The DOI matches its Crossref record; 36 of the 36 references it cites were found in a registry or an index.
Diffusion of oxygen in amorphous Al2O3, Ta2O5, and Nb2O5
Open accessAbstract
The self-diffusivity of oxygen in amorphous Al2O3 (a-Al2O3), a-Ta2O5, and a-Nb2O5 was investigated along with structural analysis in terms of pair distribution function (PDF). The low activation energy, ∼1.2 eV, for diffusion in the oxides suggests a single atomic jump of oxygen ions mediated via vacancy-like defects. However, the pre-exponential factor for a-Ta2O5 and a-Nb2O5 with lower bond energy was two orders of magnitude larger than that for a-Al2O3 with higher bond energy. PDF analyses revealed that the short-range configuration in a-Ta2O5 and a-Nb2O5 was more broadly distributed than that in a-Al2O3. Due to the larger variety of atomic configurations of a-Ta2O5 and a-Nb2O5, these oxides have a higher activation entropy for diffusion than a-Al2O3. The entropy term for diffusion associated with short-range structures was shown to be a dominant factor for diffusion in amorphous oxides.
Overview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
The cited source says what the claim attributes to it.
In the citing paper
“In fact, oxygen diffusion in Ta2O5 is characterized by a larger activation energy ( ∼ 1.2 eV [17]) and by a smaller field acceleration factor, respectively determining a slower and more random diffusion process (the reduced dependence on the applied field makes easier for O to move radially driven by the local temperature and mutual Coulomb repulsion [14]).”
From Linking Conductive Filament Properties and Evolution to Synaptic Behavior of RRAM Devices for Neuromorphic Applications (2017) · cites this paper as [17]
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cites
Metastable Alumina Polymorphs: Crystal Structures and Transition Sequences
Levin, I., & Brandon, D. G. (1998) · Journal of the American Ceramic Society · doi:10.1111/j.1151-2916.1998.tb02581.x · Cited by 1,498
Interstitial Atomic Diffusion Coefficients
Wert, C. A., & Zener, C. M. (1949) · Physical Review · doi:10.1103/physrev.76.1169 · Cited by 822
Diffusion in metallic glasses and supercooled melts
Faupel, F., Frank, W., Macht, M. ‐., Mehrer, H., Naundorf, V., Rätzke, K., Schober, H. R., Sharma, S. K., & Teichler, H. (2003) · Reviews of Modern Physics · doi:10.1103/revmodphys.75.237 · Cited by 617
Molecular dynamics study of structural properties of amorphous Al2O3
Gutiérrez, G., & Johansson, B. (2002) · Physical review. B, Condensed matter · doi:10.1103/physrevb.65.104202 · Cited by 348
Corrosion resistance and biocompatibility of Ti–Ta alloys for biomedical applications
Zhou, Y., Niinomi, M., Akahori, T., Fukui, H., & Toda, H. (2005) · Materials Science and Engineering A · doi:10.1016/j.msea.2005.03.032 · Cited by 317
Oxygen and aluminum diffusion in α-Al2O3: How much do we really understand?
Heuer, A. H. (2008) · Journal of the European Ceramic Society · doi:10.1016/j.jeurceramsoc.2007.12.020 · Cited by 305
Enhancement of the dielectric constant of Ta2O5through substitution with TiO2
Cava, R. F., PECK, W. F. J., & Krajewski, J. J. (1995) · Nature · doi:10.1038/377215a0 · Cited by 214
Diffusion Processes in Advanced Technological Materials
(2005) · Springer eBooks · doi:10.1007/978-3-540-27470-4 · Cited by 202
Structure of Amorphous Aluminum Oxide
Lee, S. K., Lee, S. K., Park, S. Y., Yi, Y. S., & Ahn, C. W. (2009) · Physical Review Letters · doi:10.1103/physrevlett.103.095501 · Cited by 189
Vashishta, P. D., Kalia, R. K., Nakano, A., & Rino, J. P. (2008) · Journal of Applied Physics · doi:10.1063/1.2901171 · Cited by 184
Cited by
Sorted by citations
Highly ductile amorphous oxide at room temperature and high strain rate
Frankberg, E. J., Kalikka, J., Ferré, F. G., Joly-Pottuz, L., Salminen, T., Hintikka, J., Hokka, M., Koneti, S., Douillard, T., Saint, B. L., et al. (2019) · Science · doi:10.1126/science.aav1254 · Cited by 198
In-memory Learning with Analog Resistive Switching Memory: A Review and Perspective
Xi, Y., Gao, B., Tang, J., Chen, A., Chang, M., Hu, X. S., der Spiegel, J. V., Qian, H., & Wu, H. (2020) · Proceedings of the IEEE · doi:10.1109/jproc.2020.3004543 · Cited by 200
Nanoionics-Based Three-Terminal Synaptic Device Using Zinc Oxide
Pillai, P. B., & Souza, M. M. D. (2016) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.6b13746 · Cited by 169
Charge Transition of Oxygen Vacancies during Resistive Switching in Oxide-Based RRAM
Lee, J., Schell, W., Zhu, X., Kioupakis, E., & Lu, W. D. (2019) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.8b18386 · Cited by 138
Self-rectifying resistive memory in passive crossbar arrays
Jeon, K., Kim, J., Ryu, J. J., Yoo, S.-J., Song, C., Yang, M., Jeong, D. S., & Kim, G. H. (2021) · Nature Communications · doi:10.1038/s41467-021-23180-2 · Cited by 132
Materials selection for oxide-based resistive random access memories
Guo, Y., & Robertson, J. (2014) · Applied Physics Letters · doi:10.1063/1.4903470 · Cited by 118
Woo, J., Padovani, A., Moon, K., Kwak, M., Larcher, L., & Hwang, H. (2017) · IEEE Electron Device Letters · doi:10.1109/led.2017.2731859 · Cited by 103
“2 eV [17]) and by a smaller field acceleration”
BackgroundZhang, H., Yoo, S., Menzel, S., Funck, C., Cüppers, F., Wouters, D. J., Hwang, C. S., Waser, R. M., & Hoffmann‐Eifert, S. (2018) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.8b09068 · Cited by 102
A Low‐Current and Analog Memristor with Ru as Mobile Species
Yoon, J. H., Zhang, J., Lin, P., Upadhyay, N. K., Yan, P., Liu, Y., Xia, Q., & Yang, J. J. (2020) · Advanced Materials · doi:10.1002/adma.201904599 · Cited by 96
Truly Electroforming‐Free and Low‐Energy Memristors with Preconditioned Conductive Tunneling Paths
Yoon, J. H., Zhang, J., Ren, X., Wang, Z., Wu, H., Li, Z., Barnell, M., Wu, Q., Lauhon, L. J., Xia, Q., et al. (2017) · Advanced Functional Materials · doi:10.1002/adfm.201702010 · Cited by 95
2D oriented covalent organic frameworks for alcohol-sensory synapses
Li, T., Yu, H., Xiong, Z., Gao, Z., Zhou, Y., & Han, S. (2021) · Materials Horizons · doi:10.1039/d1mh00315a · Cited by 77
To the Issue of the Memristor’s HRS and LRS States Degradation and Data Retention Time
Фадеев, А. В., & Rudenko, K. V. (2021) · Russian Microelectronics · doi:10.1134/s1063739721050024 · Cited by 77
Gonzalez‐Rosillo, J. C., Balaish, M., Hood, Z. D., Nadkarni, N., Fraggedakis, D., Kim, K. J., Mullin, K. M., Pfenninger, R., Bazant, M. Z., & Rupp, J. L. M. (2020) · Advanced Materials · doi:10.1002/adma.201907465 · Cited by 66
Ke, X., Zhou, X., Gao, H., Hao, G., Xiao, L., Chen, T., Liu, J., & Jiang, W. (2017) · Materials & Design · doi:10.1016/j.matdes.2017.11.068 · Cited by 62
Qin, F. H., Zhang, Y., Song, H. W., & Lee, S. (2023) · Materials Advances · doi:10.1039/d3ma00069a · Cited by 60
von Witzleben, M., Fleck, K., Funck, C., Baumkötter, B., Žurić, M., Idt, A., Breuer, T., Waser, R. M., Böttger, U., & Menzel, S. (2017) · Advanced Electronic Materials · doi:10.1002/aelm.201700294 · Cited by 57
Jung, P.-Y., Panda, D., Chandrasekaran, S., Rajasekaran, S., & Tseng, T. (2020) · IEEE Journal of the Electron Devices Society · doi:10.1109/jeds.2020.2966799 · Cited by 54
Thermal oxidation of amorphous Al0.44Zr0.56 alloys
Weller, K., Jeurgens, L. P. H., Wang, Z., & Mittemeijer, E. J. (2015) · Acta Materialia · doi:10.1016/j.actamat.2014.12.022 · Cited by 51
Chuang, K.-C., Chu, C.-Y., Zhang, H., Luo, J.-D., Li, W.-S., Li, Y.-S., & Cheng, H. (2019) · IEEE Journal of the Electron Devices Society · doi:10.1109/jeds.2019.2915975 · Cited by 51
Jiang, H., & Stewart, D. A. (2016) · Journal of Applied Physics · doi:10.1063/1.4945579 · Cited by 38
Influence of annealing environment on the ALD-Al 2 O 3 /4H-SiC interface studied through XPS
Usman, M., Arshad, M., Suvanam, S. S., & Hallén, A. (2018) · Journal of Physics D Applied Physics · doi:10.1088/1361-6463/aaa9a1 · Cited by 38
Role of the Electrode Material on the RESET Limitation in Oxide ReRAM Devices
Schönhals, A., Rosário, C. M. M., Hoffmann‐Eifert, S., Waser, R. M., Menzel, S., & Wouters, D. J. (2017) · Advanced Electronic Materials · doi:10.1002/aelm.201700243 · Cited by 37
Metal/ SrTiO3 two-dimensional electron gases for spin-to-charge conversion
Vicente‐Arche, L. M., Mallik, S., Cosset‐Chéneau, M., Noël, P., Vaz, D. C., Trier, F., Gosavi, T. A., Lin, C.-C., Nikonov, D. E., Young, I. A., et al. (2021) · Physical Review Materials · doi:10.1103/physrevmaterials.5.064005 · Cited by 33
Oxidation mechanism in a refractory multiple-principal-element alloy at high temperature
Su, R., Zhang, H., Ouyang, G., Liu, L., Johnson, D. D., & Perepezko, J. H. (2023) · Acta Materialia · doi:10.1016/j.actamat.2023.118719 · Cited by 33
Diffusion of oxygen in amorphous tantalum oxide
Stewart, D. A. (2019) · Physical Review Materials · doi:10.1103/physrevmaterials.3.055605 · Cited by 31
Study of the SET switching event of VCM-based memories on a picosecond timescale
von Witzleben, M., Hennen, T., Kindsmüller, A., Menzel, S., Waser, R., & Böttger, U. (2020) · Journal of Applied Physics · doi:10.1063/5.0003840 · Cited by 31
Krivetskiy, V., Malkov, I., Garshev, A. V., Mordvinova, N. E., Lebedev, O. I., Dolenko, S. A., Efitorov, A., Grigoriev, T., Rumyantseva, M. N., & Gaskov, A. M. (2016) · Journal of Alloys and Compounds · doi:10.1016/j.jallcom.2016.08.275 · Cited by 30
Effect of atomic structure on preferential oxidation of alloys: amorphous versus crystalline Cu-Zr
Xu, Y., Jeurgens, L. P. H., Schützendübe, P., Zhu, S., Huang, Y., Liu, Y., & Wang, Z. (2019) · Journal of Material Science and Technology · doi:10.1016/j.jmst.2019.10.001 · Cited by 29
Ramírez, L. P., Bournel, F., Gallet, J., Dudy, L., & Rochet, F. (2022) · The Journal of Physical Chemistry C · doi:10.1021/acs.jpcc.1c09388 · Cited by 28
Time and rate dependent synaptic learning in neuro-mimicking resistive memories
Ahmed, T., Walia, S., Mayes, E. L. H., Ramanathan, R., Bansal, V., Bhaskaran, M. C., Sriram, S., & Kavehei, O. (2019) · Scientific Reports · doi:10.1038/s41598-019-51700-0 · Cited by 28
Evidence for oxygen being a dominant shallow acceptor in p-type CuI
Storm, P., Gierth, S., Selle, S., Bar, M. S., von Wenckstern, H., Grundmann, M., & Lorenz, M. (2021) · APL Materials · doi:10.1063/5.0047723 · Cited by 27
Tsurumaki‐Fukuchi, A., Nakagawa, R., 有田正志, & Takahashi, Y. (2018) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.7b15384 · Cited by 24
Rosário, C. M. M., Thöner, B., Schönhals, A., Menzel, S., Meledin, A., Barradas, N. P., Alves, E., Mayer, J., Wuttig, M., Waser, R. M., et al. (2019) · Nanoscale · doi:10.1039/c9nr05285b · Cited by 24
Thermodynamic origin of nonvolatility in resistive memory
Li, J., Appachar, A., Peczonczyk, S. L., Harrison, E. T., Ievlev, A. V., Hood, R., Shin, D. J., Yoo, S., Roest, B., Sun, K., et al. (2024) · Matter · doi:10.1016/j.matt.2024.07.018 · Cited by 29
Zhou, X., Yi, D., Nyborg, L., Hu, Z., Huang, J., & Cao, Y. J. (2017) · Journal of Alloys and Compounds · doi:10.1016/j.jallcom.2017.06.176 · Cited by 22
Xiao, B., Yu, X.-F., & Watanabe, S. (2019) · ACS Applied Electronic Materials · doi:10.1021/acsaelm.9b00049 · Cited by 22
Ferroelectric‐Like Behavior in TaN/High‐k/Si System Based on Amorphous Oxide
Feng, Z. K., Peng, Y., Shen, Y., Li, Z., Wang, H., Chen, X., Wang, Y., Jing, M., Lu, F., Wang, W., et al. (2021) · Advanced Electronic Materials · doi:10.1002/aelm.202100414 · Cited by 22
Sala, K., Kashyap, S. K., & Mitra, R. (2021) · Intermetallics · doi:10.1016/j.intermet.2021.107338 · Cited by 21
Unravelling the Data Retention Mechanisms under Thermal Stress on 2D Memristors
Aldana, S., & Zhang, H. (2023) · ACS Omega · doi:10.1021/acsomega.3c03200 · Cited by 21
Annealing induced void formation in epitaxial Al thin films on sapphire (α-Al2O3)
Hieke, S. W., Dehm, G., & Scheu, C. (2017) · Acta Materialia · doi:10.1016/j.actamat.2017.08.050 · Cited by 21
Improving the quality of Al2O3/4H-SiC interface for device applications
Usman, M., Suvanam, S. S., Linnarsson, M. K., & Hallén, A. (2018) · Materials Science in Semiconductor Processing · doi:10.1016/j.mssp.2018.02.036 · Cited by 20
Interfacial bonding of CuZr metallic glass via oxide: A molecular dynamics study
Zhang, M., Cai, H., Zhang, J., Li, Q., Wang, Y., Huang, T., Liu, J., & Wang, X. (2021) · Corrosion Science · doi:10.1016/j.corsci.2021.109275 · Cited by 19
The Effects of Oxide Layer on the Joining Performance of CuZr Metallic Glasses
Jasim, S. A., Jabbar, A. H., Bokov, D. O., Mashhadani, Z. I. A., Surendar, A., Taban, T. Z., Kamona, S. M. H., Mahmoud, Z. H., Suksatan, W., Abdulkadhim, A. H., et al. (2022) · Transactions of the Indian Institute of Metals · doi:10.1007/s12666-022-02739-7 · Cited by 19
Zhao, J., Wang, C., Yan, Y. Q., Chen, Y. T., Sun, W. T., Li, J. Y., Wang, X. Y., Mi, W., Song, D., & Zhou, L. (2020) · Vacuum · doi:10.1016/j.vacuum.2020.109186 · Cited by 17
Flame propagation through dust clouds of nano and micron scale aluminum particles
Chang, P.-J., Mogi, T., & Dobashi, R. (2020) · Journal of Loss Prevention in the Process Industries · doi:10.1016/j.jlp.2020.104266 · Cited by 17
Mazumder, S., Pantawane, M. V., & Dahotre, N. B. (2021) · npj Materials Degradation · doi:10.1038/s41529-021-00193-2 · Cited by 16
Lechner, E., Angle, J. W., Palczewski, A., Stevie, F. A., Kelley, M. J., & Reece, C. (2024) · Journal of Applied Physics · doi:10.1063/5.0191234 · Cited by 15
Investigating the oxidation mechanism of tantalum nanoparticles at high heating rates
DeLisio, J. B., Wang, X., Wu, T., Egan, G. C., Jacob, R. J., & Zachariah, M. R. (2017) · Journal of Applied Physics · doi:10.1063/1.4995574 · Cited by 15
Microstructure and mechanical properties of Nb4AlC3 MAX phase synthesized by reactive hot pressing
Julian-Jankowiak, A., & Sallot, P. (2018) · Ceramics International · doi:10.1016/j.ceramint.2018.06.031 · Cited by 15
Impact of Electrolyte Incorporation in Anodized Niobium on Its Resistive Switching
Zrinski, I., Löfler, M., Zavašnik, J., Cancellieri, C., Jeurgens, L. P. H., Hassel, A. W., & Mardare, A. I. (2022) · Nanomaterials · doi:10.3390/nano12050813 · Cited by 15
Atomistic simulations to reveal HIP-bonding mechanisms of Al6061/Al6061
Roy, A., Kalsar, R., Song, M., & Joshi, V. V. (2024) · Acta Materialia · doi:10.1016/j.actamat.2024.120402 · Cited by 14
Modeling of Current Conduction during RESET Phase of Pt/Ta2O5/TaOx/Pt Bipolar Resistive RAM Devices
Jagath, A. L., Kumar, T. N., & Almurib, H. A. F. (2018) · IEEE Non-Volatile Memory Systems and Applications Symposium (NVMSA) · doi:10.1109/nvmsa.2018.00014 · Cited by 14
Quantifying the Local Structure of Nanocrystals, Glasses, and Interfaces Using TEM-Based Diffraction
Ehrhardt, K. M., Radomsky, R. C., & Warren, S. (2021) · Chemistry of Materials · doi:10.1021/acs.chemmater.1c03017 · Cited by 12
The effect of nanometre-scale kinetic competition on the phase selection in Zr/Si superstructure
Cao, G., Guo, M., Yang, F., Xu, H., Shao, G., & Hu, J. (2024) · Materials Characterization · doi:10.1016/j.matchar.2024.113666 · Cited by 13
Disentangling the oxidation mechanisms of high-entropy carbonitrides
Li, Y., Wang, Y., Lin, N., Zhao, S., & Wu, Z. (2025) · Corrosion Science · doi:10.1016/j.corsci.2025.112850 · Cited by 13
Low temperature electroformation of TaOx-based resistive switching devices
Gala, D. K., Sharma, A. A., Li, D., Goodwill, J. M., Bain, J. A., & Skowroński, M. (2016) · APL Materials · doi:10.1063/1.4939181 · Cited by 13
Resistive switching properties of Mn-doped amorphous Nb2O5 thin films for resistive RAM application
Tsai, M., Shih, C.-J., Chang, C.-W., Chu, Y.-T., Wu, Y.-S., & Huang, C. (2022) · Materials Science in Semiconductor Processing · doi:10.1016/j.mssp.2022.107059 · Cited by 13
Li, Y. B., Sun, J., Salim, T., Liu, R., & Chen, T. P. (2021) · ECS Journal of Solid State Science and Technology · doi:10.1149/2162-8777/abf724 · Cited by 13
Kim, J. E., Kwon, J. U., Chun, S. Y., Song, Y. G., Jeong, D. S., Kang, C., Kim, S. K., Nahm, S., & Yoon, J. H. (2022) · Advanced Electronic Materials · doi:10.1002/aelm.202200365 · Cited by 12
Filho, J. B. G., de Almeida, L. D., Victória, H. F. V., Gomes, G. H. M., Krambrock, K., Robles‐Azocar, P. A., Pereira, M. C., & Oliveira, L. C. A. (2024) · Journal of Catalysis · doi:10.1016/j.jcat.2024.115580 · Cited by 12
Insight into Facile Ion Diffusion in Resistive Switching Medium toward Low Operating Voltage Memory
Do, D. P., Bui, V. Q., Nguyen, M. C., Seo, S., Do, V. D., Kim, J., Choi, J., Ko, H., Yu, W. J., Kawazoe, Y., et al. (2024) · Nano Letters · doi:10.1021/acs.nanolett.4c01629 · Cited by 12
Korshunov, A. V. (2024) · Physical Chemistry Chemical Physics · doi:10.1039/d4cp03355h · Cited by 12
AgBiS 2 quantum dot based multilevel resistive switching for low power electronics
Sharma, H., Saini, N., Kumar, A., & Srivastava, R. (2023) · Journal of Materials Chemistry C · doi:10.1039/d3tc01050c · Cited by 12
Long-Term Sustainability of High-Mobility Ultrathin a-IGZO TFT with Double-Layered Passivation
Tang, Y., Song, Y., & Nomura, K. (2025) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.5c08848 · Cited by 11
Nandi, S. K., Nath, S. K., Das, S. K., Murdoch, B. J., Ratcliff, T., McCulloch, D. G., & Elliman, R. G. (2023) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.3c14431 · Cited by 10
Nguyen, G. T., Nguyen, T. T., Nguyen, T. T., & Le, V. V. (2016) · Journal of Non-Crystalline Solids · doi:10.1016/j.jnoncrysol.2016.07.018 · Cited by 10
Patil, S. M., Kumar, K. N. C., Radhakrishnan, M., Sharma, S., Joshi, S. S., Kumar, J., Banerjee, R., & Dahotre, N. B. (2025) · Corrosion Science · doi:10.1016/j.corsci.2025.113174 · Cited by 9
Electronegative metal dopants improve switching variability in Al2O3 resistive switching devices
Tan, Z. J., Somjit, V., Toparlı, Ç., Yildiz, B., & Fang, N. X. (2022) · Physical Review Materials · doi:10.1103/physrevmaterials.6.105002 · Cited by 11
Suñé, J., Aguirre, F. L., González, M. B., Campabadal, F., & Miranda, E. A. (2023) · Advanced Quantum Technologies · doi:10.1002/qute.202300048 · Cited by 8
Momida, H., & Ohno, T. (2020) · Applied Physics Letters · doi:10.1063/5.0021627 · Cited by 8
Leon-Chaparro, D., Nguyen, M. D., Baeumer, C., Mul, G., & Katsoukis, G. (2025) · Advanced Materials Interfaces · doi:10.1002/admi.202400846 · Cited by 7
Jiang, L., Jin, Y., Zhao, Y., Meng, J., Zhang, J., Chen, X., Wu, X., Xiao, Y., Tao, Z., Jiang, B., et al. (2023) · Advanced Physics Research · doi:10.1002/apxr.202200086 · Cited by 7
Vogl, L., Schweizer, P., Minor, A. M., Michler, J., & Utke, I. (2024) · Advanced Engineering Materials · doi:10.1002/adem.202302220 · Cited by 7
Effect of Nb2O5 doping on low-temperature sintering of TiO2-Al2O3 ceramics
Shih, H.-J., Lee, Y.-C., Li, Y., & Yang, C.-T. (2024) · Open Ceramics · doi:10.1016/j.oceram.2024.100635 · Cited by 7
Interface between Al 2 O 3 and 4H-SiC investigated by time-of-flight medium energy ion scattering
Linnarsson, M. K., Hallén, A., Khartsev, S. I., Suvanam, S. S., & Usman, M. (2017) · Journal of Physics D Applied Physics · doi:10.1088/1361-6463/aa9431 · Cited by 7
Li, J., Wu, J., Liu, J., & Sun, J. (2019) · Nanoscale Research Letters · doi:10.1186/s11671-019-2907-0 · Cited by 7
High-Interface-Quality Hf-Based Gate Stacks on Si0.5Ge0.5 Through Aluminum Capping
Lee, M.-C., Lee, W., Lin, H.-R., Luo, G.-L., & Chien, C.-H. (2021) · IEEE Electron Device Letters · doi:10.1109/led.2021.3123607 · Cited by 7
Molnár, D., Török, T. N., Sánta, B., Gubicza, Á., Magyarkuti, A., Hauert, R., Kiss, G. J., Halbritter, A., & Csontos, M. (2018) · Nanoscale · doi:10.1039/c8nr06226a · Cited by 7
Improved oxidation resistance of boron nitride nanotubes with protective alumina nano-coatings
Davis, C. R., Nuwayhid, R. B., Campbell, C. A., Mills, S. C., Backman, L., Estevez, J. E., & Schaeffer, M. R. (2024) · Ceramics International · doi:10.1016/j.ceramint.2024.09.211 · Cited by 6
ALD Al2O3-Engineered Schottky Barrier Interface for Amorphous Indium–Zinc Oxide
Zheng, Z., Huang, C.-Y., Jin, Y., Zhang, M., Yan, Y., Zhang, D. H., Wong, M., Kwok, H. S., & Lü, L. (2025) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2025.3592642 · Cited by 6
Electrical model of Ta2O5/TaOx RRAM device with current conduction beyond RESET phase
Jagath, A. L., Kumar, T. N., & Almurib, H. A. F. (2019) · IEEE International Nanoelectronics Conference · doi:10.1109/inec.2019.8853845 · Cited by 6
Fujiwara, K., Tsubota, S., & Tanaka, H. (2018) · Applied Physics Express · doi:10.7567/1882-0786/aaf285 · Cited by 6
Density functional theory study of oxygen vacancy defect diffusion properties in λ -Ta 2 O 5
Wu, X., Cui, N., Zhang, Q., Wang, W., Huang, Q., Hongsong, Z., & Xu, Q. (2020) · Japanese Journal of Applied Physics · doi:10.35848/1347-4065/abcc14 · Cited by 6
An aluminide coating deposited by pack cementation on 2:17-type SmCo magnets
Chen, Q., Kang, D., He, Y., Liu, J., Zhang, T., & Jiang, C. (2024) · Applied Surface Science · doi:10.1016/j.apsusc.2024.160753 · Cited by 5
Фадеев, А. В., & Rudenko, K. V. (2019) · Russian Microelectronics · doi:10.1134/s1063739719040048 · Cited by 5
Gurbán, S., Sulyok, A., Menyhard, M., Baradács, E., Parditka, B., Cserháti, C., Langer, G. A., & Erdélyi, Z. (2021) · Scientific Reports · doi:10.1038/s41598-021-88808-1 · Cited by 5
Christis, M., Henning, A., Bartl, J. D., Zeidler, A., Rieger, B., Stutzmann, M., & Sharp, I. D. (2023) · Advanced Materials Interfaces · doi:10.1002/admi.202300758 · Cited by 5
Gao, Y., Han, X.-E., Gao, X., Xue, F.-L., Chen, J.-R., Zhong, Y., Xu, J.-L., & Wang, S. (2025) · Materials & Design · doi:10.1016/j.matdes.2025.114152 · Cited by 6
Degradation of leakage currents and reliability prediction for tantalum capacitors
Teverovsky, A. (2016) · Annual Reliability and Maintainability Symposium (RAMS) · doi:10.1109/rams.2016.7447969 · Cited by 5
Demarina, N. V., Karimzadah, S., Bennemann, B., Krause, C., Jalil, A. R., Hartmann, H., Kardynal, B. E., Lepsa, M. I., & Gruetzmacher, D. A. (2025) · Applied Surface Science · doi:10.1016/j.apsusc.2025.165114 · Cited by 4
Gaggio, B., Jan, A., Muller, M., Salonikidou, B., Bakhit, B., Hellenbrand, M., Martino, G. D., Yildiz, B., & MacManus‐Driscoll, J. L. (2024) · Chemistry of Materials · doi:10.1021/acs.chemmater.4c00965 · Cited by 4
Yang, L., Randel, E., Vajente, G., Ananyeva, A., Gustafson, E. K., Markosyan, A. S., Bassiri, R., Fejer, M. M., & Menoni, C. S. (2019) · Physical review. D/Physical review. D. · doi:10.1103/physrevd.100.122004 · Cited by 4
Efficient implementation of the Hodgkin-Huxley potassium channel via a single volatile memristor
Landsmeer, L. P. L., Hua, E., Abunahla, H., Siddiqi, M. A., Ishihara, R., Zeeuw, C. I. D., Hamdioui, S., & Strydis, C. (2025) · Frontiers in Neuroscience · doi:10.3389/fnins.2025.1569397 · Cited by 3
Leon-Chaparro, D., Englezos, C., Mei, B., Mul, G., & Katsoukis, G. (2026) · Nanoscale · doi:10.1039/d5nr04262c · Cited by 3
Oxidation behavior and interdiffusion of Ta Al multilayer films and Inconel 617 alloy
Ke, Y.-E., Chang, L.-C., Kai, W., & Chen, Y.-I. (2020) · Surface and Coatings Technology · doi:10.1016/j.surfcoat.2020.126684 · Cited by 3
Bipolar resistive switching memory with bismuth sulfide quantum dots
Rohilla, R., Goswami, L., Bisht, A., Maurya, V. K., Srivastava, R., & Kumar, A. (2025) · Journal of Applied Physics · doi:10.1063/5.0246454 · Cited by 3
Interface-enhanced ion migration in amorphous alumina thin film on a substrate
Liu, Z., Kwan, C. C. F., & Wen, J. Z. (2025) · Physical Review Materials · doi:10.1103/dspr-7h6w · Cited by 2
Bilayer Ohmic Electrode Engineering in TaO X ReRAM Devices
Paul, G., Glint, T., Menzel, S., & Rana, V. (2025) · IEEE Electron Device Letters · doi:10.1109/led.2025.3585469 · Cited by 2
Xiong, J., Zhang, M., Guo, N., Bao, L., Hou, H., & Wang, B. (2025) · Aerospace · doi:10.3390/aerospace12121041 · Cited by 2
Cation‐Driven Valence Change Mechanism in 2D AgCrS 2 for Ultralow‐Power and Reliable Memristors
Su, Y., Wang, M., Tai, X., Liu, Y., Lin, Y. I. P., Guo, Y., Peng, J., Xie, Y., & Wu, C. (2026) · Advanced Science · doi:10.1002/advs.202521409 · Cited by 2
Metadata
- Authors
- Nakamura, R., Toda, T., Tsukui, S., Tane, M., Ishimaru, M., Suzuki, T., & Nakajima, H.
- Affiliations
- Osaka Prefecture University (JP)
- The Institute of Scientific and Industrial Research, The University of Osaka (JP)
- Kyushu Institute of Technology (JP)
- Foundation Wakasa Wan Energy Research Center (JP)
- Venue
- Journal of Applied Physics
- Publisher
- AIP Publishing
- Published
- 2014-07-15
- Volume
- 116
- Issue
- 3
- ISSN
- 0021-8979 (ISSN-L)
- 1089-7550
- OpenAlex
- W2048014664
- Cited by
- 132
- References
- 36
- Citations by year
- 2026: 15 · 2025: 19 · 2024: 14 · 2023: 10 · 2022: 8 · 2021: 16 · 2020: 11 · 2019: 12 · 2018: 8 · 2017: 9 · 2016: 7 · 2015: 2 · 2014: 1
- FWCI
- 5.77
- Type
- journal article
- Language
- en
- Open access
- green
- omu.repo.nii.ac.jp
- Locations
- Journal of Applied Physics (publishedVersion)
- Institutional Repositories DataBase (IRDB) (submittedVersion)
- Osaka Prefecture University Repository (Osaka Prefecture University) (submittedVersion, cc-by-nc-nd)
- Topics
- Physical Sciences › Materials Science › Ceramics and Composites › Glass properties and applications
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
- Physical Sciences › Materials Science › Materials Chemistry › Nuclear materials and radiation effects
- Keywords
- oxygen self-diffusion, amorphous oxides, amorphous Al2O3, amorphous Ta2O5, activation energy, vacancy-like defects, pair distribution function, short-range order, activation entropy, bond energy, pre-exponential factor
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review