Cited by 410Thermal properties of materials3D IC and TSV technologiesThermoelastic and Magnetoelastic Phenomena

Thermal resistance at interfaces

Swartz, E. T., Pohl, R. O.·1987·Applied Physics Letters

Abstract

We report measurements of the solid-solid thermal boundary resistance Rbd, spanning the temperature range from 1 to 300 K. Below 30 K, Rbd is found to be in agreement with the prediction of the acoustic mismatch model. The influence of diffuse scattering at the interface is found to have a very minor influence on Rbd. Above 30 K, Rbd decreases less rapidly with increasing temperature than predicted by the theory. Phonon scattering in thin (∼30 Å) disordered layers near the interface is shown to be a possible explanation. Implications for heat removal from integrated circuits are discussed.

Integrity signals

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Crossref · 10.1063/1.98939

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6 of 6 references verified0 citation errors · 0 not checkable

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  • The thermal boundary resistance between evaporated metal films and dielectric crystals above 50 K is reproducible and small, equivalent to the bulk thermal resistance of an a-SiO2 layer only 20 Å thick.

    “He found that the boundary resistance above 50 K was reproducible and small—equivalent to the bulk thermal resistance of an a-SiO₂ layer only 20 Å thick.”

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Authors
Swartz, E. T., & Pohl, R. O.
Affiliations
Cornell University (US)
Venue
Applied Physics Letters
Published
1987-12-28
Volume
51
Issue
26
Pages
2200-2202
ISSN
  • 0003-6951 (ISSN-L)
  • 1077-3118
OpenAlex
W2018240900
Cited by
410
References
6
Citations by year
2026: 16 · 2025: 14 · 2024: 20 · 2023: 13 · 2022: 20 · 2021: 21 · 2020: 20 · 2019: 19 · 2018: 15 · 2017: 18 · 2016: 14 · 2015: 13 · 2014: 14 · 2013: 12 · 2012: 10
FWCI
5.13
Type
journal article
Language
en
Open access
closed
Locations
Applied Physics Letters (publishedVersion)
Topics
  • Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
  • Physical Sciences › Engineering › Mechanics of Materials › Thermoelastic and Magnetoelastic Phenomena
Keywords
interfacial thermal resistance, solid-solid interfaces, low-temperature thermal transport, acoustic mismatch model, diffuse scattering, phonon scattering

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