The DOI matches its Crossref record; 12 of the 12 references it cites were found in a registry or an index.
A Review of 5G Front-End Systems Package Integration
Open accessAbstract
Increasing data rates, spectrum efficiency, and energy efficiency have been driving major advances in the design and hardware integration of RF communication networks. In order to meet the data rate and efficiency metrics, fifthgeneration (5G) networks have emerged as a follow-on to 4G and projected to have 100× higher wireless date rates and 100× lower latency than those with current 4G networks. Major challenges arise in the packaging of radio frequency front-end modules because of the stringent low signal-loss requirements in the millimeter-wave frequency bands, and precision-impedance designs with smaller footprints and thickness. Heterogeneous integration in 3-D ultrathin packages with higher component densities and performance than with the existing 2-D packages is needed to realize such 5G systems. This article reviews the key building blocks of 5G systems and the underlying advances in packaging technologies to realize them.
Overview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cites
A Vision of 6G Wireless Systems: Applications, Trends, Technologies, and Open Research Problems
Saad, W., Bennis, M., & Chen, M. (2020) · IEEE Network · doi:10.1109/mnet.001.1900287 · Cited by 4,985
A Survey of 5G Network: Architecture and Emerging Technologies
Gupta, A., & Jha, R. K. (2015) · IEEE Access · doi:10.1109/access.2015.2461602 · Cited by 2,420
Ultrareliable and Low-Latency Wireless Communication: Tail, Risk, and Scale
Bennis, M., Debbah, M. A., & Poor, H. V. (2018) · Proceedings of the IEEE · doi:10.1109/jproc.2018.2867029 · Cited by 1,048
A Fully-Integrated 16-Element Phased-Array Receiver in SiGe BiCMOS for 60-GHz Communications
Natarajan, A., Reynolds, S. K., Tsai, M.-D., Nicolson, S. T., Zhan, J.-H. C., Kam, D. G., Liu, D., Huang, Y.-L. O., Valdes-Garcia, A., & Floyd, B. A. (2011) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2011.2118110 · Cited by 419
Yaacoub, E., & Alouini, M.-S. (2020) · Proceedings of the IEEE · doi:10.1109/jproc.2020.2976703 · Cited by 383
Potential key technologies for 6G mobile communications
Yuan, Y., Zhao, Y., Zong, B., & Parolari, S. (2020) · Science China Information Sciences · doi:10.1007/s11432-019-2789-y · Cited by 189
Gu, X., Liu, D., Baks, C., Tageman, O., Sadhu, B., Hallin, J., Rexberg, L., Parida, P., Kwark, Y., & Valdes-Garcia, A. (2019) · IEEE Transactions on Microwave Theory and Techniques · doi:10.1109/tmtt.2019.2912819 · Cited by 179
Packages for Terahertz Electronics
Song, H.-J. (2017) · Proceedings of the IEEE · doi:10.1109/jproc.2016.2633547 · Cited by 153
Venkatakrishnan, S. B., Alwan, E. A., & Volakis, J. L. (2018) · IEEE Access · doi:10.1109/access.2017.2788179 · Cited by 85
Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages
You, S.-H., Jeon, S.-H., Oh, D. K. S., Kim, K., Kim, J., Cha, S.-Y., & Kim, G. (2018) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc.2018.00199 · Cited by 65
Metadata
- Authors
- Watanabe, A. O., Ali, M., Sayeed, S. Y. B., Tummala, R. R., & Pulugurtha, M. R.
- Venue
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- Published
- 2021-01
- Volume
- 11
- Issue
- 1
- Pages
- 118-133
- ISSN
- 2156-3950 (ISSN-L)
- 2156-3985
- OpenAlex
- W3085592083
- Cited by
- 253
- References
- 12
- FWCI
- 10.04
- Type
- journal article
- Language
- en
- Open access
- green
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: A Review of 5G Front-End Systems Package Integration. https://app.cochat.ai/papers/10.1109/tcpmt.2020.3041412
- The paper
- Watanabe, A. O., Ali, M., Sayeed, S. Y. B., Tummala, R. R., & Pulugurtha, M. R. (2021). A Review of 5G Front-End Systems Package Integration. IEEE Transactions on Components, Packaging and Manufacturing Technology. https://doi.org/10.1109/tcpmt.2020.3041412
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
