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Cited by 217

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Thick film laser induced forward transfer for deposition of thermally and mechanically sensitive materials

Kattamis, Nicholas T., Purnick, Priscilla E., Weiss, Ron, Arnold, Craig B.·2007·Applied Physics Letters

Abstract

Laser forward transfer processes incorporating thin absorbing films can be used to deposit robust organic and inorganic materials but the deposition of more delicate materials has remained elusive due to contamination and stress induced during the transfer process. Here, we present the approach to high resolution patterning of sensitive materials by incorporating a thick film polymer absorbing layer that is able to dissipate shock energy through mechanical deformation. Multiple mechanisms for transfer as a function of incident laser energy are observed and we show viable and contamination-free deposition of living mammalian embryonic stem cells.

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Metadata

Authors
Kattamis, N. T., Purnick, P. E., Weiss, R., & Arnold, C. B.
Venue
Applied Physics Letters
Published
2007-10-22
Volume
91
Issue
17
ISSN
  • 0003-6951 (ISSN-L)
  • 1077-3118
OpenAlex
W2020448153
Cited by
217
References
0
FWCI
13.45
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Thick film laser induced forward transfer for deposition of thermally and mechanically sensitive materials. https://app.cochat.ai/papers/10.1063/1.2799877
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Kattamis, N. T., Purnick, P. E., Weiss, R., & Arnold, C. B. (2007). Thick film laser induced forward transfer for deposition of thermally and mechanically sensitive materials. Applied Physics Letters. https://doi.org/10.1063/1.2799877

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.