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Hybrid integrated quantum photonic circuits
Open accessAbstract
Recent developments in chip-based photonic quantum circuits has radically impacted quantum information processing. However, it is challenging for monolithic photonic platforms to meet the stringent demands of most quantum applications. Hybrid platforms combining different photonic technologies in a single functional unit have great potential to overcome the limitations of monolithic photonic circuits. Our review summarizes the progress of hybrid quantum photonics integration, discusses important design considerations including optical connectivity and operation conditions, then highlights several successful realizations of key physical resources for building a quantum-teleporter. We conclude by discussing the roadmap for realizing future advanced large-scale hybrid devices, beyond the solid state platform, which hold great potential for quantum information applications.
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“In the last decade, remarkable advances in quantum photonic integration and a dramatic reduction in optical losses [2] have enabled benchtop experiments to be scaled down to prototype chips with improvements in efficiency, robustness, and key performance metrics [3,4].”
From 2022 Roadmap on integrated quantum photonics (2022) · cites this paper as [4]
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“Along with combining the QFC element(s) with linear components such as filters and couplers, integration with pump lasers and other quantum photonic elements, such as SPSs and solid-state spins, is feasible, particularly in the context of hybrid photonic platforms that combine the advantageous characteristics of dissimilar materials [4].”
From 2022 Roadmap on integrated quantum photonics (2022) · cites this paper as [4]
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“Recent advances in the fabrication of quantum photonic integrated circuits (QPICs) have enabled the functionality of bench-top nonlinear sources to be scaled down to a single chip, with a dramatic improvement in the efficiency and stability [12][13][14][15].”
From Ultrabright Entangled-Photon-Pair Generation from anAlGaAs-On-Insulator Microring Resonator (2021) · cites this paper as [13]
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“It is worth noting that hybrid integration techniques, in which III-V and silicon-based devices are produced in separate runs and then brought together through methods such as pick-and-place or transfer-printing, have also successfully produced silicon photonic devices with on-chip QD SPSs [4].”
From 2022 Roadmap on integrated quantum photonics (2022) · cites this paper as [4]
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Metadata
- Authors
- Elshaari, A. W., Pernice, W., Srinivasan, K., Benson, O., & Zwiller, V.
- Affiliations
- KTH Royal Institute of Technology (SE)
- University of Münster (DE)
- National Institute of Standards and Technology (US)
- Humboldt-Universität zu Berlin (DE)
- Corresponding author
- Elshaari, Ali W.
- Venue
- Nature Photonics
- Published
- 2020-04-13
- Volume
- 14
- Issue
- 5
- Pages
- 285-298
- ISSN
- 1749-4885 (ISSN-L)
- 1749-4893
- PMC
- PMC8607459
- OpenAlex
- W3015390178
- Cited by
- 805
- References
- 110
- Citations by year
- 2026: 91 · 2025: 148 · 2024: 147 · 2023: 144 · 2022: 129 · 2021: 106 · 2020: 40
- FWCI
- 41.25
- Type
- journal article
- Language
- en
- Update notices
- correction (2020-04-17)
- Open access
- green
- www.ncbi.nlm.nih.gov
- Locations
- Nature Photonics (publishedVersion)
- PubMed (publishedVersion)
- PubMed Central (acceptedVersion)
- Topics
- Physical Sciences › Physics and Astronomy › Atomic and Molecular Physics, and Optics › Quantum Information and Cryptography
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Photonic and Optical Devices
- Physical Sciences › Computer Science › Artificial Intelligence › Quantum Computing Algorithms and Architecture
- Keywords
- quantum teleportation, quantum repeaters, quantum simulators, monolithic photonic integration, quantum information processing
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