Solid-state qubits integrated with superconducting through-silicon vias

Yost, D. R. W.; Schwartz, M. E.; Mallek, J.; Rosenberg, D.; Stull, C.; Yoder, J. L.; Calusine, G.; Cook, M.; Das, R.; Day, A. L.; Golden, E. B.; Kim, D. K.; Melville, A.; Niedzielski, B. M.; Woods, W.; Kerman, A. J.; Oliver, W. D.

doi:10.1038/s41534-020-00289-8

Solid-state qubits integrated with superconducting through-silicon vias

As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may require, access via the third dimension to alleviate interconnect crowding. Through-silicon vias (TSVs) represent a pro…