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Cited by 559Thermal properties of materialsHeat Transfer and Numerical MethodsThermography and Photoacoustic Techniques

The DOI matches its Crossref record; 133 of the 133 references it cites were found in a registry or an index; 3 of the 106 sources its claims cite were checked for support.

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Open access
Zhao, Dongliang, Qian, Xin, Gu, Xiaokun, Jajja, Saad Ayub, Yang, Ronggui·2016·Journal of Electronic Packaging
DOI 10.1115/1.4034605
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Abstract

Thermal conductivity and interfacial thermal conductance play crucial roles in the design of engineering systems where temperature and thermal stress are of concerns. To date, a variety of measurement techniques are available for both bulk and thin film solid-state materials with a broad temperature range. For thermal characterization of bulk material, the steady-state method, transient hot-wire method, laser flash diffusivity method, and transient plane source (TPS) method are most used. For thin film measurement, the 3ω method and the transient thermoreflectance technique including both time-domain and frequency-domain analysis are widely employed. This work reviews several most commonly used measurement techniques. In general, it is a very challenging task to determine thermal conductivity and interfacial thermal conductance with less than 5% error. Selecting a specific measurement technique to characterize thermal properties needs to be based on: (1) knowledge on the sample whose thermophysical properties are to be determined, including the sample geometry and size, and the material preparation method; (2) understanding of fundamentals and procedures of the testing technique, for example, some techniques are limited to samples with specific geometries and some are limited to a specific range of thermophysical properties; and (3) understanding of the potential error sources which might affect the final results, for example, the convection and radiation heat losses.

Overview

AI snapshot

Written from the paper’s full text.

TL;DR

This review surveys commonly used techniques for measuring thermal conductivity and interfacial thermal conductance of bulk and thin-film solid-state materials. It compares steady-state and transient methods, their sample requirements, data-reduction models, and error sources, noting that determining these properties with less than 5% error is generally very challenging.

Key findings

  • For bulk materials, the most-used techniques reviewed are steady-state methods (absolute, comparative, radial heat flow, parallel thermal conductance), transient hot-wire, laser flash diffusivity, and transient plane source (TPS); for thin films, the 3ω method and transient thermoreflectance in time-domain (TDTR) and frequency-domain (FDTR) are widely employed.
  • Reported performance numbers include: hot-wire uncertainties below 1% for gases, liquids, and solids and below 2% for nanofluids; laser flash uncertainty less than 3% over -120 °C to 2800 °C and for samples 5–12 mm in diameter; pulsed power uncertainty less than 3% over 1.9–390 K and capable of measuring 0.004 W/m·K for ZrW2O8 at 2 K; TPS for 0.005–500 W/m·K from cryogenic temperatures to 500 K; and 3ω radiation error less than 2% even at 1000 K.
  • Thermal conductivity of solids spans about 0.015 W/m·K for aerogels to about 2000 W/m·K for diamond and about 3000 W/m·K for single-layer graphene at room temperature.
  • The paper emphasizes that technique selection depends on sample geometry/size and preparation, the fundamentals and limits of the testing method, and potential error sources such as convection and radiation heat losses.

Methods

  • Design: a review article, not a primary experimental study; it describes principles, schematics, governing equations, and data-reduction approaches for bulk and thin-film thermal characterization techniques.
  • Data or sample: the paper draws on published literature and standards (e.g., ASTM, ISO, EN) rather than reporting a new sample set or original measurements.
  • Main analysis: qualitative and analytical comparison of steady-state and transient methods, including equations for Fourier’s law, hot-wire, TPS, laser flash, 3ω, and thermoreflectance models, plus discussion of measurement uncertainty and sensitivity.

Limitations

  • The paper states that determining thermal conductivity and interfacial thermal conductance with less than 5% error is very challenging, and that parasitic heat losses, sample geometry, contact resistance, and other error sources can affect results.
  • Technique-specific limitations stated include: absolute steady-state methods require relatively large samples and long waiting times; TPS requires planar sample sides and suffers from contact resistance, sensor thermal inertia, and electrical resistance changes; laser flash requires separate density and heat capacity measurements and can suffer from sample-holder heating; 3ω requires microfabrication and an insulating layer for electrically conducting or semiconducting samples; thermoreflectance requires a metal transducer and model fitting with sensitivity limitations.
  • Evident from the text: the review covers selected commonly used techniques rather than all possible methods, and several quantitative uncertainty values are cited from prior literature rather than newly validated in this work.

Model-written summary. Check it against the paper before relying on it.

Integrity signals

Registry

Crossref · 10.1115/1.4034605

Cites

133 of 133 references verified0 citation errors · 0 not checkable

Statistics

Nothing to recompute.

Verification

Claims the paper makes

3 of 106 cited sources checked · 2 supported · 0 flagged · accuracy not yet measured

  • Premisecitation

    The 3ω voltage signal has information about thermal transport within the sample.

    “This change in voltage at 3ω frequency (i.e. the third term in Eq. ( 23)) has the information about thermal transport within the sample [82].”
    Quote in the paperSubstantial claim1 of 1 sources checked
    • cites [82] 2003, Nanoscale Thermal Transport, J. Appl. Phys. source

      The Multilayers and superlattices section (page unavailable) says the 3ω method measures thermal conductivity in thin films, supporting the claim that the method yields information about sample thermal transport. Our copy does not explain that this information is carried specifically by a voltage signal at 3ω. (LLM, conf=0.76)

      Experimental — accuracy not yet measured
  • Findingcitation

    The TPS method was reported to be capable of measuring materials with thermal conductivity ranging from 0.005 to 500 W/m·K in the temperature range from cryogenic temperatures to 500 K, including liquids, aerogels and solids.

    “The TPS method was reported to be capable for measuring materials with thermal conductivity ranging from 0.005 to 500 W/m • K in the temperature range from cryogenic temperatures to 500 K, including liquids, aerogels and solids [59][60][61][62].”
    Quote in the paperNot a substantial claim0 of 3 sources checked
    • cites [59] 1991, Transient Plane Source Techniques for Thermal Conductivity and Thermal Diffusivity Measurements of Solid Materials, Rev. Sci. Instrum. source
    • cites [60] 1994, Thermal Conductivity, Thermal Diffusivity, and Specific Heat of Thin Samples From Transient Measurements With Hot Disk Sensors, Rev. Sci. Instrum. source
    • cites [62] 2014, Improving the Accuracy of the Transient Plane Source Method by Correcting Probe Heat Capacity and Resistance Influences, Meas. Sci. Technol. source
    • The authors state this as an assumption: In the TPS method, the metal disk can be considered in contact with infinite size samples throughout the transient signal recording process because the time period is generally only a few seconds.
  • Findingcitation

    The pulsed power technique is capable of measuring a wide temperature range from 1.9 to 390 K.

    “This technique is capable of measuring a wide temperature range from 1.9 to 390 K as reported in literature [42][43][44]”
    Quote in the paperNot a substantial claim0 of 3 sources checked
    • cites [42] 2012, Low-Temperature Investigations of the Open-Framework Material HfMgMo3O12, Solid State Commun. source
    • cites [43] 2005, Unusual Thermal Conductivity of the Negative Thermal Expansion Material, ZrW2O8, Solid State Commun. source
    • cites [44] 2012, Characterization of Thermal Performance of a Solid–Solid Phase Change Material, Di-n-Hexylammonium Bromide, for Potential Integration in Building Materials, Thermochim. Acta source
    • The authors state this as an assumption: In the pulsed power technique, using C(Tc), R(Tc) and K(Tc) in place of C(Th), R(Th) and K((Th+Tc)/2) is valid because the temperature difference between Tc and Th is very small.
    • The authors state this as an assumption: In the pulsed power technique, Tc is considered constant because it drifts very slowly compared to the periodic current.
  • Premisereasoning

    In the TPS method, thermal properties of the testing samples can be determined by monitoring the temperature increase of the metal disk for a short time period because the temperature increase is highly dependent on the two testing samples attached to it.

    “Since the temperature increase of the metal disk is highly dependent on the two testing samples attached to it, thermal properties of the testing samples can be determined by monitoring the temperature increase for a short time period.”
    Quote in the paperNot a substantial claim
    • The authors state this as an assumption: In the TPS method, the metal disk can be considered in contact with infinite size samples throughout the transient signal recording process because the time period is generally only a few seconds.
  • Premisereasoning

    Heat conduction through thermocouple wires is another concern in the absolute technique.

    “Besides the convection and radiation heat losses, another concern is that the heat conduction through thermocouple wires.”
    Quote in the paperNot a substantial claim
  • It may state two separate claims as one. 28
  • Probably not a substantial claim. 58
  • The quote only partly states this claim. 1

  • It may state two separate claims as one.

    Premisecitation

    The technique has recently been further developed for measuring anisotropic thermal conductivity of thin films and probing spectral phonon transport.

    “This technique has recently been further developed over the last few years for measuring anisotropic thermal conductivity of thin films [97][98][99] and probing spectral phonon transport [100-103].”
    Quote in the paperNot a substantial claim2 of 7 sources checked
    • cites [97] 2010, Characterization of Thin Metal Films Via Frequency-Domain Thermoreflectance, J. Appl. Phys. source
    • cites [98] 2008, Pulse Accumulation, Radial Heat Conduction, and Anisotropic Thermal Conductivity in Pump-Probe Transient Thermoreflectance, Rev. Sci. Instrum. source
    • cites [99] 2010, Quasi-Ballistic Thermal Transport From Nanoscale Interfaces Observed Using Ultrafast Coherent Soft X-Ray Beams, Nat. Mater. source
    • cites [100] 2015, A New Regime of Nanoscale Thermal Transport: Collective Diffusion Increases Dissipation Efficiency, Proc. Natl. Acad. Sci. source
    • cites [101] 2014, Anisotropic Failure of Fourier Theory in Time-Domain Thermoreflectance Experiments, Nat. Commun. source
    • cites [102] 2015, Spectral Mapping of Thermal Conductivity Through Nanoscale Ballistic Transport, Nat. Nanotechnol. source
    • cites [103] 1999, Thermal-Conductivity Measurements of GaAs/AlAs Superlattices Using a Picosecond Optical Pump-and-Probe Technique, Phys. Rev. B source

  • It may state two separate claims as one.

    Findingcitation

    When W is equal to 0.5, η is equal to 1.38, and the thermal diffusivity α is calculated by Eq. (18).

    “When 𝑊 is equal to 0.5, which means the rear-side temperature reaches to one half of its maximum temperature, 𝜂 is equal to 1.38, and so the thermal diffusivity 𝛼 is calculated by [66]:”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [66] 1961, Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity, J. Appl. Phys. source
    • The authors state this as an assumption: In the laser flash method, heat conduction is assumed to be one-dimensional, with no lateral heat loss.

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Findingcitation

    The pulsed power technique can measure an ultralow thermal conductivity as low as 0.004 W/m·K for ZrW2O8 at temperature 2 K.

    “and an ultralow thermal conductivity as low as 0.004 W/m·K for ZrW2O8 at temperature 2 K [43].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [43] 2005, Unusual Thermal Conductivity of the Negative Thermal Expansion Material, ZrW2O8, Solid State Commun. source
    • The authors state this as an assumption: In the pulsed power technique, using C(Tc), R(Tc) and K(Tc) in place of C(Th), R(Th) and K((Th+Tc)/2) is valid because the temperature difference between Tc and Th is very small.
    • The authors state this as an assumption: In the pulsed power technique, Tc is considered constant because it drifts very slowly compared to the periodic current.

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Findingcitation

    The measurement uncertainty reported by Maldonado for the pulsed power technique is less than 3%.

    “The measurement uncertainty reported by Maldonado is less than 3% [38].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [38] 1992, Pulse Method for Simultaneous Measurement of Electric Thermopower and Heat Conductivity at Low Temperatures, Cryogenics source
    • The authors state this as an assumption: In the pulsed power technique, using C(Tc), R(Tc) and K(Tc) in place of C(Th), R(Th) and K((Th+Tc)/2) is valid because the temperature difference between Tc and Th is very small.
    • The authors state this as an assumption: In the pulsed power technique, Tc is considered constant because it drifts very slowly compared to the periodic current.

  • It may state two separate claims as one.

    Findingcitation

    If applied properly, the hot-wire method can achieve uncertainties below 1% for gases, liquids, and solids, and below 2% for nanofluids.

    “If applied properly, it can achieve uncertainties below 1% for gases, liquids, and solids, and below 2% for nanofluids [51].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [51] 2010, Historical Evolution of the Transient Hot-Wire Technique, Int. J. Thermophys. source

  • It may state two separate claims as one.

    Findingown data

    A clear phase difference is observed between pulsed FDTR and CW-based FDTR, so the correct solution must be adopted when processing signals from different FDTR systems.

    “A clear phase difference is observed between the pulsed FDTR and the CW-based FDTR and attentions must be paid to adopt the correct solution when processing signals from different FDTR systems.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Study design and conductcitation

    In the TPS method, the temperature increase at the sensor surface (e.g. 1-3°C) as a function of time can be measured.

    “Temperature increase at the sensor surface 𝛥𝑇 (e.g.1-3°C [56]) as a function of time can be measured.”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [56] 2013, Porous Mullite Ceramics With Low Thermal Conductivity Prepared by Foaming and Starch Consolidation, J. Porous Mater. source
    • The authors state this as an assumption: In the TPS method, the metal disk can be considered in contact with infinite size samples throughout the transient signal recording process because the time period is generally only a few seconds.

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. The paper may give no reason why it holds.

    Premisenone given

    Contact thermal resistance is a major source of error for temperature measurement.

    “Contact thermal resistance is a major source of error for temperature measurement.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.

    Premisenone given

    Thermal conductivity of thin films depends strongly on the materials preparation method and the substrate that the thin films are sitting on.

    “The thermal conductivity of thin films also depends strongly on the materials preparation (processing) method, and the substrate that thin films are sitting on.”
    Quote in the paperNot a substantial claim

  • It may state two separate claims as one.

    Premisenone given

    TPS measurement errors come from thermal contact resistance between the sensor and the testing samples, the thermal inertia of the sensor, the measured power input being influenced by the heat capacity of the electrical isolation films, and the electrical resistance change of the metallic disk sensors.

    “The TPS measurement errors come from several sources: 1) thermal contact resistance between the sensor and the testing samples, 2) the thermal inertia of the sensor, 3) the measured power input being influenced by the heat capacity of the electrical isolation films, and 4) the electrical resistance change of the metallic disk sensors.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim.

    Premisereasoning

    A variety of transient techniques have been developed to overcome drawbacks associated with steady-state methods such as parasitic heat losses, contact resistance of temperature sensors, and long waiting time.

    “In order to overcome the drawbacks associated with the steady-state methods described above such as parasitic heat losses, contact resistance of temperature sensors, and long waiting time for establishing steady-state temperature difference, a variety of transient techniques have been developed.”
    Quote in the paperSubstantial claim

  • It may state two separate claims as one.

    Premisecitation

    The laser flash method has advantages of speed (usually 1-2 s for most solids) and capability to use very small samples (5-12 mm in diameter).

    “The advantages of the method are not only its speed (usually 1-2 s for most solid), but also its capability to use very small samples, e.g.5-12 mm in diameter [53].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [53] 2011, Characterization Methodologies of Thermal Management Materials source

  • It may state two separate claims as one.

    Premisecitation

    The laser flash method can measure thermal conductivity over -120 °C to 2800 °C with reported measurement uncertainty less than 3%.

    “The laser flash method is capable of measuring thermal conductivity over a wide temperature range (-120 °C to 2800 °C [71]) with measurement uncertainty reported to be less than 3% [72].”
    Quote in the paperNot a substantial claim0 of 2 sources checked
    • cites [71] 2015, Thermal-Diffusivity and Heat-Capacity Measurements of Sandstone at High Temperatures Using Laser Flash and DSC Methods, Int. J. Thermophys. source
    • cites [72] 2011, Considerations in the Use of the Laser Flash Method for Thermal Measurements of Thermal Interface Materials, IEEE Trans. Compon. Packag. Manuf. Technol. source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    Thermal interface materials (TIMs) are usually employed to reduce thermal contact resistance.

    “In addition to bare contacts, thermal interface materials (TIMs) are usually employed to reduce thermal contact resistance.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisereasoning

    Despite its advantages, there are very few commercial hot-wire instruments.

    “Despite its advantages, there are very few commercial hot-wire instruments [52].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [52] 2015, A Novel Portable Absolute Transient Hot-Wire Instrument for the Measurement of the Thermal Conductivity of Solids, Int. J. Thermophys. source

  • It may state two separate claims as one.

    Premisenone given

    Eq. (5) for the pulsed power technique is nonlinear and difficult to be solved analytically.

    “However, Eq. ( 5) is nonlinear and difficult to be solved analytically.”
    Quote in the paperSubstantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    The pulsed power technique is a derivative of the absolute technique, with the difference that a periodic electrical heating current is used.

    “This technique is a derivative of the absolute technique in the steady-state methods, with the difference that a periodic electrical heating current 𝐼(𝑡) is used.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Study design and conductcitation

    The measurement accuracy of the TPS temperature sensor is usually ±0.01 °C.

    “Measurement accuracy of the temperature sensor (temperature resistance thermometer) is usually ± 0.01 °C [56].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [56] 2013, Porous Mullite Ceramics With Low Thermal Conductivity Prepared by Foaming and Starch Consolidation, J. Porous Mater. source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.

    Study design and conductcitation

    In the laser flash method, the rear-side infrared radiation thermometer should be fast enough to respond to the emitting signals, and the precision of temperature calibration is usually ±0.2 K.

    “The rear-side infrared radiation thermometer should be fast enough to respond to the emitting signals, and the precision of temperature calibration is usually ± 0.2 K [53].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [53] 2011, Characterization Methodologies of Thermal Management Materials source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisereasoning

    The needle-probe configuration is particularly practical where thermal conductivity is determined by a probe inserted in the test sample.

    “This configuration is particularly practical where thermal conductivity is determined by a probe inserted in the test sample.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisereasoning

    When the thickness of a thin film is smaller than the mean free path of its heat carriers, the thermal conductivity of the thin film is reduced compared to its bulk counterpart because of geometric constraints.

    “When the thickness of a thin film is smaller than the mean free path of its heat carriers, which are electrons and phonons depending on whether the material is electrically conducting or not, the thermal conductivity of thin films is reduced compared to its bulk counterparts because of the geometric constraints.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    The absolute technique usually suffers from a long waiting time, up to a few hours, to reach steady state.

    “2) the test usually suffers from a long waiting time, up to a few hours, to reach steady state.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisecitation

    The parallel thermal conductance technique was introduced by Tritt et al for small needle-like samples.

    “The parallel thermal conductance technique was introduced by Tritt et al [36] for small needle-like samples (e.g.2.0 × 0.05 × 0.1 mm 3 [36], 10 × 1 × 1 mm 3 [37]).”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [36] 2001, Description of the Parallel Thermal Conductance Technique for the Measurement of the Thermal Conductivity of Small Diameter Samples, Rev. Sci. Instrum. source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisecitation

    The laser flash method was first introduced by Parker et al.

    “The method was first introduced by Parker et al. [66].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [66] 1961, Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity, J. Appl. Phys. source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. The paper may give no reason why it holds.

    Premisenone given

    For thin films, the temperature drop across an interface can be attributed to the bonding strength and material difference.

    “For thin films, the temperature drop across an interface can be attributed to the bonding strength and material difference.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Study design and conductcitation

    In the pulsed power technique, a small temperature gradient ΔT = Th - Tc (usually ~0.3 K) is created between the heat source and the heat sink, which can be measured by a calibrated Au-Fe chromel thermocouple.

    “A small temperature gradient ∆𝑇 = 𝑇 ℎ -𝑇 𝑐 (usually ~0.3 K) is created between the heat source and the heat sink, which can be measured by a calibrated Au-Fe chromel thermocouple [38].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [38] 1992, Pulse Method for Simultaneous Measurement of Electric Thermopower and Heat Conductivity at Low Temperatures, Cryogenics source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    The comparative cut bar technique is the most widely used method for axial heat flow thermal conductivity testing.

    “This is the most widely used method for axial heat flow thermal conductivity testing.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.

    Study design and conductcitation

    In the radial heat flow method, thermocouples are used predominantly for temperature sensing, with an accuracy within ±0.1 °C.

    “Thermocouples are used predominantly for temperature sensing in radial heat flow method, with an accuracy within ±0.1 °C [34].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [34] ASTM, Standard Test Method for Steady-State Heat Transfer Properties of Pipe Insulation

      Couldn’t be matched to a paper in Crossref, so it can’t be checked.

  • It may state two separate claims as one.

    Premisecitation

    The pulsed power technique is in principle very close to Angstrom's method in terms of the heating method, but the heat sink temperature is slowly varying during the measurement.

    “This technique is in principle very close to the Angstrom's method [39,40] in terms of the heating method.But the difference is that the heat sink temperature of this technique is slowly varying during the measurement.”
    Quote in the paperNot a substantial claim0 of 2 sources checked
    • cites [39] 1991, Thermal Diffusivity Measurements by Angstrom's Method in a Fluid Environment, Int. J. Thermophys. source
    • cites [40] 1863, New Method of Determining the Conductibility of Bodies, Philos. Mag. source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisecitation

    The pulsed power technique was first introduced by Maldonado to measure both thermal conductivity and thermoelectric power.

    “Pulsed power technique was first introduced by Maldonado to measure both thermal conductivity and thermoelectric power [38].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [38] 1992, Pulse Method for Simultaneous Measurement of Electric Thermopower and Heat Conductivity at Low Temperatures, Cryogenics source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.

    Premisenone given

    The laser flash method uses optical heating as an instantaneous heating source, along with a thermographic technique for quick non-invasive temperature sensing.

    “It uses optical heating as an instantaneous heating source, along with a thermographic technique for quick non-invasive temperature sensing.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.

    Premisenone given

    The working principle of the needle-probe method is the same as the hot-wire method, but the temperature sensing is based on a zero radius system.

    “Working principle of the needle-probe method is same as the hot-wire method.But the temperature sensing is based on a zero radius system (i.e.𝑟 = 0 in Eq. ( 8)).”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.

    Premisenone given

    In the laser flash method, the testing sample is usually a solid planar-shaped material when measuring thermal conductivity, and is a multi-layer structure when characterizing thermal contact resistance.

    “The testing sample is usually a solid planar-shaped material when measuring thermal conductivity, and is a multi-layer structure when characterizing thermal contact resistance.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    The hot-wire method has also been commonly used for measuring the thermal conductivity of liquids.

    “This method has also been commonly used for measuring the thermal conductivity of liquids.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    Some techniques (e.g. 3ω, TDTR and FDTR) are very versatile and can be applied for thermal characterization of both bulk and thin film materials.

    “We note that some techniques (e.g.3ω, TDTR and FDTR) are actually very versatile and can be applied for the thermal characterization of both bulk and thin film materials although the techniques reviewed here have been divided into two categories for bulk materials and thin films just for convenience.”
    Quote in the paperNot a substantial claim

  • It may state two separate claims as one.

    Premisenone given

    The major challenge of the absolute technique is to determine the heat flow rate through the sample at the presence of parasitic heat losses and to measure temperature difference accurately.

    “The major challenge of the absolute technique is to determine the heat flow rate 𝑄 through the sample at the presence of parasitic heat losses 𝑄 loss and to measure temperature difference ∆𝑇 accurately.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.

    Premisecitation

    The one-dimensional steady-state testing method is widely used for characterizing the thermal conductivity of TIMs, as well as the thermal contact resistance.

    “The one-dimensional steady-state testing method is widely used for characterizing the thermal conductivity of TIMs, as well as the thermal contact resistance [29].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [29] ASTM, Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials

      Couldn’t be matched to a paper in Crossref, so it can’t be checked.

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    In the needle-probe method, the probe helps protect the heating wire.

    “The probe helps protect the heating wire.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    The heat flow meter method is usually used to characterize low thermal conductivity materials, such as building insulation materials.

    “This method is usually used to characterize low thermal conductivity materials, such as building insulation materials.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisecitation

    ASTM E1461 and ISO 22007-4 specify requirements of apparatus, test sample and procedure for thermal diffusivity measurement by the laser flash method.

    “ASTM E1461 [69] and ISO 22007-4 [70] specify the requirements of apparatus, test sample and procedure for thermal diffusivity measurement by the laser flash method.”
    Quote in the paperNot a substantial claim0 of 2 sources checked
    • cites [69] ASTM, Standard Test Method for Thermal Diffusivity by the Flash Method

      Couldn’t be matched to a paper in Crossref, so it can’t be checked.

    • cites [70] ISO, Plastics—Determination of Thermal Conductivity and Thermal Diffusivity—Part 4: Laser Flash Method

      Couldn’t be matched to a paper in Crossref, so it can’t be checked.

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.

    Premisecitation

    A needle-probe device can be used to measure sample thermal properties in situ, but most commonly a temperature-controlled furnace is used to produce the base temperatures for the measurements.

    “A needle-probe device can be used to measure sample thermal properties in situ, but most commonly a temperature-controlled furnace is used to produce the base temperatures for the measurements [53].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [53] 2011, Characterization Methodologies of Thermal Management Materials source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    The needle-probe method is a variation of the hot-wire method for testing isotropic and homogeneous materials.

    “The needle-probe method, also for testing isotropic and homogeneous materials, is a variation of the hot-wire method.”
    Quote in the paperNot a substantial claim

  • It may state two separate claims as one.

    Interpretationreasoning

    The laser flash method can measure thin films, but sample thickness is limited by timescales of the heating pulse and infrared detector.

    “Though laser flash method can be used to measure thin films, thickness of the measured sample is limited by the timescales associated with the heating pulse and the infrared detector.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisecitation

    In the pulsed power technique, the heating current can be either a square wave of constant-amplitude current or a sinusoid wave.

    “The heating current used can be either a square wave of constant-amplitude current or a sinusoid wave [41].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [41] 2014, Thermal, Vibrational, and Thermoelastic Properties of Y2Mo3O12 and Their Relations to Negative Thermal Expansion, Phys. Rev. B source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisecitation

    The hot-wire method is commonly used to measure low thermal conductivity materials such as soils, ice cores and refractories.

    “Hot-wire method is commonly used to measure low thermal conductivity materials such as soils [46], ice cores [47] and refractories (refractory brick, refractory fibers, plastic refractories and powdered materials [48]).”
    Quote in the paperNot a substantial claim0 of 3 sources checked
    • cites [46] 2001, A Comparison of Two Methods Used to Evaluate Thermal Conductivity for Some Soils, Int. J. Heat Mass Transfer source
    • cites [47] 1999, Apparatus for Routine Measurements of the Thermal Conductivity of Ice Cores, Ann. Glaciol. source

      Checked before — its earlier verdict is held back until a new check runs.

    • cites [48] ASTM, Standard Test Method for Thermal Conductivity of Refractories by Hot Wire (Platinum Resistance Thermometer Technique)

      Couldn’t be matched to a paper in Crossref, so it can’t be checked.

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisereasoning

    Thermal conductivity of thin films is in general anisotropic due to geometric constraints, with different in-plane and cross-plane values.

    “The thermal conductivity of thin films is in general anisotropic due to the geometric constraints, which means that the value are different in different directions (i.e.in-plane thermal conductivity 𝑘 ∥ , and cross-plane thermal conductivity 𝑘 ⊥ ).”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisecitation

    Resistance thermometers (RTDs) and infrared thermography are often employed for temperature sensing when testing small samples by using the absolute technique.

    “Resistance thermometers (i.e.RTDs) [24,25] and infrared (IR) thermography [26] are often employed for temperature sensing when testing small samples (in micron scale or even smaller) by using absolute technique.”
    Quote in the paperNot a substantial claim0 of 3 sources checked
    • cites [24] 2003, Measuring Thermal and Thermoelectric Properties of One-Dimensional Nanostructures Using a Microfabricated Device, ASME J. Heat Transfer source
    • cites [25] 2009, Direct Measurement of Thermal Conductivity of Aluminum Nanowires, Appl. Phys. Lett. source
    • cites [26] 2011, Thermal Conduction in Aligned Carbon Nanotube–Polymer Nanocomposites With High Packing Density, ACS Nano source

  • Probably not a substantial claim.

    Premisecitation

    To increase measurement accuracy, it is desirable that the product of thin film in-plane thermal conductivity and film thickness be equal to or greater than the corresponding product of the substrate.

    “In order to increase measurement accuracy, Volklein et al. [74] concluded that it is desirable to have the product of the thin film in-plane thermal conductivity 𝑘 𝑓,∥ and film thickness 𝑑 𝑓 equal to or greater than the corresponding product of the substrate (i.e.𝑘 𝑓,∥ 𝑑 𝑓 ≥ 𝑘 𝑆 𝑑 𝑆 ).”
    Quote in the paperSubstantial claim0 of 1 sources checked
    • cites [74] 2011, Thermal Conductivity Anisotropy and Grain Structure in Ge2Sb2Te5 Films, J. Appl. Phys. source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisereasoning

    The needle-probe method is conveniently applied to powder-like materials and soils.

    “Therefore, the method is conveniently applied to powder-like materials and soils.”
    Quote in the paperNot a substantial claim

  • It may state two separate claims as one.

    Premisecitation

    FDTR can be implemented using less expensive continuous wave lasers, achieving similar accuracy to TDTR for thermal conductivity of many thin-film materials.

    “FDTR system can also be implemented using the less expensive continuous wave (CW) lasers as shown in Figure 14b, which achieves similar accuracy to TDTR measurement for thermal conductivity of many thin-film materials [98,105,106,109].”
    Quote in the paperNot a substantial claim0 of 4 sources checked
    • cites [98] 2008, Pulse Accumulation, Radial Heat Conduction, and Anisotropic Thermal Conductivity in Pump-Probe Transient Thermoreflectance, Rev. Sci. Instrum. source
    • cites [105] 2011, Optical Measurement of Thermal Conductivity Using Fiber Aligned Frequency Domain Thermoreflectance, ASME J. Heat Transfer source
    • cites [106] 2013, Pump-Probe Thermoreflectance, Annu. Rev. Heat Transfer source
    • cites [109] 2014, Nonlocal Theory for Heat Transport at High Frequencies, Phys. Rev. B source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    The 3ω method has also been extensively used to measure the in-plane thermal conductivity of thin films.

    “The 3ω method has also been extensively used to measure the in-plane thermal conductivity of thin films.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.

    Premisecitation

    With the advancement of pico- and femtosecond pulsed lasers after 1980, the technique has been widely used for studying non-equilibrium electron-phonon interaction, detecting coherent phonon transport, and thermal transport across interfaces.

    “With the advancement of pico-and femtosecond pulsed laser after 1980, this technique has been widely used for studying non-equilibrium electron-phonon interaction [89,90], detecting coherent phonon transport [91][92][93] and thermal transport across interfaces [94][95][96] .”
    Quote in the paperNot a substantial claim0 of 8 sources checked
    • cites [89] 2013, Two-Channel Model for Nonequilibrium Thermal Transport in Pump-Probe Experiments, Phys. Rev. B source
    • cites [90] 1992, Coherent Phonon Detection From Ultrafast Surface Vibrations, Phys. Rev. Lett. source
    • cites [91] 2012, Coherent Phonon Heat Conduction in Superlattices, Science source
    • cites [92] 2014, Crossover From Incoherent to Coherent Phonon Scattering in Epitaxial Oxide Superlattices, Nat. Mater. source
    • cites [93] 2004, Analysis of Heat Flow in Layered Structures for Time-Domain Thermoreflectance, Rev. Sci. Instrum. source
    • cites [94] 2008, Probing the Gold Nanorod−Ligand−Solvent Interface by Plasmonic Absorption and Thermal Decay, J. Phys. Chem. C source
    • cites [95] 2006, Thermal Conductance of Hydrophilic and Hydrophobic Interfaces, Phys. Rev. Lett. source
    • cites [96] 2009, A Frequency-Domain Thermoreflectance Method for the Characterization of Thermal Properties, Rev. Sci. Instrum. source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Interpretationnone given

    Optical heating and sensing methods such as transient thermoreflectance usually require minimal sample preparation.

    “Optical heating and sensing method (e.g.transient thermoreflectance technique), on the other hand, usually requires minimal sample preparation.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisecitation

    The 3ω method is widely used to measure thermal properties of both bulk materials and thin films after it was introduced in 1990 by Cahill and coworkers.

    “The 3ω method is widely used to measure thermal properties of both bulk materials and thin films after it was first introduced in 1990 by Cahill and coworkers [78,79].”
    Quote in the paperNot a substantial claim0 of 2 sources checked
    • cites [78] 1990, Thermal Conductivity Measurement From 30 to 750 K: The 3ω Method, Rev. Sci. Instrum. source
    • cites [79] 2013, Ultralow Thermal Conductivity in Polycrystalline CdSe Thin Films With Controlled Grain Size, Nano Lett. source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    In practice, cross-plane thermal conductivity is usually measured first with a heater/sensor with much greater width that is only sensitive to cross-plane thermal conductivity.

    “In practice, 𝑘 𝑓,⊥ is usually measured first with a heater/sensor with much greater width that is only sensitive to cross-plane thermal conductivity.”
    Quote in the paperNot a substantial claim

  • It may state two separate claims as one.

    Interpretationcitation

    For electrically conducting and semiconducting materials, samples need to be electrically isolated from the metallic heater/sensor with an additional insulating layer, which introduces extra thermal resistance and reduces sensitivity and measurement accuracy.

    “For electrically conducting and semiconducting materials, samples need to be electrically isolated from the metallic heater/sensor with additional insulating layer [80,86], which introduces extra thermal resistance and inevitably reduces both sensitivity and measurement accuracy.”
    Quote in the paperNot a substantial claim0 of 2 sources checked
    • cites [80] 2006, Thermal Conductivity Measurement by the 3 Omega Method
    • cites [86] 1982, Thermal-Wave Imaging, Science source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    The transient thermoreflectance technique is a non-contact optical heating and sensing method to measure thermal conductivity, heat capacity, and interfacial thermal conductance of both bulk and thin film materials.

    “The transient thermoreflectance technique is a non-contact optical heating and sensing method to measure thermal properties (thermal conductivity, heat capacity, and interfacial thermal conductance) of both bulk and thin film materials.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Interpretationreasoning

    The challenge of the thermoreflectance technique lies in its versatile capability that multiple thermal properties including thermal conductivity, interfacial thermal conductance and heat capacity can be determined depending on the measurement regime.

    “The challenge of thermoreflectance technique lies in its versatile capability that multiple thermal properties including thermal conductivity, interfacial thermal conductance and heat capacity can be determined depending on the measurement regime.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisecitation

    Dames described the general case of thermal and electrical transfer functions framework.

    “Dames also described the general case of thermal and electrical transfer functions framework [82].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [82] 2003, Nanoscale Thermal Transport, J. Appl. Phys. source

      Checked before — its earlier verdict is held back until a new check runs.

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Interpretationnone given

    Another challenge is that the 3ω method involves microfabrication for the metallic heater/sensor.

    “Another challenge is that the 3ω method involves microfabrication for the metallic heater/sensor.”
    Quote in the paperNot a substantial claim

  • The quote only partly states this claim.

    Premisereasoning

    At the high frequency limit, when the penetration depth is so small that the temperature gradient only penetrates into a limited depth (thermally thick), the thermal response is analogous to the high frequency limit of the bulk material and is dominated by thermal effusivity sqrt(k_z C).

    “At high frequency limit, the penetration depth 𝐿 𝑝,𝑧 would be so small that temperature gradient only penetrates into a limited depth of the layer (referred to as”
    Quote in the paperSubstantial claim

  • It may state two separate claims as one.

    Premisenone given

    Unlike bulk samples whose thickness is always much longer than the cross-plane penetration depth, a thin film's thickness might be comparable to or even smaller than the cross-plane penetration depth.

    “Different from bulk samples whose thickness is always much longer than the cross-plane penetration depth, the thickness of a thin film might be comparable or even smaller than the cross-plane penetration depth 𝐿 𝑝,𝑧 .”
    Quote in the paperSubstantial claim

  • It may state two separate claims as one.

    Premisecitation

    TDTR technique is implemented extensively to study thermal transport mechanisms across interfaces, including surface chemistry effects on interfacial thermal conductance across functionalized liquid-solid and solid-solid interfaces, interfacial thermal conductance between metals and dielectrics, and interface between low dimensional materials and bulk substrates.

    “TDTR technique is therefore implemented extensively to study the thermal transport mechanisms across interfaces, including the effect of surface chemistry on interfacial thermal conductance across functionalized liquid-solid boundary[95,117,118] and solid-solid interfaces[119], interfacial thermal conductance between metals and dielectrics,[120][121][122][123][124] and interface between low dim”
    Quote in the paperNot a substantial claim0 of 9 sources checked
    • cites [95] 2006, Thermal Conductance of Hydrophilic and Hydrophobic Interfaces, Phys. Rev. Lett. source
    • cites [117] 2013, The Influence of Interface Bonding on Thermal Transport Through Solid–Liquid Interfaces, Appl. Phys. Lett. source
    • cites [118] 2012, Effects of Chemical Bonding on Heat Transport Across Interfaces, Nat. Mater. source
    • cites [119] 2006, Thermal Conductance of Interfaces Between Highly Dissimilar Materials, Phys. Rev. B source
    • cites [120] 2003, Thermal Conductance of Epitaxial Interfaces, Phys. Rev. B source
    • cites [121] 2015, Thermal Transport Through GaN–SiC Interfaces From 300 to 600 K, Appl. Phys. Lett. source
    • cites [122] 2014, Thermal Boundary Conductance Across Metal-Gallium Nitride Interfaces From 80 to 450 K, Appl. Phys. Lett. source
    • cites [123] 2016, Thermal Interface Conductance Across Metal Alloy–Dielectric Interfaces, Phys. Rev. B source
    • cites [124] 2003, Interfacial Heat Flow in Carbon Nanotube Suspensions, Nat. Mater. source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. The paper may give no reason why it holds.

    Interpretationnone given

    The most effective way to deal with radiation heat loss is using a transient heating and temperature sensing technique such as the 3ω method.

    “Nevertheless, the most effective way to deal with radiation heat loss would be using a transient heating (e.g.use alternating current) and temperature sensing technique such as the 3ω method.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisecitation

    The thermoreflectance technique was primarily developed in the 1970s and 1980s when continuous wave light sources were used to heat the sample.

    “The thermoreflectance technique was primarily developed in the 1970s and 1980s when continuous wave (CW) light sources are used to heat the sample [87,88].”
    Quote in the paperNot a substantial claim0 of 2 sources checked
    • cites [87] 1976, Theory of the Photoacoustic Effect With Solids, J. Appl. Phys. source
    • cites [88] 1983, Observation of Nonequilibrium Electron Heating in Copper, Phys. Rev. Lett. source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisereasoning

    To minimize heat loss to the ambient, the experimental measurement is usually carried out under vacuum.

    “To minimize heat loss to the ambient, the experimental measurement is usually carried out under vacuum.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.

    Premisereasoning

    A small temperature difference is usually used to minimize radiation heat loss, and coating the surface with low-emissivity material is another option.

    “Usually a small temperature difference is used to minimize the radiation heat loss while coating the surface with low-emissivity material could be another option.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    Samples are usually coated with a metal thin film, called a metallic transducer layer, whose reflectance changes with temperature rise at the laser wavelength.

    “Samples are usually coated with a metal thin film (e.g.Aluminum or Tungsten), referred to as metallic transducer layer, whose reflectance changes with the temperature rise at the laser wavelength.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    FDTR measures the thermoreflectance change as a function of the modulation frequency of the pump beam.

    “The other group of thermoreflectance technique is FDTR, where the thermoreflectance change is measured as a function of the modulation frequency of the pump beam.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    TDTR measures the thermoreflectance response as a function of the time delay between arrival of the probe and pump pulses at the sample surface.

    “The TDTR method measures the thermoreflectance response as a function of the time delay between the arrival of the probe and the pump pulses at the sample surface.”
    Quote in the paperNot a substantial claim

  • It may state two separate claims as one.

    Premisecitation

    To completely remove parasitic heat loss through the substrate, a suspended structure by removing the substrate is desirable, but it complicates microfabrication.

    “However, in order to completely remove parasitic heat loss through the substrate, a suspended structure by removing the substrate as shown in Figure 9 is desirable, which complicates microfabrication for sample preparation [75].”
    Quote in the paperNot a substantial claim0 of 1 sources checked
    • cites [75] 1990, Thermal Conductivity and Diffusivity of a Thin Film SiO2-Si3N4 Sandwich System, Thin Solid Films source

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. The paper may give no reason why it holds.

    Interpretationnone given

    In general, it is a very challenging task to determine material thermal conductivity and interface contact resistance with less than 5% error.

    “In general, it is a very challenging task to determine material thermal conductivity and interface contact resistance with less than 5% error.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it. The paper may give no reason why it holds.

    Interpretationnone given

    For thermal characterization of bulk material, the steady-state absolute method, comparative technique, laser flash diffusivity method, and transient plane source (TPS) method are most used.

    “For thermal characterization of bulk material, the steady-state absolute method, comparative technique, laser flash diffusivity method, and transient plane source (TPS) method are most used.”
    Quote in the paperNot a substantial claim

  • It may state two separate claims as one.

    Premisereasoning

    If a very low modulation frequency and small spot size is used to conduct TDTR measurement, the radial heat transfer dominates the thermal dissipation, and the signal is determined by the geometric average thermal conductivity √(k_r k_z).

    “If a very low modulation frequency and small spot size is used to conduct TDTR measurement, the radial heat transfer dominates the thermal dissipation (Figure20a), and the signal is determined by the geometric average thermal conductivity √𝑘 𝑟 𝑘 𝑧 .”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Premisenone given

    The steady-state methods for bulk materials include absolute technique, comparative technique and radial heat flow method.

    “Note that the steady-state methods for bulk materials including absolute technique, comparative technique and radial heat flow method.”
    Quote in the paperNot a substantial claim

  • Probably not a substantial claim. The paper’s conclusions may not depend on it.

    Interpretationnone given

    For thin film measurement, the 3ω method and transient thermoreflectance technique are employed widely.

    “For thin film measurement, the 3ω method and transient thermoreflectance technique are employed widely.”
    Quote in the paperNot a substantial claim

  • It may state two separate claims as one.

    Interpretationnone given

    The absolute technique and comparative technique measure large-size sample but need longest time for data acquisition, while transient thermoreflectance technique is capable of measuring thinnest film sample in a quickest way.

    “The absolute technique and comparative technique measure large-size sample but need longest time for data acquisition, while transient thermoreflectance technique is capable of measuring thinnest film sample in a quickest way.”
    • Also stated in: § Additional information · plain
      “The state-state methods for bulk materials measure large-size sample but need longest time for data acquisition, while transient thermoreflectance technique (TDTR and FDTR) is capable of measuring thinnest film sample in a quickest way.”
    Quote in the paperNot a substantial claim
77 of 77

  • The authors state this as an assumption.

    In the absolute technique for thermal contact resistance, the temperature distribution on each side of the mating samples is linear.

    “Temperatures at both interfaces (i.e.𝑇 ℎ and 𝑇 𝑐 , denoted by hollow circles) can be deduced assuming the temperature distribution on each side is linear.”

  • The authors state this as an assumption.

    In the pulsed power technique, using C(Tc), R(Tc) and K(Tc) in place of C(Th), R(Th) and K((Th+Tc)/2) is valid because the temperature difference between Tc and Th is very small.

    “Therefore, 𝐶(𝑇 𝑐 ) , 𝑅(𝑇 𝑐 ) and 𝐾(𝑇 𝑐 ) are usually used in Eq. ( 5) to replace 𝐶(𝑇 ℎ ) , 𝑅(𝑇 ℎ ) and 𝐾((𝑇 ℎ + 𝑇 𝑐 )/2) to linearize the equation.This assumption holds because temperature difference between 𝑇 𝑐 and 𝑇 ℎ (i.e.∆𝑇) is very small (Figure 4b).”

  • The authors state this as an assumption.

    In the pulsed power technique, Tc is considered constant because it drifts very slowly compared to the periodic current.

    “Also, 𝑇 𝑐 is considered to be constant since it is drifted very slowly compared to the periodic current.”

  • The authors state this as an assumption.

    In the TPS method, the metal disk can be considered in contact with infinite size samples throughout the transient signal recording process because the time period is generally only a few seconds.

    “This time period is generally only a few seconds so that the metal disk can be considered in contact with infinite size samples throughout the transient signal recording process.”

  • The authors state this as an assumption.

    In the laser flash method, heat conduction is assumed to be one-dimensional, with no lateral heat loss.

    “Heat conduction is assumed to be one-dimensional (i.e.no lateral heat loss).”

  • The authors state this as an assumption.

    The temperature at the top of the film is the same as the average heater temperature.

    “The temperature at the top of the film 𝑇 𝑓,1 is generally assumed to be the same as the average heater temperature 𝑇 ℎ .”

  • The authors state this as an assumption.

    The temperature at the upper side of the film can be taken to be equal to the heater/sensor temperature because contact resistances are very small.

    “The temperature at the upper side of the film is usually taken to be equal to the heater/sensor temperature because the contact resistances are typically very small, 10 -8 -10 -7 m 2 K/W [83].”

  • The authors state this as an assumption.

    Heat conduction across the thin film is one-dimensional.

    “Assuming one-dimensional heat conduction across the thin film (Figure 10a), the thermal conductivity of the thin film can be easily determined from:”

  • The authors state this as an assumption.

    The boundary condition is approximately adiabatic under experimental conditions.

    “The boundary condition is approximately adiabatic in experimental condition, hence 𝐹 𝑏 = 𝐶𝜃 𝑡 + 𝐷𝐹 𝑡 = 0”

  • The authors state this as an assumption.

    The material is isotropic when determining thermal conductivity with a small beam spot at low frequency and heat capacity with a large beam spot at high frequency.

    “If we assume the material isotropic, we can first determine thermal conductivity using a small beam spot at low frequency, and then measure heat capacity using a large beam spot at high frequency.”

  • The authors state this as an assumption.

    The in-plane thermal conductivity has cylindrical symmetry when using a small spot size to measure in-plane thermal conductivity.

    “This method of measuring in-plane thermal conductivity using a small spot size, however, assumes cylindrical symmetry of thermal conductivity in the in-plane direction [94].”

  • The authors state this as an assumption.

    The heat flow is one-dimensional with no lateral heat loss.

    “The heat flow is assumed to be one-dimensional with no lateral heat loss.”
12 of 12

Self-check

Percentages, sums and reported differences re-computed from the paper’s own numbers.

Each contradiction between two passages listed here was confirmed by an independent check.

  • Heater resistance is identified as thermal resistance

    Minor

    In the pulsed-power derivation, the heater resistance is introduced as electrical resistance, while the explanation of the resulting expression calls R thermal resistance. The R multiplied by current squared in that expression must be the electrical heater resistance described earlier.

  • Interfacial conductance and contact resistance use different heat quantities

    Minor

    The paper defines interfacial conductance using heat flux, but defines thermal contact resistance using total heat flow and says the two are inverses. The reciprocal of the stated resistance uses total heat flow, not heat flux; the definitions differ by interface area.

  • Reference [32] identifies a different source

    Minor

    The text cites [32] for the ASTM E1530 standard, but reference 32 is a work by Flynn. The ASTM E1530 entry is numbered 31 in the reference list.

  • Equation 27 is described as normalized although it gives a temperature drop

    Minor

    The text first presents Eq. (27) as the thin-film temperature drop ΔTf, then says the equation gives that drop normalized to a one-dimensional value. The displayed equation has no normalization by that value.

4 of 4

Citations

Cites

Flagged first, then by citations

Research works printed but not linked: 2

  1. 2006, Materials Science in Microelectronics: The Relationships Between Thin Film Processing and Structure
  2. 1931, New Method for Determining the Coefficients of Thermal Conductivity, Tek. Tidskr., 61, 389

Cited by

Sorted by citations

Related

Metadata

Authors
Zhao, D., Qian, X., Gu, X., Jajja, S. A., & Yang, R.
Affiliations
University of Colorado Boulder (US)
ORCID
Venue
Journal of Electronic Packaging
Publisher
ASME International
Published
2016-10-06
Volume
138
Issue
4
ISSN
  • 1043-7398 (ISSN-L)
  • 1528-9044
DOI
10.1115/1.4034605
OpenAlex
W2399632194
Cited by
559
References
133
Citations by year
2026: 55 · 2025: 72 · 2024: 60 · 2023: 57 · 2022: 72 · 2021: 59 · 2020: 66 · 2019: 56 · 2018: 41 · 2017: 19 · 2016: 2
FWCI
15.14
Type
journal article
Language
en
Open access
Locations
  • Journal of Electronic Packaging (publishedVersion)
  • arXiv (Cornell University) (submittedVersion)
  • arXiv (Cornell University)
Topics
  • Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
  • Physical Sciences › Engineering › Computational Mechanics › Heat Transfer and Numerical Methods
  • Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
Keywords
thermal conductivity measurement, interfacial thermal conductance, thin films, bulk materials, steady-state method, transient hot-wire method, transient plane source, 3ω method, transient thermoreflectance, measurement error sources

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