyung Jean, Park, Tae Hyung, Kwon, Dae Eun, Lim, Hyungkwang, Kim, Gun Hwan, Jeong, Doo Seok, Hwang, Cheol Seong·2014·Advanced Functional Materials

Abstract

Issues in the circuitry, integration, and material properties of the two‐dimensional (2D) and three‐dimensional (3D) crossbar array (CBA)‐type resistance switching memories are described. Two important quantitative guidelines for the memory integration are provided with respect to the required numbers of signal wires and sneak current paths. The advantage of 3D CBAs over 2D CBAs (i.e., the decrease in effect memory cell size) can be exploited only under certain limited conditions due to the increased area and layout complexity of the periphery circuits. The sneak current problem can be mitigated by the adoption of different voltage application schemes and various selection devices. These have critical correlations, however, and depend on the involved types of resistance switching memory. The problem is quantitatively dealt with using the generalized equation for the overall resistance of the parasitic current paths. Atomic layer deposition is discussed in detail as the most feasible fabrication process of 3D CBAs because it can provide the device with the necessary conformality and atomic‐level accuracy in thickness control. Other subsidiary issues related to the line resistance, maximum available current, and fabrication technologies are also reviewed. Finally, a summary and outlook on various other applications of 3D CBAs are provided.

Overview

The claims and statistics of this paper haven’t been checked yet.

Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.

A few free checks a day · papers already verified open instantly · results are public

Integrity signals

Registry

Crossref · 10.1002/adfm.201303520

Cites

9 of 9 references verified0 citation errors · 0 not checkable

Statistics

Verification

Claims the paper makes

The claims and statistics of this paper haven’t been checked yet.

Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.

A few free checks a day · papers already verified open instantly · results are public

Self-check

Percentages, sums and reported differences re-computed from the paper’s own numbers.

The self-check needs the paper’s full text.

Citations

Cites

Show all 9 references

Cited by

See all 383

Metadata

Authors
Seok, J. Y., Song, S. J., Yoon, J. H., Yoon, K. J., Park, T. H., Kwon, D. E., Lim, H., Kim, G. H., Jeong, D. S., & Hwang, C. S.
Venue
Advanced Functional Materials
Publisher
Wiley
Published
2014-07-03
Volume
24
Issue
34
Pages
5316-5339
ISSN
  • 1616-301X (ISSN-L)
  • 1616-3028
OpenAlex
W1998177673
Cited by
383
References
9
FWCI
19.28
Type
journal article
Language
en
Open access
closed

About these checks

Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

Statistics and arithmetic are recomputed, not judged.

Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.

What counts as a claim ›How we measure confidence ›How we check this ›

Are you an author, or do you see a problem with this page? Request a review

How to cite

Cite CoChat for the checks on this page, and the paper for its own findings.

This page
CoChat. (2026). Citation check: A Review of Three‐Dimensional Resistive Switching Cross‐Bar Array Memories from the Integration and Materials Property Points of View. https://app.cochat.ai/papers/10.1002/adfm.201303520
The paper
Seok, J. Y., Song, S. J., Yoon, J. H., Yoon, K. J., Park, T. H., Kwon, D. E., Lim, H., Kim, G. H., Jeong, D. S., & Hwang, C. S. (2014). A Review of Three‐Dimensional Resistive Switching Cross‐Bar Array Memories from the Integration and Materials Property Points of View. Advanced Functional Materials. https://doi.org/10.1002/adfm.201303520

Data sources

Bibliographic data: Semantic Scholar, OpenAlex, Crossref.

Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.