Thermal interfacial transport in the presence of ballistic heat modes
Open accessAbstract
Thermal interface (Kapitza) resistance expresses how hard it is for heat to flow across material junctions inside multilayer structures. This quantity plays a crucial role in the thermal performance of nanoscale devices but is still poorly understood. Here we show that conventional Fourier-based metrology overestimates metal/semiconductor resistances by up to threefold due to misinterpretation of ballistic heat flow modes. We achieve improved identification and a different physical insight with a truncated L\'evy formalism. This approach properly distinguishes interfacial dynamics from nearby quasiballistic heat flow suppression in the semiconductor. Unlike conventionally extracted values, interface resistances obtained with our new approach are independent of laser modulation frequency, as physically appropriate, and much more closely approach theoretical predictions.
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The majority of experimental work in the literature deduced thermal properties based on Fourier's law of heat conduction with an effective thermal conductivity.
“Similarly, while TDTR can be used to study non-equilibrium phenomena such as quasi-ballistic phonon transport 90, 91, 109-111 and electronphonon coupling 55 due to its ability to detect temperature evolutions at micrometer-scale and picosecond-scale resolutions, the majority of the experimental work in the literature deduced thermal properties based on Fourier's”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [109]
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References 21 · Cited by 22
Research works printed but not linked: 19
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- Authors
- Vermeersch, B., Mohammed, A. M. S., Pernot, G., Koh, Y. R., & Shakouri, A.
- Affiliations
- Purdue University West Lafayette (US)
- Laboratoire Ondes et Matière d'Aquitaine (FR)
- Venue
- Physical Review B
- Publisher
- American Physical Society (APS)
- Published
- 2014-07-25
- Volume
- 90
- Issue
- 1
- Pages
- 014306
- ISSN
- 1098-0121 (ISSN-L)
- 1550-235X
- OpenAlex
- W1997225822
- Cited by
- 22
- References
- 21
- Citations by year
- 2024: 2 · 2022: 3 · 2021: 1 · 2019: 1 · 2018: 6 · 2017: 2 · 2016: 3 · 2015: 4
- FWCI
- 1.36
- Type
- journal article
- Language
- en
- Open access
- bronze
- doi.org
- Locations
- Physical Review B (publishedVersion)
- Purdue e-Pubs (Purdue University System) (submittedVersion)
- HAL (submittedVersion, other-oa)
- Oskar-Bordeaux (Universite de Bordeaux) (submittedVersion)
- Funders
- U.S. Department of Energy (DE-SC0001009)
- Defense Advanced Research Projects Agency (W911NF0810347)
- Air Force Office of Scientific Research (FA9550-08-1-0340)
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Mechanics of Materials › Thermoelastic and Magnetoelastic Phenomena
- Physical Sciences › Engineering › Computational Mechanics › Heat Transfer and Numerical Methods
- Keywords
- interfacial thermal resistance, metal-semiconductor interface, truncated Lévy distribution, nanoscale thermal management, multilayer structures
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