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Cited by 358Advanced MEMS and NEMS Technologies3D IC and TSV technologiesMicrofluidic and Capillary Electrophoresis Applications

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Wafer level packaging of MEMS

Esashi, Masayoshi·2008·Journal of Micromechanics and Microengineering
DOI 10.1088/0960-1317/18/7/073001
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Abstract

Wafer level packaging plays many important roles for MEMS (micro electro mechanical systems), including cost, yield and reliability. MEMS structures on silicon chips are encapsulated between bonded wafers or by surface micromachining, and electrical interconnections are made from the cavity. Bonding at the interface, such as glass–Si anodic bonding and metal-to-metal bonding, requires electrical interconnection through the lid vias in many cases. On the other hand, lateral electrical interconnections on the surface of the chip are used for bonding with intermediate melting materials, such as low melting point glass and solder. The cavity formed by surface micromachining is made using sacrificial etching, and the openings needed for the sacrificial etching are plugged using deposition sealing methods. Vacuum packaging methods and the structures for electrical feedthrough for the interconnection are discussed in this review.

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  • Suspended silicon photonic MEMS devices must be placed inside hermetically sealed cavities to ensure reliable operation and protect them from environmental influences such as dust and varying humidity.

    “To ensure reliable operation and protect suspended silicon photonic MEMS devices from environmental influences, such as dust and varying humidity levels, the devices must be placed inside hermetically sealed cavities63.”

    From Integrated silicon photonic MEMS (2023) · cites this paper as [63]

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Cited by

Sorted by citations

  • Integrated silicon photonic MEMS

    Quack, N., Takabayashi, A. Y., Sattari, H., Edinger, P., Jo, G., Bleiker, S. J., Errando-Herranz, C., Gylfason, K. B., Niklaus, F., Khan, U., et al. (2023) · Microsystems & Nanoengineering · doi:10.1038/s41378-023-00498-z · Cited by 167

    “To ensure reliable operation and protect suspended silicon photonic MEMS devices from environmental in fl uences, such as dust and varying humidity levels, the devices must be placed inside hermetically sealed cavities 63 .”

Metadata

Authors
Esashi, M.
Affiliations
Tohoku University (JP)
Corresponding author
Esashi, Masayoshi
ORCID
Esashi, Masayoshi
Venue
Journal of Micromechanics and Microengineering
Publisher
IOP Publishing
Published
2008-05-29
Volume
18
Issue
7
Pages
073001
ISSN
  • 0960-1317 (ISSN-L)
  • 1361-6439
DOI
10.1088/0960-1317/18/7/073001
OpenAlex
W2003766830
Cited by
358
References
0
Citations by year
2026: 4 · 2025: 12 · 2024: 13 · 2023: 12 · 2022: 10 · 2021: 19 · 2020: 12 · 2019: 18 · 2018: 21 · 2017: 29 · 2016: 19 · 2015: 25 · 2014: 30 · 2013: 29 · 2012: 38
FWCI
20.06
Type
journal article
Language
en
Open access
closed
Locations
Journal of Micromechanics and Microengineering (publishedVersion)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced MEMS and NEMS Technologies
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
  • Physical Sciences › Engineering › Biomedical Engineering › Microfluidic and Capillary Electrophoresis Applications
Keywords
wafer-level packaging, MEMS, anodic bonding, metal-metal bonding, surface micromachining, sacrificial etching, electrical interconnection, low-melting glass, solder bonding, vacuum packaging, electrical feedthrough, encapsulation, yield and reliability

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