The DOI matches its Crossref record; 8 of the 8 references it cites were found in a registry or an index.
Low temperature sintering of Ag nanoparticles for flexible electronics packaging
Abstract
We achieve robust bonding of Cu wires to Cu pads on polyimide with silver nanopaste cured at 373 K. The paste is prepared by simply condensing Ag nanoparticle (NP) solution via centrifuging. The bonding is formed by solid state sintering of Ag NPs through neck growth and direct metallic bonding between clean Ag–Cu interfaces. Both experiment and Monte Carlo simulation confirm that the melting point of joint clusters increases during sintering. This creates improved bonds for use at an elevated operating temperature using Ag NPs.
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Cites
Tight-binding potentials for transition metals and alloys
Cleri, F., & Rosato, V. (1993) · Physical Review B · doi:10.1103/physrevb.48.22 · Cited by 1,940
Ko, S. H., Pan, H., Grigoropoulos, C. P., Luscombe, C. K., Fréchet, J. M. J., & Poulikakos, D. (2007) · Nanotechnology · doi:10.1088/0957-4484/18/34/345202 · Cited by 770
Size-Dependent Melting of Silica-Encapsulated Gold Nanoparticles
Dick, K., Dhanasekaran, T., Zhang, Z., & Meisel, D. (2002) · Journal of the American Chemical Society · doi:10.1021/ja017281a · Cited by 549
Cold welding of ultrathin gold nanowires
Lu, Y., Huang, J. Y., Wang, C., Sun, S., & Lou, J. (2010) · Nature Nanotechnology · doi:10.1038/nnano.2010.4 · Cited by 523
Metal–metal bonding process using Ag metallo-organic nanoparticles
Ide, E., Angata, S., Hirose, A., & Kobayashi, K. F. (2005) · Acta Materialia · doi:10.1016/j.actamat.2005.01.047 · Cited by 500
Study of Bonding Technology Using Silver Nanoparticles
Morita, T., Ide, E., Yasuda, Y., et al. (2008) · Japanese Journal of Applied Physics · doi:10.1143/jjap.47.6615 · Cited by 110
Tselesh, A. S. (2007) · Thin Solid Films · doi:10.1016/j.tsf.2007.11.118 · Cited by 104
Soldering to a single atomic layer
Girit, Ç., & Zettl, A. K. (2007) · Applied Physics Letters · doi:10.1063/1.2812571 · Cited by 73
Cited by
Messina, G. C., Wagener, P., Streubel, R., De Giacomo, A., Santagata, A., Compagnini, G., & Barcikowski, S. (2013) · Phys. Chem. Chem. Phys. · doi:10.1039/c2cp42626a · Cited by 68
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Metadata
- Authors
- Hu, A., Guo, J. Y., Alarifi, H., Patane, G., Zhou, Y., Compagnini, G., & Xu, C. X.
- Venue
- Applied Physics Letters
- Publisher
- AIP Publishing
- Published
- 2010-10-11
- Volume
- 97
- Issue
- 15
- ISSN
- 0003-6951 (ISSN-L)
- 1077-3118
- OpenAlex
- W2092063262
- Cited by
- 309
- References
- 8
- FWCI
- 15.70
- Type
- journal article
- Language
- en
- Open access
- closed
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- Hu, A., Guo, J. Y., Alarifi, H., Patane, G., Zhou, Y., Compagnini, G., & Xu, C. X. (2010). Low temperature sintering of Ag nanoparticles for flexible electronics packaging. Applied Physics Letters. https://doi.org/10.1063/1.3502604
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