The DOI matches its Crossref record; 7 of the 7 references it cites were found in a registry or an index.
Electronic part life cycle concepts and obsolescence forecasting
Abstract
Obsolescence of electronic parts is a major contributor to the life cycle cost of long-field life systems such as avionics. A methodology to forecast life cycles of electronic parts is presented, in which both years to obsolescence and life cycle stages are predicted. The methodology embeds both market and technology factors based on the dynamic assessment of sales data. The predictions enabled from the models developed in this paper allow engineers to effectively manage the introduction and on-going use of long field-life products based on the projected life cycle of the parts incorporated into the products. Application of the methodology to integrated circuits is discussed and obsolescence predictions for dynamic random access memories (DRAMs) are demonstrated. The goal is to significantly reduce design iterations, inventory expenses, sustainment costs, and overall life cycle product costs.
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In the citing paper
“The premature aging process through calculating and planning when various circuit-breakers in the product shall fail, reliably renders the product useless or less useful after a certain predetermined date, even if often only one aspect or component of the product truly breaks (Solomon et al., 2000).”
From Designed to break: planned obsolescence as corporate environmental crime (2022) · cites this paper as Solomon et al., 2000
In the citing paper
“For many products, the availability of parts is limited in time or so expensive that repairs are not cost-effective (Solomon et al., 2000).”
From Designed to break: planned obsolescence as corporate environmental crime (2022) · cites this paper as Solomon et al., 2000
Citations
Cites
EXPLOIT THE PRODUCT LIFE CYCLE
Levitt, T. (1965) · Cited by 772
Stogdill, R. C. (1999) · IEEE Design & Test of Computers · doi:10.1109/54.765200 · Cited by 62
PECHT, M. G., & Das, D. (2000) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/6144.833060 · Cited by 41
Self-citationStatus : a report on the integrated circuit industry
Strauss, W. I., McClean, W. J., & Pitcher, H. I. (1984) · Medical Entomology and Zoology · Cited by 36
Uprating electronic components for use outside their temperature specification limits
Wright, M. B. S. O., Humphrey, D., & McCluskey, F. P. (1997) · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · doi:10.1109/95.588581 · Cited by 27
A risk-informed methodology for parts selection and management
Jackson, M. M., Sandborn, P. A., PECHT, M. G., Hemens‐Davis, C., & Audette, P. (1999) · Quality and Reliability Engineering International · doi:10.1002/(sici)1099-1638(199907/08)15:4 · Cited by 21
Self-citationWhy a new parts selection and management program?
Foucher, B., Kennedy, R., Kelkar, N., Ranade, Y., Govind, A., Blake, W., Mathur, A., & Solomon, R. (1998) · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · doi:10.1109/95.705487 · Cited by 20
Self-citation
Research works printed but not linked: 5
- texas instruments, 1999, 1999 Standard linear and logic product withdrawal device list
- national semiconductor, 2000, Product Folder LF11331
- sherwood, 2000, Product life cycle (PLC) code definitions and applications
- 1997, Product Life Cycle Data Model
- bumbalough, 1999, usaf manufacturing technology's initiative on electronics parts obsolescence management, Proc 44th Int SAMPE Symp, 2044
Cited by
Sorted by citations
Bauer, M., Glenn, T., Geddes, J., Gitlin, M., Grof, P., Kessing, L. V., Monteith, S., Faurholt-Jepsen, M., Severus, E., & Whybrow, P. C. (2020) · International Journal of Bipolar Disorders · doi:10.1186/s40345-019-0164-x · Cited by 163
Obsolescence Driven Design Refresh Planning for Sustainment-Dominated Systems
Singh, P., & Sandborn, P. A. (2006) · The Engineering Economist · doi:10.1080/00137910600695643 · Cited by 123
Self-citationDekker, R., Pinçe, Ç., Zuidwijk, R. A., & Jalil, M. N. (2012) · International Journal of Production Economics · doi:10.1016/j.ijpe.2011.11.025 · Cited by 110
Spare Parts Inventory Management: A Literature Review
Zhang, S., Huang, K., & Yuan, Y. (2021) · Sustainability · doi:10.3390/su13052460 · Cited by 136
Obsolescence management for long-life contracts: state of the art and future trends
Rojo, F. J. R., Roy, R., & Shehab, E. (2009) · The International Journal of Advanced Manufacturing Technology · doi:10.1007/s00170-009-2471-3 · Cited by 100
Metadata
- Authors
- Pecht, M. G., Sandborn, P. A., & Solomon, R.
- Affiliations
- University of Maryland, College Park (US)
- Venue
- IEEE Transactions on Components and Packaging Technologies
- Published
- 2000
- Volume
- 23
- Issue
- 4
- Pages
- 707-717
- ISSN
- 1521-3331 (ISSN-L)
- OpenAlex
- W2119785455
- Cited by
- 194
- References
- 7
- Citations by year
- 2026: 6 · 2025: 7 · 2024: 4 · 2023: 2 · 2022: 10 · 2021: 19 · 2020: 5 · 2019: 14 · 2018: 9 · 2017: 9 · 2016: 10 · 2015: 9 · 2014: 11 · 2013: 8 · 2012: 16
- FWCI
- 6.83
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- IEEE Transactions on Components and Packaging Technologies (publishedVersion)
- Topics
- Social Sciences › Business, Management and Accounting › Management of Technology and Innovation › Transportation Systems and Infrastructure
- Social Sciences › Decision Sciences › Management Science and Operations Research › Innovation Diffusion and Forecasting
- Social Sciences › Business, Management and Accounting › Management of Technology and Innovation › Technology Assessment and Management
- Keywords
- life cycle cost, avionics, integrated circuits, dynamic random access memory, DRAM, sales analysis, technology forecasting, inventory management
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