Cited by 646Thermal properties of materialsThermoelastic and Magnetoelastic PhenomenaAdvanced Condensed Matter Physics

The DOI matches its Crossref record; 39 of the 39 references it cites were found in a registry or an index.

Kapitza conductance and heat flow between solids at temperatures from 50 to 300 K

Stoner, R. J., Maris, H. J.·1993·Physical Review B

Open this paper in CoChat — free account

Abstract

Measurements of the Kapitza conductance ${\mathrm{\ensuremath{\sigma}}}_{\mathit{K}}$ made using a picosecond optical technique at temperatures between 50 and 300 K are presented for interfaces between metals and dielectrics. The Debye temperatures ${\mathit{FTHETA}}_{\mathit{D}}$ of the metals (Pb, Au, Al, and Ti) were in the range from 102 to 426 K, while those of the dielectrics (${\mathrm{BaF}}_{2}$, sapphire, and diamond) varied from 287 to 2200 K. Conductances measured between materials with ${\mathit{FTHETA}}_{\mathit{D}}$ differing by less than about a factor of 5 were found to be in reasonable agreement with calculations based on a lattice dynamical theory. However, for more widely mismatched solids the measured conductances were found to be greatly in excess of the lattice dynamical calculations. In some of these cases the conductances exceeded even the phonon radiation limit, indicating that much of the heat flow between the solids was via an inelastic channel. It was demonstrated experimentally that the inelastic channel does not involve an interaction between the phonons in the dielectric and electrons in the metal. We show that the anomalously large conductance can be understood in terms of a model in which the anharmonicity of the metal plays an important role.

Integrity signals

Registry

Crossref · 10.1103/physrevb.48.16373

Cites

39 of 39 references verified0 citation errors · 0 not checkable

Statistics

Recomputing p-values needs the paper’s full text.

Claims the paper makes

This paper’s full text isn’t openly available, so its claims and self-check weren’t run. The registry and citation checks still apply.

Claims other papers make about this one

Each is checked against this paper’s own text: does it say what the citing paper says it does?

Electronic structure and the properties of solids
Harrison, W. A. (1980) · Cited by 4,193
Thermophysical Properties of Matter
Touloukian, Y. S. (1995) · CERN Document Server (European Organization for Nuclear Research) · Cited by 3,282
Thermal boundary resistance
Swartz, E. T., & Pohl, R. O. (1989) · Reviews of Modern Physics · doi:10.1103/revmodphys.61.605 · Cited by 2,992
Surface generation and detection of phonons by picosecond light pulses
Thomsen, C., Grahn, H. T., Maris, H. J., & Tauc, J. (1986) · Physical review. B, Condensed matter · doi:10.1103/physrevb.34.4129 · Cited by 1,636
Self-citation
THE TRANSPORT OF HEAT BETWEEN DISSIMILAR SOLIDS AT LOW TEMPERATURES
Little, W. A. (1959) · Canadian Journal of Physics · doi:10.1139/p59-037 · Cited by 907
Femtosecond room-temperature measurement of the electron-phonon coupling constant γ in metallic superconductors
Brorson, S. D., Kazeroonian, A., Moodera, J. S., Face, D. W., Cheng, T. K., Ippen, E. P., Dresselhaus, M. S., & Dresselhaus, G. (1990) · Physical Review Letters · doi:10.1103/physrevlett.64.2172 · Cited by 672
Kapitza Resistance
Pollack, G. L. (1969) · Reviews of Modern Physics · doi:10.1103/revmodphys.41.48 · Cited by 610
Thermal diffusivity of isotopically enriched C12 diamond
Anthony, T. R., Banholzer, W. F., Fleischer, J. F., Wei, L., Kuo, P. K., Thomas, R. L., & Pryor, R. W. (1990) · Physical review. B, Condensed matter · doi:10.1103/physrevb.42.1104 · Cited by 446
Thermal resistance at interfaces
Swartz, E. T., & Pohl, R. O. (1987) · Applied Physics Letters · doi:10.1063/1.98939 · Cited by 410
Generation of nonequilibrium electron and lattice temperatures in copper by picosecond laser pulses
Eesley, G. L. (1986) · Physical review. B, Condensed matter · doi:10.1103/physrevb.33.2144 · Cited by 373

Flagged first, then by citations

Show all 39 references

Research works printed but not linked: 15

P. L. Kapitza, 1941, J. Phys. USSR, 4, 181
I. M. Khalatnikov, 1952, Zh. Eksp. Teor. Fiz., 22, 687
I. M. Khalatnikov, 1965, Theory of Superfluidity
P. Herth, 1970, Z. Angew. Phys., 29, 101
A. C. Anderson, 1981, Nonequilibrium Superconductivity, Phonons and Kapitza Boundaries
M. Nahum, Phonon Scattering in Condensed Matter VII
S. J. Collocot, 1983, J. Phys. C, 16, 6174
1986, CRC Handbook of Chemistry and Physics, 67th ed.
Y. Namba, 1978, Ann. CIRP, 27, 511
H. J. Maris, 1992, Acousto-Optics and Acoustic Microscopy
O. L. Anderson, 1965, Physical Acoustics
A. F. Andreev, 1963, Sov. Phys. JETP, 16, 1084
R. E. Petersen, 1973, J. Low Temp. Phys., 11, 639, 10.1007/BF00654451 · DOI
H. Kinder, Phonons Scattering in Condensed Matter VII
1993, J. Phys: Condens. Matter, 5, 2063

Sorted by citations

Items 501–600 of 646

Temperature‐dependent heat transfer deterioration in ordered graphene/ceramic composites
Zhang, B., Zhou, X., Zhang, Z., Rui, S., Wang, J., & Zhang, W. (2024) · Journal of the American Ceramic Society · doi:10.1111/jace.20253 · Cited by 4
Two-dimensional ice affects thermal transport at the graphene–water microscopic interface
Yu, Y., Xu, X., Li, S., Zhang, Y., Zhao, J., & Wei, N. (2024) · Journal of Applied Physics · doi:10.1063/5.0232824 · Cited by 4
Stimulated pH‐Dependence Phosphorus Platinum–Nickel Alloy Cluster as Hydrogen Generation Electrocatalyst in Alkaline Solution
Bi, S., Xu, H. Y., Xue, M., Jin, L., Geng, Z., & Zhang, C. (2022) · Energy Technology · doi:10.1002/ente.202200380 · Cited by 4
Characterization Methods of Heat Flows in Solids
O. Ye. Pogorelov, O. V. F. (2023) · Progress in Physics of Metals · doi:10.15407/ufm.24.02.239 · Cited by 4
Scanning thermal microscopy—a tool for thermal measurement in the nanoscale
Bodzenta, J. (2019) · Frontiers of nanoscience · doi:10.1016/b978-0-08-102572-7.00007-6 · Cited by 4
Scanning tunneling microscope-quartz crystal microbalance study of temperature gradients at an asperity contact
Pan, L., & Krim, J. (2013) · Review of Scientific Instruments · doi:10.1063/1.4767239 · Cited by 4
Laser-irradiation-induced temperature jump at interfaces: Evidence for the Kapitza effect in molecular-dynamics simulation
Urbassek, H. M., Gu, X., & Rethfeld, B. (2006) · Computational Materials Science · doi:10.1016/j.commatsci.2006.01.006 · Cited by 4
Nanoscale Thermal Transport at Solid -Liquid Interfaces
Ge, Z. (2006) · Cited by 4
Unraveling thickness-dependent spin relaxation in colossal magnetoresistance manganite films
Sheu, Y., Trugman, S. A., Chen, A., Jia, Q. X., Taylor, A. J., & Prasankumar, R. P. (2018) · Applied Physics Letters · doi:10.1063/1.5013258 · Cited by 4
Predicting the interfacial thermal resistance of electronic packaging materials via machine learning
Wang, N., Jieensi, J., Zhen, Z., Zhou, Y., & Ju, S. (2022) · International Conference on Electronic Packaging Technology (ICEPT) · doi:10.1109/icept56209.2022.9872718 · Cited by 4
Comment on “Transition from Thermal to Athermal Friction under Cryogenic Conditions”
Dunckle, C. G., & Taborek, P. (2010) · Physical Review Letters · doi:10.1103/physrevlett.105.229601 · Cited by 4
Thermal interface conductance between aluminum and aluminum oxide: A rigorous test of atomistic level theoriesPreprint
Muraleedharan, M. G., Gordiz, K., Ju, S., Shiomi, J., Yang, V., & Henry, A. S. (2018) · arXiv (Cornell University) · doi:10.48550/arxiv.1807.06631 · Cited by 4
Plasticity tuning of thermal conductivity between nanoparticles
Mora-Barzaga, G., Miranda, E. N., & Bringa, E. M. (2024) · Journal of Applied Physics · doi:10.1063/5.0225591 · Cited by 3
Effect of surface wettability on thermal conductance of Cu-water interface: A molecular dynamics study
Li, Y., Ma, M., Zhang, X., Chen, L., Wang, H., & Chen, R. (2025) · Chemical Physics Impact · doi:10.1016/j.chphi.2025.100951 · Cited by 3
Time-Resolved Structural Measurement of Thermal Resistance across a Buried Semiconductor Heterostructure Interface
Lee, J., Jo, W., Kwon, J., Griffin, B., Cho, B.-G., Landahl, E. C., & Lee, S. (2023) · Materials · doi:10.3390/ma16237450 · Cited by 3
Surface reconstruction enhanced interfacial thermal conductance between CsPbI 3 and graphene
Zhao, X. L., Cui, C.-X., & Jiang, J.-W. (2024) · International Journal of Thermal Sciences · doi:10.1016/j.ijthermalsci.2024.109580 · Cited by 3
Evaluation of thermal parameters of layers and interfaces in silicon-on-diamond structures by a photothermal method
Klokov, A. Y., Aminev, D. F., Sharkov, A. I., Galkina, T. I., & Ralchenko, V. (2010) · Journal of Physics Conference Series · doi:10.1088/1742-6596/214/1/012108 · Cited by 3
Computer simulation of heat transfer in zone plate optics exposed to x-ray FEL radiation
Nilsson, D., Holmberg, A., Sinn, H., & Vogt, U. (2011) · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · doi:10.1117/12.887566 · Cited by 3
Kapitza resistance between electron and phonon gases in the 1D case
Reich, K. V. (2012) · Progress of Theoretical and Experimental Physics · doi:10.1093/ptep/pts054 · Cited by 3
Phononic thermal resistance due to a finite periodic array of nano-scatterers
Nghiêm, T. T. T., & Chapuis, P. (2016) · Journal of Applied Physics · doi:10.1063/1.4959803 · Cited by 3
Upper bounds in electrocaloric cooling
Suchaneck, G. (2016) · IEEE International Symposium on Applications of Ferroelectrics (ISAF) · doi:10.1109/isaf.2016.7578104 · Cited by 3
Progress in measuring, modeling, and manipulating thermal boundary conductance
Norris, P. M., Larkin, L. S., Le, N. Q., Polanco, C. A., Smoyer, J. L., & Zhang, J. (2021) · Advances in heat transfer · doi:10.1016/bs.aiht.2021.07.001 · Cited by 4
Low-temperature nanoscale heat transport in a gadolinium iron garnet heterostructure probed by ultrafast x-ray diffraction
Gyan, D. S., Mannix, D., Carbone, D., Sumpter, J. L., Geprägs, S., Dietlein, M., Groß, R., Jurgilaitis, A., Pham, V., Coudert-Alteirac, H., et al. (2022) · Structural Dynamics · doi:10.1063/4.0000154 · Cited by 3
Modulated heat conduction in a two-layer dielectric system with dynamical interface thermal resistance
Alaili, K., Ordoñez-Miranda, J., & Ezzahri, Y. (2018) · Journal of Applied Physics · doi:10.1063/1.5058747 · Cited by 3
Solid–gas interface thermal conductance for the thermal barrier coating with surface roughness: The confinement effect
Zhao, X. L., & Jiang, J.-W. (2022) · Chinese Physics B · doi:10.1088/1674-1056/ac9041 · Cited by 3
Parametric study of thermal interface resistance using laser-based thermal wave imaging
Hurley, D. H., & Fig, M. K. (2008) · Journal of Applied Physics · doi:10.1063/1.3033163 · Cited by 3
Prediction and Measurement of Thermal Transport Across Interfaces Between Isotropic Solids and Graphitic Materials
Norris, P. M., Smoyer, J. L., Duda, J. C., & Hopkins, P. E. (2010) · ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2012 Heat Transfer Summer Conference and the ASME 2012 Fluids Engineering Division Summer Meeting · doi:10.1115/fedsm-icnmm2010-30171 · Cited by 3
Laser-pulse technique for measuring the thermal diffusivity of substrate-supported polymer films
Hobbie, E. K., & Reggi, A. S. D. (1999) · Review of Scientific Instruments · doi:10.1063/1.1150079 · Cited by 3
Dependence of Thermal Boundary Conductance on Interfacial Mixing at the Chromium-Silicon Interface
Hopkins, P. E., Salaway, R. N., Stevens, R. J., & Norris, P. M. (2006) · doi:10.1115/imece2006-15288 · Cited by 3
Thermal Conductivity
(2011) · doi:10.1002/9781118084380.ch7 · Cited by 3
THERMAL TRANSPORT IN INDIVIDUAL NANOWIRES OF FINE STRUCTURES
Zhang, Q. (2017) · doi:10.13140/rg.2.2.34172.85123 · Cited by 3
Nanobubble-induced significant reduction of the interfacial thermal conductance for few-layer graphene
Qu, Z.-X., & Jiang, J.-W. (2023) · Physical Chemistry Chemical Physics · doi:10.1039/d3cp04085b · Cited by 2
First-principles calculations of thermal transport at metal/silicon interfaces: Evidence of interfacial electron-phonon coupling
Féliciano, M. D. S., Adessi, C., Hajj, J. E., Horny, N., Detcheverry, F., Cobián, M., & Mérabia, S. (2025) · Physical review. B./Physical review. B · doi:10.1103/94kx-5l8h · Cited by 2
High thermal conductivity electroplating-assisted stitched large-area diamond substrates for high performance electronic devices
Zhang, X., Li, K., Xu, N., Wu, Y. Y.-C., Zhong, Y., Lin, W., Xu, R., Liang, D., & Yu, D. (2026) · Diamond and Related Materials · doi:10.1016/j.diamond.2026.113326 · Cited by 2
Interfacial Engineering toward Ultralow Thermal Boundary Resistance at Metal–Semiconductor Contacts
Cai, Z., Sang, L., Luan, T., Fang, Y., Li, Y., Sumiya, M., Zhang, L., Cao, K., & Shen, B. (2026) · Nano Letters · doi:10.1021/acs.nanolett.5c05501 · Cited by 2
Using Amorphous CoB Alloy as Transducer to Detect Acoustic Propagation and Heat Transport at Interface
Jian, L., & Choi, G. (2021) · Applied Sciences · doi:10.3390/app11115155 · Cited by 2
Nanoscale Energy Transport Dynamics across Nonbonded Solid–Molecule Interfaces and in Molecular Thin Films
He, X., & Yang, D. (2023) · The Journal of Physical Chemistry Letters · doi:10.1021/acs.jpclett.3c02673 · Cited by 2
Strain engineering for the interfacial thermal resistance of few-layer graphene with porous defects
Zhang, B., Xue, Y., & Jiang, J.-W. (2024) · Journal of Applied Physics · doi:10.1063/5.0232097 · Cited by 2
Interface Thermal Conductance of Nonequilibrium Thermal Transport across Nanoscale Metal Multilayers
Li, D., Zhang, Z., Wang, Z., Li, G., Zhou, J., Zhu, J., & Tang, D. (2025) · Advanced Devices & Instrumentation · doi:10.34133/adi.0104 · Cited by 2
Thermal properties of metallic films
Schelling, P. K. (2014) · Elsevier eBooks · doi:10.1533/9780857096296.2.590 · Cited by 2
Thermal conductivity changes upon neutron transmutation of 10B doped diamond
Jagannadham, K., VERGHESE, K., & Butler, J. E. (2014) · Journal of Applied Physics · doi:10.1063/1.4892888 · Cited by 2
Requirements to (Ba,Ca)(Zr,Ti)O3 electrocaloric materials
Suchaneck, G., & Gerlach, G. (2013) · IEEE International Symposium on Applications of Ferroelectrics (ISAF) · doi:10.1109/isaf.2013.6748680 · Cited by 2
Investigation of the thermal properties of thin solid materials at different temperature levels using a set of microresistors
Assy, A., Gomès, S., Chantrenne, P., Pavy, N., Parasuraman, J., Kléber, X., & Basset, P. (2013) · Microelectronics Journal · doi:10.1016/j.mejo.2013.08.006 · Cited by 2
The Effect of Interstitial Layers on Thermal Boundary Conductance Between Lennard-Jones Crystals
English, T. S., Duda, J. C., Jordan, D. A., Norris, P. M., & Zhigilei, L. V. (2010) · International Heat Transfer Conference (IHTC) · doi:10.1115/ihtc14-22953 · Cited by 2
Thermal transmission at Si/Ge interface:ab initiolattice dynamics calculation
Alkurdi, A., & Mérabia, S. (2017) · Journal of Physics Conference Series · doi:10.1088/1742-6596/785/1/012001 · Cited by 2
Interface Density Effects on Cross-Plane Thermal Conductance of Nanolaminate Thin Films
Wilson, A. A., Warzoha, R. J., Sharar, D. J., & Smith, A. N. (2020) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm45881.2020.9190379 · Cited by 2
Thermophysical Properties of Lanthanum–Gadolinium Zirconate and Gadolinia‐Stabilized Zirconia Nanocomposite from In Situ Reaction
Liu, S., Zhao, L., & Jiang, K. (2014) · Advanced Engineering Materials · doi:10.1002/adem.201400164 · Cited by 2
Balance thermal conductivity and thermal expansion in RGO/Cu composites through alignment engineering
Liu, Y., Liu, Y., Li, X., Zhou, T., & Yang, X. (2019) · Materials Research Express · doi:10.1088/2053-1591/ab30b3 · Cited by 2
Field emission from carbon nanostructures: models and experiment
Eidelman, E. D., & Arkhipov, A. V. (2019) · Uspekhi Fizicheskih Nauk · doi:10.3367/ufnr.2019.06.038576 · Cited by 2
Experimental investigations of solid-solid thermal interface conductance
Collins, K. C. (2010) · DSpace@MIT (Massachusetts Institute of Technology) · Cited by 2
Minimizing thermal conductivity in laser deposited multilayers
Döring, F. (2017) · eDiss (Georg-August-Universität Göttingen) · doi:10.53846/goediss-6093 · Cited by 2
Specular Acoustic Vibrational Wave Transmissions with the Presence of Phononic Bandgaps
Cho, H. J., Wu, Y., Qi, J., Kim, Y., Ohta, H., & Matsuda, O. (2021) · Journal of the Physical Society of Japan · doi:10.7566/jpsj.91.014601 · Cited by 1
Electronic Kapitza conductance and related kinetic coefficients at an interface between n-type semiconductors
Meilakhs, A. (2023) · Journal of Physics Condensed Matter · doi:10.1088/1361-648x/ad0014 · Cited by 1
Dynamic control of electron correlations in photodoped charge-transfer insulators
Rossi, T., Tancogne-Dejean, N., Oppermann, M., Porer, M., Magrez, A., Chopdekar, R. V., Takamura, Y., Staub, U., van der Veen, R. M., Rubio, Á., et al. (2025) · Science Advances · doi:10.1126/sciadv.adx5676 · Cited by 1
Numerical study of macroscopic thermal diodes: Influence of interface topography and contact resistance
Vozel, K., & Kitanovski, A. (2025) · iScience · doi:10.1016/j.isci.2025.113724 · Cited by 1
Nonequilibrium thermal transport across metal-Si interfaces from Boltzmann transport theory
Han, J., & Lee, S. (2025) · Physical review. B./Physical review. B · doi:10.1103/fndt-fln1 · Cited by 1
Thermal transport mechanisms and interfacial thermal bridging in low-carbon-black POM/CaCO3 hybrid nanocomposites: Experimental and finite-element investigation
Aljabr, A. (2026) · International Journal of Thermal Sciences · doi:10.1016/j.ijthermalsci.2026.111134 · Cited by 1
Effect of phase formation in the Mo-Ni system on the rate of change of the thermal conductivity of the interface
Бондаренко, Г. Г., & Yakunkin, M. M. (2010) · Russian Metallurgy (Metally) · doi:10.1134/s0036029510090156 · Cited by 1
Thermal Conductivity and Interfacial Thermal Barrier Resistance of the Particle Reinforced Metal Matrix Composites
Zhang, Y., Zhuo-shen, S., & Tong, Z. (2007) · International Conference on Electronic Packaging Technology (ICEPT) · doi:10.1109/icept.2007.4441445 · Cited by 1
Nanoscale Heat Transport through Epitaxial Ultrathin Hetero Films: Bi(111)/Si(001) and Bi(111)/Si(111)
Hanisch-Blicharski, A., Wall, S., Kalus, A., Frigge, T., & von Hoegen, M. H. (2012) · MRS Proceedings · doi:10.1557/opl.2012.472 · Cited by 1
Nanoscale phonon drag as a part of low-field electron emission mechanism for nanocarbons
Arkhipov, A. V., Гарифович, Г. П., Квашенкина, О. Е., & Osipov, V. S. (2017) · International Vacuum Nanoelectronics Conference · doi:10.1109/ivnc.2017.8051538 · Cited by 1
Thermal Conductivities of Organic Semiconductors
Yao, Y. (2017) · UKnowledge (University of Kentucky) · doi:10.13023/etd.2017.337 · Cited by 1
Lattice Thermal Boundary Resistance
Antidormi, A., & Colombo, L. (2018) · Springer eBooks · doi:10.1007/978-3-319-50257-1_15-1 · Cited by 1
Molecular Dynamics Simulation on the Thermal Boundary Resistance of a Thin-film and Experimental Validation
Suk, M. E., & Kim, Y. Y. (2019) · Journal of the Computational Structural Engineering Institute of Korea · doi:10.7734/coseik.2019.32.2.103 · Cited by 1
Non/Loosely Contacting NDE Techniques
David, J., & Cheeke, N. (2012) · CRC Press eBooks · doi:10.1201/b12260-20 · Cited by 1
Double-humped phonon resonance in doubly resonant vibration systems: Phonon metamaterials analogy with doubly resonant electromagnetic structures
Potyomina, L. G. (2020) · Physical review. B./Physical review. B · doi:10.1103/physrevb.102.174315 · Cited by 1
Lattice thermal conductivity in isotope diamond asymmetric superlattices
Weng, H. K., Nagakubo, A., Watanabe, H., & Ogi, H. (2021) · Japanese Journal of Applied Physics · doi:10.35848/1347-4065/ac4304 · Cited by 1
Fundamental understanding of thermal transport across solid interfaces
Cheng, Z., Shi, J., & Graham, S. L. (2022) · Elsevier eBooks · doi:10.1016/b978-0-12-821084-0.00005-6 · Cited by 1
An efficient solution procedure for simulating phonon transport in multiscale multimaterial systems
Loy, J. M. (2013) · Texas ScholarWorks (Texas Digital Library) · Cited by 1
Pressure dependence of the thermal contact resistance at the Si/He interface
Ramière, A., Amrit, J., & Volz, S. G. (2012) · Journal of Physics Conference Series · doi:10.1088/1742-6596/395/1/012110 · Cited by 1
Heat resistance of the interface in the silicon-on-diamond structure at a temperature of 80 K
Aminev, D. F., Klokov, A. Y., Galkina, T. I., Sharkov, A. I., & Ralchenko, V. (2010) · Bulletin of the Lebedev Physics Institute · doi:10.3103/s1068335610050076 · Cited by 1
Contributions of Anharmonic Phonon Interactions to Thermal Boundary Conductance
Hopkins, P. E., Duda, J. C., & Norris, P. M. (2011) · ASME/JSME Thermal Engineering Joint Conference (AJTEC) · doi:10.1115/ajtec2011-44135 · Cited by 1
Thermal Boundary Conductance Between Thin Metal Films and Graphite Substrates
Smoyer, J. L., Duda, J. C., Norris, P. M., & Lichtenberger, A. W. (2011) · ASME/JSME Thermal Engineering Joint Conference (AJTEC) · doi:10.1115/ajtec2011-44333 · Cited by 1
Diffusion of Overheated and Overcooled Particles as a Mechanism of Thermal Conductivity in Nanofluids
Meilakhs, A., & Aleksenskii, A. E. (2020) · Journal of Experimental and Theoretical Physics Letters · doi:10.1134/s0021364020060065 · Cited by 1
Size effect of the heat transfer in palladium-based metallic glass nanofilms
Shan, Z.-Y., Xian, H., Jia, L., Ma, W., Zhang, H., Zhang, X., & Wang, W. (2021) · Journal of Alloys and Compounds · doi:10.1016/j.jallcom.2021.160748 · Cited by 1
Thermoelectric Spin-Transfer Torque MRAM with Sub-Nanosecond Bi-Directional Writing using Magnonic CurrentPreprint
Mojumder, N. N., Roy, K., & Abraham, D. W. (2011) · arXiv (Cornell University) · doi:10.48550/arxiv.1108.2386 · Cited by 1
Thermal model for the bolometric response of high- superconducting films to chopped optical radiation
Genchev, Z. D., Chakalov, R. A., Chern, J. D., & Dew-Hughes, D. (1996) · Superconductor Science and Technology · doi:10.1088/0953-2048/9/7/003 · Cited by 1
Ultrafast nonlinear optics of bulk and two-dimensional materials for infrared applications
Demetriou, G. (2016) · Cited by 1
Spektrale Kontrolle von elastischer Dynamik und Wärmetransport in periodischen Nanostrukturen
Meyer, D. (2021) · doi:10.53846/goediss-8969 · Cited by 1
Control of oligonucleotide conformation on nanoparticle surfaces for nanoscale heat transfer study
Park, S. (2004) · DSpace@MIT (Massachusetts Institute of Technology)
Optical Methods for the Measurement of Thermal Conductivity
Bandaru, P. R., & Aubain, M. S. (2013) · doi:10.1002/9781118436707.hmse036
Electro-Thermal Transport in Nanotube Based Composites for Macroelectronic Applications
Kumar, S. (2007) · Purdue e-Pubs (Purdue University System)
Nanoscale transport phenomena at the interface of hard and soft matter
Majumdar, A. (2003) · DSpace@MIT (Massachusetts Institute of Technology)
Thermal Transport through Solid-Solid Interface with an Interlayer
Liu, Y. D., Bi, K. D., Chen, Y. F., & Chen, M. (2011) · Key engineering materials · doi:10.4028/www.scientific.net/kem.483.750
Fluctuation subharmonic and multiharmonic phonon transmission and Kapitza conductance between solids with very different vibrational spectra
Kosevich, Y. A. (1996) · Czechoslovak Journal of Physics · doi:10.1007/bf02570347
Analytical insights into thermophysical properties of nanomaterials
Chou, R.-H., & Pan, C. (2014) · The European Physical Journal Applied Physics · doi:10.1051/epjap/2013130031
Transient Cooling of Ultrathin Epitaxial Bi(111)-Films on Si(111) Upon Femtosecond Laser Excitation Studied by Ultrafast Reflection High Energy Electron Diffraction
Hanisch-Blicharski, A., Krenzer, B., Möllenbeck, S., Ligges, M., Zhou, P., Kammler, M., & Hoegen, M. H. (2009) · MRS Proceedings · doi:10.1557/proc-1172-t04-08
Picosecond Ultrasonics Studies of the Effect of Ion Implantation on InterfAcial Bonding Between a thin Film and a Substrate
Tas, G., Loomis, J. J., Maris, H. J., Bailes, A. A., & Seiberling, L. E. (1997) · MRS Proceedings · doi:10.1557/proc-505-369
Self-citation
Influence of Interfacial Mixing on Thermal Boundary Conductance Across a Chromium/Silicon
Hopkins, P. E., Norris, P. M., Stevens, R., Beechem, T. E., & Graham, S. L. (2010)
Heat Generation and Transport in Nanometer-Scale Transistors Heat problems in ever-smaller integrated circuits include hot-spots at transistor drain areas, reduced heat conduction in new devices and higher thermal resistance at material boundaries.
Pop, E., Sinha, S., & Goodson, K. E. (2006)
WYTWARZANIE I PROPAGACJA FAL AKUSTYCZNYCH O WYSOKICH CZ ĘSTOTLIWO ŚCIACH W NANOWARSTWACH METALICZNYCH
Aleksiejczuk, M. (2007)
Experimental Investigation of Metal-Diamond Thermal Interface Conductance With Different Diamond Surface Terminations
Collins, K. C., & Chen, G. (2010) · International Heat Transfer Conference (IHTC) · doi:10.1115/ihtc14-23357
Experimental Determination of the Relationship Between Thermal Boundary Resistance and Non-Abrupt Interfaces and Electron-Phonon Coupling
Stevens, R. J., Norris, P. M., & Lichtenberger, A. W. (2004) · Education and New Developments 2022 – Volume I · doi:10.1115/ht-fed2004-56556
Interfacial electron and phonon scattering processes in high-powered nanoscale applications.
Hopkins, P. E. (2011) · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · doi:10.2172/1029772
High Throughput Assessment of Multicomponent Alloy Materials
Yu, X. (2018) · KiltHub Repository · doi:10.1184/r1/6719828
Effect of the Temperature Dependence of Transmissivity on the Thermal Boundary Conductance Between Two Dissimilar Solids
Huang, M. (2018) · Journal of Electronic Materials · doi:10.1007/s11664-018-6589-7
Morphologic observations of human T and B lymphocytes by scanning electron microscopy.
Yamamoto, I. (1974) · PubMed · doi:10.18926/amo/32695
Engineering Interfaces at the Nanoscale
Norris, P. M., & Larkin, L. S. (2019) · Women in engineering and science · doi:10.1007/978-3-030-19951-7_8
Ultrafast Energy Flow and Structural Changes in Nanoscale Heterostructures
Vasileiadis, T. (2019) · doi:10.17169/refubium-3932
Nonequilibrium Energy Transfer in Nanostructures
Zhang, Z. M. (2020) · Mechanical engineering series · doi:10.1007/978-3-030-45039-7_7

Authors: Stoner, R. J., & Maris, H. J.
Affiliations: Brown University (US)
ORCID: Stoner, R. J.
Maris, H. J.
Venue: Physical Review B
Publisher: American Physical Society (APS)
Published: 1993-12-01
Volume: 48
Issue: 22
Pages: 16373-16387
ISSN: 0163-1829 (ISSN-L)
1095-3795
DOI: 10.1103/physrevb.48.16373
OpenAlex: W2091830839
Cited by: 646
References: 39
Citations by year: 2026: 18 · 2025: 18 · 2024: 19 · 2023: 28 · 2022: 28 · 2021: 26 · 2020: 30 · 2019: 37 · 2018: 26 · 2017: 32 · 2016: 28 · 2015: 33 · 2014: 26 · 2013: 23 · 2012: 34
FWCI: 3.21
Type: journal article
Language: en
Open access: closed
Licence: link.aps.org/licenses/aps-default-license (vor)
Locations: Physical review. B, Condensed matter (publishedVersion)
PubMed (publishedVersion)
Funders: U.S. Department of Energy (FG0286ER45267)
Topics: Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
Physical Sciences › Engineering › Mechanics of Materials › Thermoelastic and Magnetoelastic Phenomena
Physical Sciences › Physics and Astronomy › Condensed Matter Physics › Advanced Condensed Matter Physics
Keywords: Kapitza conductance, metal-dielectric interface, Debye temperature, lattice dynamics, lead, gold, aluminum, titanium, barium fluoride, sapphire, diamond

About these checks

Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

Statistics and arithmetic are recomputed, not judged.

Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.

What counts as a claim ›How we measure confidence ›How we check this ›

Are you an author, or do you see a problem with this page? Request a review

Kapitza conductance and heat flow between solids at temperatures from 50 to 300 K

Abstract

Overview

Integrity signals

Verification

Claims the paper makes

Claims other papers make about this one

Citations

Cites

Cited by

Related

Metadata

Record

About these checks