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Efficient strain modulation of 2D materials via polymer encapsulation
Open accessAbstract
Strain engineering is a promising method to manipulate the electronic and optical properties of two-dimensional (2D) materials. However, with weak van der Waals interaction, severe slippage between 2D material and substrate could dominate the bending or stretching processes, leading to inefficiency strain transfer. To overcome this limitation, we report a simple strain engineering method by encapsulating the monolayer 2D material in the flexible PVA substrate through spin-coating approach. The strong interaction force between spin-coated PVA and 2D material ensures the mechanical strain can be effectively transferred with negligible slippage or decoupling. By applying uniaxial strain to monolayer MoS 2, we observe a higher bandgap modulation up to ~300 meV and a highest modulation rate of ~136 meV/%, which is approximate two times improvement compared to previous results achieved. Moreover, this simple strategy could be well extended to other 2D materials such as WS 2 or WSe 2, leading to enhanced bandgap modulation.
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Lattice‐Strain Engineering for Heterogenous Electrocatalytic Oxygen Evolution Reaction
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Deformable Catalytic Material Derived from Mechanical Flexibility for Hydrogen Evolution Reaction
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Self-citationEco-Feedback for Food Waste Reduction in a Student Residence
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Metadata
- Authors
- Li, Z., Lv, Y., Ren, L., Li, J., Kong, L., Zeng, Y., Tao, Q., Wu, R., Ma, H., Zhao, B., Wang, D., Dang, W., Chen, K., Liao, L., Duan, X., Duan, X., & Liu, Y.
- Venue
- Nature Communications
- Published
- 2020-03-02
- Volume
- 11
- Issue
- 1
- Pages
- 1151-1151
- ISSN
- 2041-1723 (ISSN-L)
- OpenAlex
- W3009350640
- Cited by
- 428
- References
- 37
- FWCI
- 19.20
- Type
- journal article
- Language
- en
- Open access
- gold
- Licence
- creativecommons.org/licenses/by/4.0 (tdm)
- creativecommons.org/licenses/by/4.0 (vor)
- Funders
- National Natural Science Foundation of China (51991343, 51802090, 51991341, 61874041)
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- Li, Z., Lv, Y., Ren, L., Li, J., Kong, L., Zeng, Y., Tao, Q., Wu, R., Ma, H., Zhao, B., Wang, D., Dang, W., Chen, K., Liao, L., Duan, X., Duan, X., & Liu, Y. (2020). Efficient strain modulation of 2D materials via polymer encapsulation. Nature Communications. https://doi.org/10.1038/s41467-020-15023-3
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