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Cited by 101Advanced Welding Techniques AnalysisElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure Properties

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Controlling of IMCs layers formation sequence, bond strength and electrical resistance in Al Cu bimetal compound casting process

Tavassoli, Soheil, Abbasi, Mehrdad, Tahavvori, Ramin·2016·Materials & Design
DOI 10.1016/j.matdes.2016.06.076
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Research works printed but not linked: 25

  1. Eizadjou, 2008, Investigation of structure and mechanical properties of multi-layered Al/Cu composite produced by accumulative roll bonding (ARB) process, Compos. Sci. Technol., 68, 2003, 10.1016/j.compscitech.2008.02.029 · DOI
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  17. Divandari, 2009, Study of Al/Cu rich phases formed in A356 alloy by inserting cu wire in pattern in LFC process, Mater. Des., 30, 3279, 10.1016/j.matdes.2009.01.008 · DOI
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Metadata

Authors
Tavassoli, S., Abbasi, M., & Tahavvori, R.
Affiliations
Islamic Azad University, Karaj (IR)
Corresponding author
Abbasi, Mehrdad
ORCID
Abbasi, Mehrdad
Venue
Materials & Design
Publisher
Elsevier BV
Published
2016-10
Volume
108
Pages
343-353
ISSN
0264-1275 (ISSN-L)
DOI
10.1016/j.matdes.2016.06.076
OpenAlex
W2466585457
Cited by
101
References
0
Citations by year
2026: 10 · 2025: 15 · 2024: 9 · 2023: 15 · 2022: 14 · 2021: 6 · 2020: 9 · 2019: 4 · 2018: 9 · 2017: 10
FWCI
6.82
Type
journal article
Language
en
Open access
closed
Licence
www.elsevier.com/tdm/userlicense/1.0/ (tdm)
Locations
  • Materials & Design (publishedVersion)
  • DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion)
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
  • Physical Sciences › Materials Science › Metals and Alloys › Aluminum Alloy Microstructure Properties
Keywords
compound casting, intermetallic compound layer, Cu/Al interface, bond strength, electrical conductivity, solid-state diffusion, Al2Cu, AlCu, Al4Cu9, eutectic microstructure

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CoChat. (2026). Citation check: Controlling of IMCs layers formation sequence, bond strength and electrical resistance in Al Cu bimetal compound casting process. https://app.cochat.ai/papers/10.1016/j.matdes.2016.06.076
The paper
Tavassoli, S., Abbasi, M., & Tahavvori, R. (2016). Controlling of IMCs layers formation sequence, bond strength and electrical resistance in Al Cu bimetal compound casting process. Materials & Design. https://doi.org/10.1016/j.matdes.2016.06.076