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Cited by 161

The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.

$\hbox{Al}_{2}\hbox{O}_{3}$-Based RRAM Using Atomic Layer Deposition (ALD) With 1-$\mu\hbox{A}$ RESET Current

Wu, Yi, Lee, Byoungil, Wong, H.-S. Philip·2010·IEEE Electron Device Letters

Abstract

Al2O3-based RRAM devices were fabricated using atomic layer deposition under 100°C and 300°C deposition temperatures, respectively, and their resistance-switching behaviors were investigated. Both devices show unipolar switching if the top electrode (TE) is made of Ti/Al, whereas the bipolar phenomenon is observed when TE is pure aluminum. Devices fabricated at higher temperature give better uniformity and higher resistance ratio. Ultralow RESET current (~1 μA) was obtained, together with adequate voltage margin.

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Metadata

Authors
Wu, Y., Lee, B., & Wong, H.-S. P.
Venue
IEEE Electron Device Letters
Published
2010-12
Volume
31
Issue
12
Pages
1449-1451
ISSN
  • 0741-3106 (ISSN-L)
  • 1558-0563
OpenAlex
W2119495176
Cited by
161
References
1
FWCI
13.46
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: $\hbox{Al}_{2}\hbox{O}_{3}$-Based RRAM Using Atomic Layer Deposition (ALD) With 1-$\mu\hbox{A}$ RESET Current. https://app.cochat.ai/papers/10.1109/led.2010.2074177
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Wu, Y., Lee, B., & Wong, H.-S. P. (2010). $\hbox{Al}_{2}\hbox{O}_{3}$-Based RRAM Using Atomic Layer Deposition (ALD) With 1-$\mu\hbox{A}$ RESET Current. IEEE Electron Device Letters. https://doi.org/10.1109/led.2010.2074177

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