Intermetallic compounds at aluminum-to-copper and copper-to-tin electrical interfaces
Abstract
The effects of intermetallic compounds on the electrical and mechanical properties of bimetallic friction welded Al-Cu joints and tin-plated copper wire conductors are studied. The formation and growth of intermetallic compounds are studied in the temperature range 200-525 degrees C for the Al-Cu system, and 80 degrees -200 degrees C for the Cu-Sn system. The formation and growth of intermetallic phases exert a pronounced effect on the mechanical (microhardness) and electrical integrity of these systems. In the case of aluminum-to-copper bimetallic contacts, the contact resistance increases linearly with the thickness of the intermetallics, while in the tin-plated copper system, the resistance shows a tendency towards stabilization when the thickness of intermetallic phases approaches that of the plating. In the aluminum-to-copper joints, the presence of an electrical field greatly accelerates the kinetics of formation of intermetallic phases and significantly alters their morphology.>
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EDX measurement at position 2 of the interfacial layer gave 21.3 wt.% Al and 78.7 wt.% Cu, suggested to be AlCu δ-phase.
“2 21.3 78.7 Al Cu δ”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [8]
EDX measurement at position 3 of the interfacial layer gave 46.5 wt.% Al and 53.6 wt.% Cu, suggested to be AlCu θ-phase.
“3 46.5 53.6 Al Cu θ”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [8]
Braunovic and Aleksandrov found linear behavior between the decrease in electrical conductivity and an increase in intermetallic phase thickness and attributed the loss of electrical conductivity to an increase in dislocations and crystal defects.
“The investigations of Braunovic and Aleksandrov [8] confirmed these results.They found linear behavior between the decrease in electrical conductivity with an increase in intermetallic phase thickness and attributed the loss of electrical conductivity to an increase in dislocations and crystal defects.”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [8]
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Investigation of corrosion and electrical resistance in laser welded Al-Cu joints for EV batteries
Sinhmar, S., Mandal, S., Yadav, V. K., & Mondal, K. (2024) · Journal of Energy Storage · doi:10.1016/j.est.2024.114436 · Cited by 17 · see citing works
Nolte, N., Lukasczyk, T., & Mayer, B. (2022) · Metals · doi:10.3390/met12081314 · Cited by 5 · see citing works
“The investigations of Braunovic and Aleksandrov [8] confirmed these results.”
BackgroundMethodResultInfluential
- Authors
- Braunovic, M., & Aleksandrov, N.
- Affiliations
- Hydro-Québec (CA)
- Venue
- Electrical Contacts - 1992 Proceedings of the Thirty-Eighth IEEE Holm Conference on Electrical Contacts
- Publisher
- IEEE
- Published
- 1992
- Pages
- 25-34
- OpenAlex
- W1976043477
- Cited by
- 44
- References
- 0
- Citations by year
- 2026: 1 · 2025: 3 · 2024: 5 · 2023: 1 · 2022: 3 · 2021: 3 · 2020: 5 · 2019: 1 · 2017: 3 · 2016: 1 · 2014: 1 · 2013: 3
- FWCI
- 1.75
- Type
- conference paper
- Language
- en
- Open access
- closed
- Locations
- IEEE Holm Conference on Electrical Contacts (HOLM) (publishedVersion)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Mechanical Engineering › Electrical Contact Performance and Analysis
- Keywords
- intermetallic compounds, aluminum-copper joints, contact resistance, microhardness, electric field effects, intermetallic morphology, electrical contacts
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Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
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