The DOI matches its Crossref record; 4 of the 4 references it cites were found in a registry or an index.
High-Density Chemical Intercalation of Zero-Valent Copper into Bi2Se3 Nanoribbons
Abstract
A major goal of intercalation chemistry is to intercalate high densities of guest species without disrupting the host lattice. Many intercalant concentrations, however, are limited by the charge of the guest species. Here we have developed a general solution-based chemical method for intercalating extraordinarily high densities of zero-valent copper metal into layered Bi(2)Se(3) nanoribbons. Up to 60 atom % copper (Cu(7.5)Bi(2)Se(3)) can be intercalated with no disruption to the host lattice using a solution disproportionation redox reaction.
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Citations
Cites
Topological insulators in Bi2Se3, Bi2Te3 and Sb2Te3 with a single Dirac cone on the surface
Zhang, H., Liu, C.-X., Qi, X.-L., Dai, X., Fang, Z., & Zhang, S.-C. (2009) · Nature Physics · doi:10.1038/nphys1270 · Cited by 6,359
Morosan, E., Zandbergen, H. W., Dennis, B. S., Bos, J. W. G., Onose, Y., Klimczuk, T., Ramirez, A. P., Ong, N. P., & Cava, R. J. (2006) · Nature Physics · doi:10.1038/nphys360 · Cited by 991
Aharonov–Bohm interference in topological insulator nanoribbons
Peng, H., Lai, K., Kong, D., Meister, S., Chen, Y., Qi, X.-L., Zhang, S.-C., Shen, Z.-X., & Cui, Y. (2010) · Nature Materials · doi:10.1038/nmat2609 · Cited by 780
Self-citationObservation of topological order in a superconducting doped topological insulator
Wray, L. A., Xu, S.-Y., Xia, Y., Hor, Y. S., Qian, D., Fedorov, A. V., Lin, H., Bansil, A., Cava, R. J., & Hasan, M. Z. (2010) · Nature Physics · doi:10.1038/nphys1762 · Cited by 464
Cited by
MoSe 2 and WSe 2 Nanofilms with Vertically Aligned Molecular Layers on Curved and Rough Surfaces
Wang, H., Kong, D., Johanes, P., Cha, J. J., Zheng, G., Yan, K., Liu, N., & Cui, Y. (2013) · Nano Letters · doi:10.1021/nl401944f · Cited by 693
Self-citationZhang, X., Chen, J., Min, Y., Park, G. B., Shen, X., Song, S., Sun, Y., Wang, H., Long, W., Xie, J., et al. (2014) · Advanced Functional Materials · doi:10.1002/adfm.201302312 · Cited by 263
Metadata
- Authors
- Koski, K. J., Cha, J. J., Reed, B. W., Wessells, C. D., Kong, D., & Cui, Y.
- Venue
- Journal of the American Chemical Society
- Publisher
- American Chemical Society (ACS)
- Published
- 2012-04-30
- Volume
- 134
- Issue
- 18
- Pages
- 7584-7587
- ISSN
- 0002-7863 (ISSN-L)
- 1520-5126
- OpenAlex
- W2331443544
- Cited by
- 182
- References
- 4
- FWCI
- 4.74
- Type
- journal article
- Language
- en
- Open access
- closed
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- Koski, K. J., Cha, J. J., Reed, B. W., Wessells, C. D., Kong, D., & Cui, Y. (2012). High-Density Chemical Intercalation of Zero-Valent Copper into Bi2Se3 Nanoribbons. Journal of the American Chemical Society. https://doi.org/10.1021/ja300368x
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