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Thermal conductivity anisotropy and grain structure in Ge2Sb2Te5 films
Abstract
Although lateral thermal conduction in Ge2Sb2Te5 (GST) films can influence the performance of phase change memory (PCM), there are no data available for the in-plane thermal conductivity. This work measures both the in-plane and the out-of-plane thermal conductivities for the amorphous, face-centered-cubic, and hexagonal-close-packed phases of GST using two independent techniques. For crystalline GST, we report anisotropy favoring out-of-plane conduction by up to 54%, which varies with annealing time. Scaling arguments indicate that the anisotropy may be due to the thermal resistance of amorphous regions near grain boundaries. This explanation is consistent with transmission electron microscopy images showing columnar grains and amorphous phase at grain boundaries.
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To increase measurement accuracy, it is desirable that the product of thin film in-plane thermal conductivity and film thickness be equal to or greater than the corresponding product of the substrate.
“In order to increase measurement accuracy, Volklein et al. [74] concluded that it is desirable to have the product of the thin film in-plane thermal conductivity 𝑘 𝑓,∥ and film thickness 𝑑 𝑓 equal to or greater than the corresponding product of the substrate (i.e.𝑘 𝑓,∥ 𝑑 𝑓 ≥ 𝑘 𝑆 𝑑 𝑆 ).”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [74]
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Cites
Thermal conductivity measurement from 30 to 750 K: the 3ω method
Cahill, D. G. (1990) · Review of Scientific Instruments · doi:10.1063/1.1141498 · Cited by 1,928
1 ω , 2 ω , and 3ω methods for measurements of thermal properties
Dames, C., & Chen, G. (2005) · Review of Scientific Instruments · doi:10.1063/1.2130718 · Cited by 275
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Zhao, D., Qian, X., Gu, X., Jajja, S. A., & Yang, R. (2016) · Journal of Electronic Packaging · doi:10.1115/1.4034605 · Cited by 559
Metadata
- Authors
- Lee, J., Li, Z., Reifenberg, J. P., Lee, S., Sinclair, R., Asheghi, M., & Goodson, K. E.
- Affiliations
- Department of Mechanical Engineering, Stanford University 1 , Stanford, California 94305, USA
- Stanford University 2 Department of Material Science Engineering, , Stanford, California 94305, USA
- Venue
- Journal of Applied Physics
- Publisher
- AIP Publishing
- Published
- 2011-04-15
- Volume
- 109
- Issue
- 8
- ISSN
- 0021-8979
- 1089-7550
- Cited by
- 85
- References
- 2
- Language
- en
- Funders
- National Science Foundation (CBET-0853350)
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