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Thick film laser induced forward transfer for deposition of thermally and mechanically sensitive materials
Abstract
Laser forward transfer processes incorporating thin absorbing films can be used to deposit robust organic and inorganic materials but the deposition of more delicate materials has remained elusive due to contamination and stress induced during the transfer process. Here, we present the approach to high resolution patterning of sensitive materials by incorporating a thick film polymer absorbing layer that is able to dissipate shock energy through mechanical deformation. Multiple mechanisms for transfer as a function of incident laser energy are observed and we show viable and contamination-free deposition of living mammalian embryonic stem cells.
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Cited by
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Laser-based direct-write techniques for cell printing
Schiele, N. R., Corr, D. T., Huang, Y., Raof, N. A., Xie, Y., & Chrisey, D. B. (2010) · Biofabrication · doi:10.1088/1758-5082/2/3/032001 · Cited by 334
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Metadata
- Authors
- Kattamis, N. T., Purnick, P. E., Weiss, R., & Arnold, C. B.
- Venue
- Applied Physics Letters
- Publisher
- AIP Publishing
- Published
- 2007-10-22
- Volume
- 91
- Issue
- 17
- ISSN
- 0003-6951 (ISSN-L)
- 1077-3118
- OpenAlex
- W2020448153
- Cited by
- 217
- References
- 0
- FWCI
- 13.45
- Type
- journal article
- Language
- en
- Open access
- closed
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- Kattamis, N. T., Purnick, P. E., Weiss, R., & Arnold, C. B. (2007). Thick film laser induced forward transfer for deposition of thermally and mechanically sensitive materials. Applied Physics Letters. https://doi.org/10.1063/1.2799877
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