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Cited by 92HVDC Systems and Fault ProtectionMultilevel Inverters and ConvertersSilicon Carbide Semiconductor Technologies

The DOI matches its Crossref record.

An enhanced MMC topology with DC fault ride-through capability

Li, Xiaoqian, Liu, Wenhua, Song, Qiang, Rao, Hong, Xu, Shukai·2013·IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society
DOI 10.1109/iecon.2013.6700152
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Abstract

High-voltage direct current system using modular multilevel converter (MMC-HVDC) is a potential candidate for grid integration of renewable energy over long distances. The dc-link fault is an issue MMC-HVDC must deal with. This paper proposed an enhanced MMC topology with dc fault ride-through capability. By using diode clamp sub-modules, the freewheeling effect of diodes is eliminated and fault currents can be very rapidly extinguished. Since the tripping of circuit breakers is avoided, MMC can immediately restart power transmission for non-permanent faults. The required rated voltage of additional semiconductors is half the conventional semiconductors, resulting in low extra cost. Simulation results using PSCAD/EMTDC have verified the validity of the proposed protection scheme.

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Crossref · 10.1109/iecon.2013.6700152

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  • The SCSM defines a family of submodules with bypass clamping diodes that facilitates fault-clearing in MMCs.

    “The single-clamped submodule (SCSM) defines a family of submodules with bypass clamping diodes as shown in Fig. 2(f) that facilitates fault-clearing in MMCs [22], [23]”

    From Modular Multilevel Converters: Recent Achievements and Challenges (2021) · cites this paper as [22]

Citations

Cites

No references could be resolved yet.

Research works printed but not linked: 20

  1. soto-sanchez, 2011, Control of a modular multilevel converter-based HVDC transmission system, Proc Euro Conf Power Electronics Applications, 1
  2. 10.1109/APPEEC.2010.5448698 · DOI
  3. 2013, High Voltage DC Breaker Apparatus
  4. 10.1049/iet-gtd.2010.0587 · DOI
  5. tang, 0, Protection of vsc-multi-terminal hvdc against dc faults, Proc 2002 IEEE 33rd Annual Power Electronics Specialists Conf, 2, 719, 10.1109/PSEC.2002.1022539 · DOI
  6. 10.1109/TPWRD.2007.899276 · DOI
  7. 2011, High-voltage Direct Current (HVDC) Transmission Using Voltage Sourced Converters (VSC)
  8. 10.1109/TPWRD.2011.2115258 · DOI · Paper page
  9. 10.1109/TPWRD.2012.2226249 · DOI
  10. 10.1109/TPWRD.2010.2044813 · DOI
  11. 10.1109/ICPE.2011.5944451 · DOI · Paper page
  12. 10.1109/TPEL.2008.2008441 · DOI
  13. 10.1109/TEC.2006.889624 · DOI
  14. 10.1109/TPEL.2010.2089065 · DOI
  15. 10.1109/TIE.2009.2031187 · DOI
  16. 10.1109/TPWRD.2010.2050787 · DOI
  17. 10.1109/IPEC.2010.5544594 · DOI · Paper page
  18. 10.1109/PTC.2003.1304403 · DOI
  19. 10.1109/TPEL.2009.2014236 · DOI · Paper page
  20. 10.1109/TPEL.2011.2143431 · DOI

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Metadata

Authors
Li, X., Liu, W., Song, Q., Rao, H., & Xu, S.
Affiliations
  • Tsinghua University (CN)
  • China Southern Power Grid (China) (CN)
ORCID
Venue
IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society
Publisher
IEEE
Published
2013-11
Pages
6182-6188
ISSN
1553-572X (ISSN-L)
DOI
10.1109/iecon.2013.6700152
OpenAlex
W2030891049
Cited by
92
References
0
Citations by year
2025: 5 · 2024: 4 · 2023: 5 · 2022: 8 · 2021: 10 · 2020: 7 · 2019: 17 · 2018: 8 · 2017: 10 · 2016: 10 · 2015: 4 · 2014: 4
FWCI
7.31
Type
conference paper
Language
en
Open access
closed
Locations
Annual Conference of the IEEE Industrial Electronics Society (IECON) (publishedVersion)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › HVDC Systems and Fault Protection
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
Keywords
modular multilevel converter, MMC-HVDC, DC fault ride-through, renewable energy integration, HVDC transmission

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