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Thin-film encapsulation of organic light-emitting devices

Ghosh, A. P., Gerenser, L. J., Jarman, C. M., Fornalik, J. E.·2005·Applied Physics Letters

Abstract

Organic light-emitting devices (OLED) are extremely sensitive to moisture and oxygen. Without high-performance hermetic seals, the life of these devices is limited. Bottom-emitter OLEDs are commonly sealed using epoxy and cover glass with large amounts of desiccant. In top-emitter OLEDs the light passes through the cover glass on which the desiccant typically resides. Thus, transparent thin-film encapsulation without any desiccant is most desirable. This paper reports the results of a robust thin-film encapsulation method that utilizes a layer of aluminum oxide deposited by atomic layer deposition (ALD) process as the primary moisture barrier. More than 1000 h in 85 °C and 85% RH testing has been observed without significant device degradation caused by moisture. Data corroborating this method's superiority over other physical deposition methods for OLED encapsulation are also presented.

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Metadata

Authors
Ghosh, A. P., Gerenser, L. J., Jarman, C. M., & Fornalik, J. E.
Venue
Applied Physics Letters
Published
2005-05-24
Volume
86
Issue
22
ISSN
  • 0003-6951 (ISSN-L)
  • 1077-3118
OpenAlex
W4231796723
Cited by
263
References
0
FWCI
6.99
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Thin-film encapsulation of organic light-emitting devices. https://app.cochat.ai/papers/10.1063/1.1929867
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Ghosh, A. P., Gerenser, L. J., Jarman, C. M., & Fornalik, J. E. (2005). Thin-film encapsulation of organic light-emitting devices. Applied Physics Letters. https://doi.org/10.1063/1.1929867

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

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