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A Review on Dissimilar Friction Stir Welding of Copper to Aluminum: Process, Properties, and Variants

Mehta, Kush P., Badheka, Vishvesh J.·2016·Materials and Manufacturing Processes

Abstract

Copper and aluminum materials are extensively used in different industries because of its great conductivities and corrosion resistant nature. It is important to join dissimilar materials such as copper and aluminum to permit maximum use of the special properties of both the materials. The joining of dissimilar materials is one of the most advanced topics, which researchers have found from last few years. Friction stir welding (FSW) technology is feasible to join dissimilar materials because of its solid state nature. Present article provides a comprehensive insight on dissimilar copper to aluminum materials joined by FSW technology. FSW parameters such as tool design, tool pin offset, rotational speed, welding speed, tool tilt angle, and position of workpiece material in fixture for dissimilar Cu–Al system are summarized in the present review article. Additionally, welding defects, microstructure, and intermetallic compound generation for Cu–Al FSW system have been also discussed in this article. Furthermore, the new developments and future scope of dissimilar Cu–Al FSW system have been addressed.

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Metadata

Authors
Mehta, K. P., & Badheka, V. J.
Venue
Materials and Manufacturing Processes
Published
2015-03-23
Volume
31
Issue
3
Pages
233-254
ISSN
  • 1042-6914 (ISSN-L)
  • 1532-2475
OpenAlex
W2087233056
Cited by
294
References
0
FWCI
18.63
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: A Review on Dissimilar Friction Stir Welding of Copper to Aluminum: Process, Properties, and Variants. https://app.cochat.ai/papers/10.1080/10426914.2015.1025971
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Mehta, K. P., & Badheka, V. J. (2016). A Review on Dissimilar Friction Stir Welding of Copper to Aluminum: Process, Properties, and Variants. Materials and Manufacturing Processes. https://doi.org/10.1080/10426914.2015.1025971

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

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