The DOI matches its Crossref record; 35 of the 35 references it cites were found in a registry or an index.
A powder-metallurgy-based strategy toward three-dimensional graphene-like network for reinforcing copper matrix composites
Open accessAbstract
Three-dimensional graphene network is a promising structure for improving both the mechanical properties and functional capabilities of reinforced polymer and ceramic matrix composites. However, direct application in a metal matrix remains difficult due to the reason that wetting is usually unfavorable in the carbon/metal system. Here we report a powder-metallurgy based strategy to construct a three-dimensional continuous graphene network architecture in a copper matrix through thermal-stress-induced welding between graphene-like nanosheets grown on the surface of copper powders. The interpenetrating structural feature of the as-obtained composites not only promotes the interfacial shear stress to a high level and thus results in significantly enhanced load transfer strengthening and crack-bridging toughening simultaneously, but also constructs additional three-dimensional hyperchannels for electrical and thermal conductivity. Our approach offers a general way for manufacturing metal matrix composites with high overall performance.
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Cites
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Metadata
- Authors
- Zhang, X., Xu, Y., Wang, M., Liu, E., Zhao, N., Shi, C., Lin, D., Zhu, F., & He, C.
- Venue
- Nature Communications
- Published
- 2020-06-02
- Volume
- 11
- Issue
- 1
- Pages
- 2775-2775
- ISSN
- 2041-1723 (ISSN-L)
- OpenAlex
- W3030460461
- Cited by
- 355
- References
- 35
- FWCI
- 18.00
- Type
- journal article
- Language
- en
- Open access
- gold
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- Zhang, X., Xu, Y., Wang, M., Liu, E., Zhao, N., Shi, C., Lin, D., Zhu, F., & He, C. (2020). A powder-metallurgy-based strategy toward three-dimensional graphene-like network for reinforcing copper matrix composites. Nature Communications. https://doi.org/10.1038/s41467-020-16490-4
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
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