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Cited by 79HVDC Systems and Fault ProtectionMultilevel Inverters and ConvertersReliability and Maintenance Optimization

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Reliability Analysis of MMCs Considering Submodule Designs with Individual or Series-Operated IGBTs

Open access
Guo, Jingli, Liang, Jun, Zhang, Xiaotian, Judge, Paul D., Wang, Xiuli, Green, Tim C.·2017·IEEE Transactions on Power Delivery
DOI 10.1109/tpwrd.2016.2572061
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Abstract

The half-bridge-based modular multilevel converter (MMC) has emerged as the favored converter topology for voltage-source HVDC applications. The submodules within the converter can be constructed with either individual insulated-gate bipolar transistor (IGBT) modules or with series-connected IGBTs, which allows for different redundancy strategies to be employed. The main contribution of this paper is that an analytical method was proposed to analyze the reliability of MMCs with the consideration of submodule arrangements and redundancy strategies. Based on the analytical method, the relative merits of two approaches to adding redundancy, and variants created by varying the submodule voltage, are assessed in terms of overall converter reliability. Case studies were conducted to compare the reliability characteristics of converters constructed using the two submodule topologies. It is found that reliability of the MMC with series-connected IGBTs is higher for the first few years but then decreases rapidly. By assigning a reduced nominal voltage to the series valve submodule upon IGBT module failure, the need to install redundant submodules is greatly reduced.

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Research works printed but not linked: 29

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Metadata

Authors
Guo, J., Liang, J., Zhang, X., Judge, P. D., Wang, X., & Green, T. C.
Affiliations
  • Xi'an Jiaotong University (CN)
  • Cardiff University (GB)
  • Imperial College London (GB)
ORCID
Venue
IEEE Transactions on Power Delivery
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published
2017-04
Volume
32
Issue
2
Pages
666-677
ISSN
  • 0885-8977 (ISSN-L)
  • 1937-4208
DOI
10.1109/tpwrd.2016.2572061
OpenAlex
W2405401061
Cited by
79
References
0
Citations by year
2026: 3 · 2025: 3 · 2024: 10 · 2023: 11 · 2022: 9 · 2021: 11 · 2020: 10 · 2019: 11 · 2018: 6 · 2017: 5
FWCI
3.38
Type
journal article
Language
en
Open access
Licence
Locations
  • IEEE Transactions on Power Delivery (publishedVersion, cc-by)
  • ORCA Online Research @Cardiff (Cardiff University) (acceptedVersion)
  • Aston Publications Explorer (Aston University) (acceptedVersion, cc-by)
  • Spiral (Imperial College London) (submittedVersion, cc-by)
Funders
  • National Natural Science Foundation of China (51261130471)
  • EPSRC (EP/K006312/1, EP/I031707/1, EP/I013636/1)
  • China Scholarship Council ((201406280115))
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › HVDC Systems and Fault Protection
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
  • Physical Sciences › Engineering › Safety, Risk, Reliability and Quality › Reliability and Maintenance Optimization
Keywords
modular multilevel converter, half-bridge submodules, series-connected IGBTs, converter reliability, failure analysis

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CoChat. (2026). Citation check: Reliability Analysis of MMCs Considering Submodule Designs with Individual or Series-Operated IGBTs. https://app.cochat.ai/papers/10.1109/tpwrd.2016.2572061
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Guo, J., Liang, J., Zhang, X., Judge, P. D., Wang, X., & Green, T. C. (2017). Reliability Analysis of MMCs Considering Submodule Designs with Individual or Series-Operated IGBTs. IEEE Transactions on Power Delivery. https://doi.org/10.1109/tpwrd.2016.2572061