Cited by 79Multilevel Inverters and ConvertersAdvanced DC-DC ConvertersSilicon Carbide Semiconductor Technologies

The DOI matches its Crossref record; 12 of the 12 references it cites were found in a registry or an index.

Power-dense multilevel inverter module using interleaved GaN-based phases for electric aircraft propulsion

Pallo, Nathan, Foulkes, Thomas, Modeer, Tomas, Coday, Samantha, Pilawa-Podgurski, Robert·2018·2018 IEEE Applied Power Electronics Conference and Exposition (APEC)

Abstract

Realizing the electrification of aircraft necessitates the development of inverters and rectifiers with ultra-high efficiency and specific power simultaneously. Unconventional topologies such as the flying capacitor multilevel (FCML) inverter hold great promise for achieving transformational reductions in inverter power loss and weight due to drastically smaller filters and compact hybrid energy transfer mechanism. After describing methods to overcome obstacles in ultra-efficient and lightweight converter design, this work presents an example of interleaved FCML inverter operation. The successful, balanced interleaved operation was demonstrated in the laboratory with a dual-interleaved, 9-level converter prototype at 1 kV input bus voltage and 9.7 kW output power. At 98.6% peak efficiency, this converter achieves a gravimetric power density of 17.3 kW/kg and a volumetric power density of 35.3 kW/L including the contributions of the heat sink. Interestingly, observations from loss modeling and hardware efficiency measurements revealed the large impact of second-order loss mechanisms, such as dynamic on-state resistance and junction temperature. Insights gained from this new understanding can be incorporated into future modeling for more thorough optimization of the converter design.

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Registry

Crossref · 10.1109/apec.2018.8341239

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Citations

Cites

Show all 12 references

Research works printed but not linked: 5

  1. lidow, 2016, eGaN FET Drivers and Layout Considerations
  2. 2017, Henkel Corporation, Gap Pad® 5000S35
  3. pallo, 2017, Electrically thin vertical layout for wide-bandgap designs, 2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)
  4. haran, 2015, High power density superconducting machines, Special Session on Future Electric Aircrafts IEEE Energy Conversion Congress and Exposition (ECCE)
  5. haran, 2015, High speed, high frequency air-core machine and drive, panel session on advanced topics in electrical machines, IEEE PES General Meeting

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Metadata

Authors
Pallo, N., Foulkes, T., Modeer, T., Coday, S., & Pilawa-Podgurski, R.
Affiliations
University of Illinois Urbana-Champaign (US)
Venue
2018 IEEE Applied Power Electronics Conference and Exposition (APEC)
Publisher
IEEE
Published
2018-03
Pages
1656-1661
ISSN
1048-2334 (ISSN-L)
OpenAlex
W2798865274
Cited by
79
References
12
Citations by year
2026: 2 · 2025: 6 · 2024: 9 · 2023: 13 · 2022: 9 · 2021: 12 · 2020: 9 · 2019: 12 · 2018: 7
FWCI
15.95
Type
conference paper
Language
en
Open access
closed
Locations
Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition (publishedVersion)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced DC-DC Converters
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
Keywords
multilevel inverter, flying capacitor inverter, interleaved inverter, GaN power devices, electric aircraft propulsion, power density, inverter efficiency, junction temperature, loss modeling

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