Student or educator? Sign up with your school email and get 6 months of Pro free.
Cited by 146

The DOI matches its Crossref record; 2 of the 2 references it cites were found in a registry or an index.

Effect of Asymmetric Layout and Unequal Junction Temperature on Current Sharing of Paralleled SiC MOSFETs With Kelvin-Source Connection

Zhao, Cheng, Wang, Laili, Zhang, Fan·2020·IEEE Transactions on Power Electronics

Abstract

Parallel connection of silicon carbide (SiC) mosfets is a popular solution for high-capacity applications. In order to improve the switching speed of paralleled SiC mosfets, Kelvin-source connection is widely employed. However, the influences of asymmetric layout and unequal junction temperature on current sharing of paralleled SiC mosfets with Kelvin-source connection are not clear. This article addresses the issue for the first time by theoretical analysis and experimental verifications. The mechanism of current imbalance resulting from asymmetric layout and unequal junction temperature in the case with Kelvin-source connection is comprehensively investigated. Then, some significant discoveries are obtained. The static current sharing performance can be affected by drain and power source parasitic inductance, which is seldom mentioned before. Besides, this article first points out that the effect of power source parasitic inductance on dynamic current sharing is dominant compared with other parasitic inductance. What is more, the thermal-electric analyzing results suggest that there is a risk of thermal runaway for paralleled SiC mosfets with Kelvin-source connection at high switching frequency due to positively temperature-dependent dynamic current and switching losses. Based on the discoveries, some guidelines are provided for layout design and application of paralleled SiC mosfets with Kelvin-source connection.

Overview

Integrity signals

Registry

Crossref · 10.1109/tpel.2019.2954716

Cites

2 of 2 references verified0 citation errors · 0 not checkable

Statistics

Recomputing p-values needs the paper’s full text.

Verification

Claims the paper makes

This paper’s full text isn’t openly available, so its claims and self-check weren’t run. The registry and citation checks still apply.

Claims other papers make about this one

Each is checked against this paper’s own text: does it say what the citing paper says it does?

Citations

Cites

Show all 2 references

Research works printed but not linked: 28

  1. 10.1049/iet-pel.2018.5418 · DOI
  2. 10.1109/TIE.2017.2716868 · DOI
  3. 10.1109/TPEL.2019.2899393 · DOI
  4. 10.1109/TIE.2019.2901655 · DOI · Paper page
  5. 10.1109/TPEL.2016.2646323 · DOI
  6. 10.1109/TPEL.2016.2562030 · DOI
  7. 10.1109/JESTPE.2017.2720731 · DOI
  8. jakobi, 2018, Benefits of new CoolSiCTM MOSFET in HybridPACKTM drive package for electrical drive train applications, Proc Int Conf Integr Power Electron Syst, 1
  9. 10.1109/APEC.2000.826153 · DOI
  10. b?czkowski, 2017, Switching current imbalance mitigation in power modules with parallel connected SiC MOSFETs, Proc 19th Eur Conf Power Electron Appl (EPE–ECCE Eur ), p.1
  11. 10.1109/EPE.2013.6634432 · DOI
  12. 10.1109/TPEL.2012.2195332 · DOI
  13. 10.1109/TPEL.2013.2281084 · DOI
  14. 10.1109/TPEL.2013.2283245 · DOI
  15. 10.1109/TPEL.2018.2834345 · DOI
  16. 10.1109/ECCE.2014.6954042 · DOI
  17. 10.1109/ECCE.2017.8095952 · DOI
  18. 10.1109/TPEL.2012.2206611 · DOI
  19. 10.1109/ECCE.2013.6646891 · DOI
  20. 10.1109/APEC.2014.6803501 · DOI · Paper page
  21. abdelrahman, 2018, Wide bandgap devices in electric vehicle converters: A performance survey, Can J Elect Comput Eng, 41, 45, 10.1109/CJECE.2018.2807780 · DOI
  22. 10.1109/ITEC-AP.2018.8433284 · DOI
  23. 10.1109/APEC.2014.6803502 · DOI
  24. 10.1109/TPEL.2016.2639327 · DOI
  25. baker, 2018, Impact of Kelvin-source resistors on current sharing and failure detection in multichip power modules, Proc 20th Eur Conf Power Electron Appl (EPE–ECCE Eur ), p.1
  26. 10.1109/TPEL.2019.2900497 · DOI · Paper page
  27. 10.1109/JESTPE.2014.2313511 · DOI
  28. 10.1109/TPEL.2011.2159624 · DOI

Cited by

See all 146

Metadata

Authors
Zhao, C., Wang, L., & Zhang, F.
Venue
IEEE Transactions on Power Electronics
Published
2020-07
Volume
35
Issue
7
Pages
7392-7404
ISSN
  • 0885-8993
  • 1941-0107
Cited by
146
References
2
Funders
  • National Key Research and Development Program of China Stem Cell and Translational Research (2018YFB0905801)
  • Shaanxi Key Research and Development Plan (2018GY-043)

About these checks

Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

Statistics and arithmetic are recomputed, not judged.

Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.

What counts as a claim ›How we measure confidence ›How we check this ›

Are you an author, or do you see a problem with this page? Request a review

How to cite

Cite CoChat for the checks on this page, and the paper for its own findings.

This page
CoChat. (2026). Citation check: Effect of Asymmetric Layout and Unequal Junction Temperature on Current Sharing of Paralleled SiC MOSFETs With Kelvin-Source Connection. https://app.cochat.ai/papers/10.1109/tpel.2019.2954716
The paper
Zhao, C., Wang, L., & Zhang, F. (2020). Effect of Asymmetric Layout and Unequal Junction Temperature on Current Sharing of Paralleled SiC MOSFETs With Kelvin-Source Connection. IEEE Transactions on Power Electronics. https://doi.org/10.1109/tpel.2019.2954716

Data sources

Bibliographic data: Semantic Scholar, OpenAlex, Crossref.

Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.