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Cited by 6Electronic Packaging and Soldering TechnologiesWelding Techniques and Residual StressesAdvanced Welding Techniques Analysis

Laser Welding for Microelectronic Interconnections

Rischall, H., Shackleton, J.·1964·IEEE Transactions on Component Parts
DOI 10.1109/tcp.1964.1134984
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Abstract

The ability to join dissimilar materials having markedly different thicknesses (ratio of 50:1) is shown to be possible using a LASER. The feasibility of welding to thin films has been demonstrated by metallurgical examination of the welded connection. Welds were evaluated by visual inspection, macrosection, and microsection. Preliminary results of substrate studies indicate that unglazed alumina is a satisfactory material. LASER welding, having been demonstrated as a useful interconnection method, can be developed through additional investigation for extensive application to microelectronic circuitry.

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Crossref · 10.1109/tcp.1964.1134984

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  • Laser welding can be used to weld dissimilar materials with very different thicknesses (ratio 50:1).

    “When thick film rather than thin film is used options could include soldering, which provides reliable results, although it would probably not be suitable for very fine pitches (Schuettler et al. 2008), parallel-gap welding (Schuettler et al. 2008) and laser welding, which can be used to weld dissimilar materials with very different thicknesses (ratio 50:1) (Rischall and Shackleton 1964).”

    From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as Rischall and Shackleton 1964

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References 3 · Cited by 6

Authors
Rischall, H., & Shackleton, J.
Affiliations
Hughes Aircraft (United States) (US)
Venue
IEEE Transactions on Component Parts
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published
1964-06
Volume
11
Issue
2
Pages
145-151
ISSN
0097-6601 (ISSN-L)
DOI
10.1109/tcp.1964.1134984
OpenAlex
W1964548638
Cited by
6
References
3
Citations by year
2022: 1 · 2018: 1 · 2017: 1
FWCI
0.00
Type
journal article
Language
en
Open access
closed
Licence
ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html (vor)
Locations
IEEE Transactions on Component Parts (publishedVersion)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
  • Physical Sciences › Engineering › Mechanical Engineering › Welding Techniques and Residual Stresses
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
Keywords
laser welding, dissimilar material joining, substrate materials

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