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Substrate-Enhanced Electroless Deposition of Metal Nanoparticles on Carbon Nanotubes
Abstract
By simply supporting carbon nanotubes with a metal substrate of a redox potential lower than that of the metal ions to be reduced into nanoparticles, we have developed a facile yet versatile and effective substrate-enhanced electroless deposition (SEED) method for functionalizing nanotubes with a large variety of metal nanoparticles, including those otherwise impossible by more conventional electroless deposition methods, in the absence of any additional reducing agent. The nanotube-supported metal nanoparticles thus produced are electrochemically active, and the newly developed SEED process represents a significant advance in functionalization of carbon nanotubes with metal nanoparticles for a wide range of potential applications, including in advanced sensing and catalytic systems.
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Citations
Cited by
Carbon Nanotube−Inorganic Hybrids
Eder, D. (2010) · Chemical Reviews · doi:10.1021/cr800433k · Cited by 819
Cheng, Q., Hu, C., Wang, G., Zou, Z., Yang, H., & Dai, L. (2020) · Journal of the American Chemical Society · doi:10.1021/jacs.9b11524 · Cited by 303
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Metadata
- Authors
- Qu, L., & Dai, L.
- Venue
- Journal of the American Chemical Society
- Publisher
- American Chemical Society (ACS)
- Published
- 2005-07-19
- Volume
- 127
- Issue
- 31
- Pages
- 10806-10807
- ISSN
- 0002-7863 (ISSN-L)
- 1520-5126
- OpenAlex
- W2785755719
- Cited by
- 293
- References
- 0
- FWCI
- 15.89
- Type
- journal article
- Language
- en
- Open access
- closed
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- Qu, L., & Dai, L. (2005). Substrate-Enhanced Electroless Deposition of Metal Nanoparticles on Carbon Nanotubes. Journal of the American Chemical Society. https://doi.org/10.1021/ja053479%2B
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Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
