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Processing of Al/Cu bimetal via a novel compound casting method
Abstract
Al/Cu bimetal was processed via a novel compound casting method in this paper. Interface characteristics of the Al/Cu bimetal were studied, and the generation mechanism of the interface was also discussed. The interface of the Al/Cu bimetal displayed a defect-free and uniform morphology, which was constituted by α(Al)+Al2Cu eutectic, Al2Cu, AlCu, Al4Cu9, and Si phases. The preferred crystallographic orientations of the α(Al) and Si phase growths were respectively {111} and {001}, while the textures of the Al2Cu, AlCu, Al4Cu9 phases were basically random. A bonding mechanism of the fusion and diffusion was proposed for interface formation of the Al/Cu bimetal. The interface had much higher hardness in comparison with the Al and Cu substrates, and the Al4Cu9 phase in the interface layer obtained the highest hardness, up to 9.6 GPa. The bonding strength of the Al/Cu bimetal achieved approximately 28.5 MPa. The fractographs from the fractured surface of the Al/Cu bimetal represented a brittle fracture characteristic, and the fracture mainly initiated from the α(Al)+Al2Cu eutectic.
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“The abrupt descent of the load at T = 680 °C, t = 30 s, and T = 680 °C, t = 15 s conditions reveals that the debonding of the Cu core and the Al matrix occurs16.”
From Microstructural and mechanical characterization of Al/Cu interface in a bimetallic composite produced by compound casting (2024) · cites this paper as [16]
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Cited by
Sorted by citations
Interfacial Microstructure Formation in Al7SiMg/Cu Compound Castings
Bakke, A. O., Løland, J.-O., Jørgensen, S., Kvinge, J., Arnberg, L., & Li, Y. (2021) · International Journal of Metalcasting · doi:10.1007/s40962-020-00463-w · Cited by 22
Bakke, A. O., Arnberg, L., & Li, Y. (2021) · Materials Science and Engineering: A · doi:10.1016/j.msea.2021.140979 · Cited by 20
Ahmadzadeh Salout, S., & Mirbagheri, S. M. H. (2024) · Scientific Reports · doi:10.1038/s41598-024-57849-7 · Cited by 18
Zheng, H., Liu, C.-L., Gao, Q., Wu, M.-W., & Qin, X.-P. (2026) · Journal of Materials Research · doi:10.1557/s43578-025-01765-7 · Cited by 2
INTERDIFFUSION ZONE CHARACTERISTICS OF INTERFACE BIMETAL ALUMINUM-COPPER PRODUCED BY SQUEEZE CASTING
Setyana, L., Kusmono, Santoso, N., Wely Wullur, C., & Taufiqulhakim, D. (2024) · Acta Metallurgica Slovaca · doi:10.36547/ams.30.4.2083
Metadata
- Authors
- Jiang, W., Guan, F., Li, G., Jiang, H., Zhu, J., & Fan, Z.
- Affiliations
- State Key Laboratory of Materials Processing and Die & Mould Technology (CN)
- Corresponding author
- Fan, Zitian
- Venue
- Materials and Manufacturing Processes
- Publisher
- Informa UK Limited
- Published
- 2019-05-14
- Volume
- 34
- Issue
- 9
- Pages
- 1016-1025
- ISSN
- 1042-6914 (ISSN-L)
- 1532-2475
- OpenAlex
- W2945221913
- Cited by
- 33
- References
- 0
- Citations by year
- 2026: 4 · 2025: 6 · 2024: 4 · 2023: 5 · 2022: 4 · 2021: 5 · 2020: 5
- FWCI
- 1.97
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Materials and Manufacturing Processes (publishedVersion)
- Funders
- National Natural Science Foundation of China (51775204)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Mechanical Engineering › Aluminum Alloys Composites Properties
- Physical Sciences › Materials Science › Metals and Alloys › Aluminum Alloy Microstructure Properties
- Keywords
- compound casting, interface formation, crystallographic texture, bonding mechanism, interface hardness, bond strength, brittle fracture, crack initiation
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- The paper
- Jiang, W., Guan, F., Li, G., Jiang, H., Zhu, J., & Fan, Z. (2019). Processing of Al/Cu bimetal via a novel compound casting method. Materials and Manufacturing Processes. https://doi.org/10.1080/10426914.2019.1615084