Three-dimensional printing of soft hydrogel electronics

Abstract

Electronics based on hydrogels can have inherent similarities to biological tissue and are of potential use in biomedical applications. Ideally, such hydrogel electronics should offer customizable three-dimensional circuits, but making complex three-dimensional circuits encapsulated within a hydrogel matrix is challenging with existing materials and manufacturing methods. Here we report the three-dimensional printing of hydrogel electronics using a curable hydrogel-based supporting matrix and a stretchable silver–hydrogel ink. The supporting matrix has a yield stress fluid behaviour, so the shear force generated by a moving printer nozzle creates a temporary fluid-like state, allowing the accurate placement in the matrix of silver–hydrogel ink circuits and electronic components. After printing, the entire matrix and embedded circuitry can be cured at 60 °C to form soft (Young’s modulus of less than 5 kPa) and stretchable (elongation of around 18) monolithic hydrogel electronics, whereas the conductive ink exhibits a high conductivity of around 1.4 × 10^3 S cm^−1. We use our three-dimensional printing approach to create strain sensors, inductors and biological electrodes. Using a conductive silver–hydrogel ink, three-dimensional circuits can be printed into a supporting hydrogel matrix that has a temporary, fluid-like state before curing to make fully encapsulated hydrogel electronics.