The DOI matches its Crossref record; 75 of the 75 references it cites were found in a registry or an index.
Present and future thermal interface materials for electronic devices
Abstract
Packaging electronic devices is a growing challenge as device performance and power levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a challenge. Ensuring effective heat transfer from an integrated circuit and its heat spreader to a heat sink is a vital step in meeting this challenge. The projected power density and junction-to-ambient thermal resistance for high-performance chips at the 14 nm generation are >100 Wcm−2 and <0.2 °CW−1, respectively. The main bottleneck in reducing the net thermal resistance are the thermal resistances of the thermal interface material (TIM). This review evaluates the current state of the art of TIMs. Here, the theory of thermal surface interaction will be addressed and the practicalities of the measurement techniques and the reliability of TIMs will be discussed. Furthermore, the next generation of TIMs will be discussed in terms of potential thermal solutions in the realisation of Internet of Things.
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Citations
Cites
Contact of nominally flat surfaces
Greenwood, J. A., & Williamson, J. B. P. (1966) · Proceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences · doi:10.1098/rspa.1966.0242 · Cited by 5,692
Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity
Parker, W. J., Jenkins, R. J., Butler, C. P., & Abbott, G. L. (1961) · Journal of Applied Physics · doi:10.1063/1.1728417 · Cited by 3,978 · cited 1×
“Another popular transient technique used to evaluate TIM thermal characteristics is the flash method [57].”
MethodThermal Transport Measurements of Individual Multiwalled Nanotubes
Kim, P., Shi, L., Majumdar, A., & McEuen, P. L. (2001) · Physical Review Letters · doi:10.1103/physrevlett.87.215502 · Cited by 3,378 · cited 1×
“have a thermal conductivity as high as 37 000 Wm K [59] whereas multi-walled nanotubes (MWNTs) have been reported to be up to 3000 Wm K at room temperature [60,61].”
BackgroundGraphene–Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials
Shahil, K. M. F., & Balandin, A. A. (2012) · Nano Letters · doi:10.1021/nl203906r · Cited by 1,467
Cooper, M. G., Mikic, B. B., & Yovanovich, M. M. (1969) · International Journal of Heat and Mass Transfer · doi:10.1016/0017-9310(69)90011-8 · Cited by 1,069
Thermal Interface Materials: Historical Perspective, Status, and Future Directions
Prasher, R. (2006) · Proceedings of the IEEE · doi:10.1109/jproc.2006.879796 · Cited by 927
Thermal Conductance and Thermopower of an Individual Single-Wall Carbon Nanotube
Yu, C., Shi, L., Yao, Z., Li, D., & Majumdar, A. (2005) · Nano Letters · doi:10.1021/nl051044e · Cited by 871
Thermally Conductive Graphene-Polymer Composites: Size, Percolation, and Synergy Effects
Shtein, M., Nadiv, R., Buzaglo, M., Kahil, K., & Regev, O. (2015) · Chemistry of Materials · doi:10.1021/cm504550e · Cited by 606
Noble‐Metal‐Promoted Three‐Dimensional Macroassembly of Single‐Layered Graphene Oxide
Tang, Z., Shen, S., Zhuang, J., & Wang, X. (2010) · Angewandte Chemie International Edition · doi:10.1002/anie.201000270 · Cited by 557
Enhancement of thermal interface materials with carbon nanotube arrays
Xu, J., & Fisher, T. S. (2006) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2005.09.039 · Cited by 474
Cited by
Thermal conductivity of carbon nanotube networks: a review
Kumanek, B., & Janas, D. (2019) · Journal of Materials Science · doi:10.1007/s10853-019-03368-0 · Cited by 486
Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials
Dai, W., Ma, T., Yan, Q., Gao, J., Tan, X., Lv, L., Hou, H., Wei, Q., Yu, J., Wu, J., et al. (2019) · ACS Nano · doi:10.1021/acsnano.9b05163 · Cited by 348
Strategies for enhancing thermal conductivity of polymer-based thermal interface materials: a review
Ma, H., Gao, B., Wang, M., Yuan, Z., Shen, J., Zhao, J., & Feng, Y. (2021) · Journal of Materials Science · doi:10.1007/s10853-020-05279-x · Cited by 299
Thermal Transport in Conductive Polymer–Based Materials
Xu, X., Zhou, J., & Chen, J. (2020) · Advanced Functional Materials · doi:10.1002/adfm.201904704 · Cited by 224
Metadata
- Authors
- Razeeb, K. M., Dalton, E., Cross, G. L. W., & Robinson, A. J.
- Venue
- International Materials Reviews
- Publisher
- SAGE Publications
- Published
- 2017-03-27
- Volume
- 63
- Issue
- 1
- Pages
- 1-21
- ISSN
- 0950-6608 (ISSN-L)
- 1743-2804
- OpenAlex
- W2603759660
- Cited by
- 422
- References
- 75
- FWCI
- 9.26
- Type
- journal article
- Language
- en
- Open access
- closed
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- Razeeb, K. M., Dalton, E., Cross, G. L. W., & Robinson, A. J. (2018). Present and future thermal interface materials for electronic devices. International Materials Reviews. https://doi.org/10.1080/09506608.2017.1296605
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
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