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A 22nm high performance and low-power CMOS technology featuring fully-depleted tri-gate transistors, self-aligned contacts and high density MIM capacitors

Auth, C., Allen, C., Blattner, A., Bergstrom, D., Brazier, M., Bost, M., Buehler, M., Chikarmane, V., Ghani, T., Glassman, T., Grover, R., Han, W., Hanken, D., Hattendorf, M., Hentges, P., Heussner, R., Hicks, J., Ingerly, D., Jain, P., Jaloviar, S., James, R., Jones, D., Jopling, J., Joshi, S., Kenyon, C., Liu, H., McFadden, R., McIntyre, B., Neirynck, J., Parker, C., Pipes, L., Post, I., Pradhan, S., Prince, M., Ramey, S., Reynolds, T., Roesler, J., Sandford, J., Seiple, J., Smith, P., Thomas, C., Towner, D., Troeger, T., Weber, C., Yashar, P., Zawadzki, K., Mistry, K.·2012·2012 Symposium on VLSI Technology (VLSIT)

Abstract

A 22nm generation logic technology is described incorporating fully-depleted tri-gate transistors for the first time. These transistors feature a 3rd-generation high-k + metal-gate technology and a 5thgeneration of channel strain techniques resulting in the highest drive currents yet reported for NMOS and PMOS. The use of tri-gate transistors provides steep subthreshold slopes (~70mV/dec) and very low DIBL (~50mV/V). Self-aligned contacts are implemented to eliminate restrictive contact to gate registration requirements. Interconnects feature 9 metal layers with ultra-low-k dielectrics throughout the interconnect stack. High density MIM capacitors using a hafnium based high-k dielectric are provided. The technology is in high volume manufacturing.

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Authors
Auth, C., Allen, C., Blattner, A., Bergstrom, D., Brazier, M., Bost, M., Buehler, M., Chikarmane, V., Ghani, T., Glassman, T., Grover, R., Han, W., Hanken, D., Hattendorf, M., Hentges, P., Heussner, R., Hicks, J., Ingerly, D., Jain, P., Jaloviar, S., James, R., Jones, D., Jopling, J., Joshi, S., Kenyon, C., Liu, H., McFadden, R., McIntyre, B., Neirynck, J., Parker, C., Pipes, L., Post, I., Pradhan, S., Prince, M., Ramey, S., Reynolds, T., Roesler, J., Sandford, J., Seiple, J., Smith, P., Thomas, C., Towner, D., Troeger, T., Weber, C., Yashar, P., Zawadzki, K., & Mistry, K.
Venue
2012 Symposium on VLSI Technology (VLSIT)
Publisher
IEEE
Published
2012-06
Pages
131-132
OpenAlex
W2162517322
Cited by
782
References
0
FWCI
119.95
Type
conference paper
Language
en
Open access
closed

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CoChat. (2026). Citation check: A 22nm high performance and low-power CMOS technology featuring fully-depleted tri-gate transistors, self-aligned contacts and high density MIM capacitors. https://app.cochat.ai/papers/10.1109/vlsit.2012.6242496
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Auth, C., Allen, C., Blattner, A., Bergstrom, D., Brazier, M., Bost, M., Buehler, M., Chikarmane, V., Ghani, T., Glassman, T., Grover, R., Han, W., Hanken, D., Hattendorf, M., Hentges, P., Heussner, R., Hicks, J., Ingerly, D., Jain, P., . . . Mistry, K. (2012). A 22nm high performance and low-power CMOS technology featuring fully-depleted tri-gate transistors, self-aligned contacts and high density MIM capacitors. 2012 Symposium on VLSI Technology (VLSIT). https://doi.org/10.1109/vlsit.2012.6242496

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.