The DOI matches its Crossref record.
Metal–metal bonding process using Ag metallo-organic nanoparticles
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Citations
Cited by
Low temperature sintering of Ag nanoparticles for flexible electronics packaging
Hu, A., Guo, J. Y., Alarifi, H., Patane, G., Zhou, Y., Compagnini, G., & Xu, C. X. (2010) · Applied Physics Letters · doi:10.1063/1.3502604 · Cited by 309
Tran, T. S., Dutta, N. K., & Choudhury, N. R. (2018) · Advances in Colloid and Interface Science · doi:10.1016/j.cis.2018.09.003 · Cited by 298
Pressureless Sintered-Silver Die-Attach at 180 °C for Power Electronics Packaging
Wang, M., Mei, Y.-H., Jin, J., Chen, S., Li, X., & Lu, G.-Q. (2021) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2021.3074853 · Cited by 69
Review of Die-Attach Materials for SiC High-Temperature Packaging
Hou, F., Sun, Z., Su, M., Fan, J., You, X., Li, J., Wang, Q., Cao, L., & Zhang, G. (2024) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2024.3417529 · Cited by 52
Metadata
- Authors
- Ide, E., Angata, S., Hirose, A., & Kobayashi, K. F.
- Venue
- Acta Materialia
- Publisher
- Elsevier BV
- Published
- 2005-05
- Volume
- 53
- Issue
- 8
- Pages
- 2385-2393
- ISSN
- 1359-6454 (ISSN-L)
- OpenAlex
- W2069670770
- Cited by
- 500
- References
- 0
- FWCI
- 7.31
- Type
- journal article
- Language
- en
- Open access
- closed
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
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How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Metal–metal bonding process using Ag metallo-organic nanoparticles. https://app.cochat.ai/papers/10.1016/j.actamat.2005.01.047
- The paper
- Ide, E., Angata, S., Hirose, A., & Kobayashi, K. F. (2005). Metal–metal bonding process using Ag metallo-organic nanoparticles. Acta Materialia. https://doi.org/10.1016/j.actamat.2005.01.047
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
