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SU-8: a photoresist for high-aspect-ratio and 3D submicron lithography
Open accessAbstract
SU-8 has become the favourite photoresist for high-aspect-ratio (HAR) and three-dimensional (3D) lithographic patterning due to its excellent coating, planarization and processing properties as well as its mechanical and chemical stability. However, as feature sizes get smaller and pattern complexity increases, particular difficulties and a number of material-related issues arise and need to be carefully considered. This review presents a detailed description of these effects and describes reported strategies and achieved SU-8 HAR and 3D structures up to August 2006.
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Citations
Cited by
Hassler, C., Boretius, T., & Stieglitz, T. (2011) · Journal of Polymer Science Part B: Polymer Physics · doi:10.1002/polb.22169 · Cited by 501
3D printing of functional microrobots
Li, J., & Pumera, M. (2021) · Chemical Society Reviews · doi:10.1039/d0cs01062f · Cited by 303
Holste, K., Dietz, P., Scharmann, S., Keil, K., Henning, T., Zschätzsch, D., Reitemeyer, M., Nauschütt, B., Kiefer, F., Kunze, F., et al. (2020) · Review of Scientific Instruments · doi:10.1063/5.0010134 · Cited by 207
Metadata
- Authors
- Campo, A. D., & Greiner, C.
- Venue
- Journal of Micromechanics and Microengineering
- Publisher
- IOP Publishing
- Published
- 2007-05-15
- Volume
- 17
- Issue
- 6
- Pages
- R81-R95
- ISSN
- 0960-1317 (ISSN-L)
- 1361-6439
- OpenAlex
- W1971870134
- Cited by
- 825
- References
- 0
- FWCI
- 28.04
- Type
- journal article
- Language
- en
- Open access
- bronze
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- CoChat. (2026). Citation check: SU-8: a photoresist for high-aspect-ratio and 3D submicron lithography. https://app.cochat.ai/papers/10.1088/0960-1317/17/6/r01
- The paper
- Campo, A. D., & Greiner, C. (2007). SU-8: a photoresist for high-aspect-ratio and 3D submicron lithography. Journal of Micromechanics and Microengineering. https://doi.org/10.1088/0960-1317/17/6/r01
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
