Single and Double-Sided Jet Impingement Cooling for SiC-Based Power Modules
Open accessAbstract
Efficient thermal management of power electronics systems is crucial for higher reliability. With the miniaturization of systems, high-loss-density electronics require cooling systems that can extract a large amount of heat. This study explored a liquid-jet-impingement-based direct substrate cooling system for single-sided and double-sided cooling to improve heat extraction efficiency and improve the power density by reducing the volume and mass. The cooling system was implemented for a SiC-based direct bonded copper substrate. Numerical simulations were performed to determine the effects of nozzle diameter, the number of nozzles, and nozzle array orientation on single-sided cooling and thermal performance gain over double-sided cooling. A novel manifold design was proposed that reduced the volume and mass of the manifold and still achieved the target power density. The performance of the proposed design was compared with the pin-fin-based cooling system used in the BMW I3 module, and a comparative analysis was done.
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
Jet impingement cooling uses high-speed jets from micro-nozzles to target hotspots, achieving high heat-transfer coefficients, and is effective for thermally demanding devices such as GaN MMIC power amplifiers.
“Jet impingement cooling uses high-speed jets from micro-nozzles to target hotspots, achieving high HTC; it is effective for thermally demanding devices such as GaN monolithic microwave integrated circuit (MMIC) power amplifiers [29,52-54].”
From Thermal Management of Wide-Bandgap Power Semiconductors: Strategies and Challenges in SiC and GaN Power Devices (2025) · cites this paper as [53]
The Introduction reports that liquid-jet impingement can achieve high heat-transfer coefficients, and the Impingement zone section describes placing nozzles beneath heat-producing devices to increase local heat transfer. The Power Module Layout studies SiC devices with 1 mm nozzles; the paper does not establish effectiveness for GaN MMIC power amplifiers. (LLM, conf=0.88)
Experimental — accuracy not yet measured
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Cites
Thermal Management on IGBT Power Electronic Devices and Modules
Qian, C., Gheitaghy, A. M., Fan, J., et al. (2018) · IEEE Access · doi:10.1109/access.2018.2793300 · Cited by 348 · see citing works
Correlating Equations for Impingement Cooling of Small Heat Sources With Single Circular Liquid Jets
Womac, D. J., Ramadhyani, S., & Incropera, F. P. (1993) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.2910635 · Cited by 164 · see citing works
Optimized Heat Transfer for High Power Electronic Cooling Using Arrays of Microjets
Fabbri, M., & Dhir, V. K. (2004) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.1924624 · Cited by 143 · see citing works
Electrical and Electronics Technical Team Roadmap
None (2013) · doi:10.2172/1220125 · Cited by 133 · see citing works
Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
Broughton, J., Smet, V., Tummala, R., & Joshi, Y. K. (2018) · Journal of Electronic Packaging · doi:10.1115/1.4040828 · Cited by 126 · see citing works
Robinson, A. J. (2009) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/tcapt.2008.2010408 · Cited by 84 · see citing works
Thermal performance study of integrated cold plate with power module
Zhang, Y. P., Yu, X., Feng, Q. K., et al. (2009) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2009.06.013 · Cited by 67 · see citing works
A high temperature, double-sided cooling SiC power electronics module
Zhang, H., Ang, S. S., Mantooth, H. A., et al. (2013) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2013.6647075 · Cited by 61 · see citing works
Wide bandgap semiconductor opportunities in power electronics
Armstrong, K., Das, S., & Cresko, J. (2016) · IEEE Workshop on Wide Bandgap Power Devices and Applications · doi:10.1109/wipda.2016.7799949 · Cited by 55 · see citing works
Misconception of thermal spreading angle and misapplication to IGBT power modules
Yang, X., & Hopkins, D. C. (2014) · IEEE Applied Power Electronics Conference and Exposition (APEC) · doi:10.1109/apec.2014.6803362 · Cited by 40 · see citing works
Design of light-weight, single-phase liquid-cooled heat exchanger for automotive power electronics
Narumanchi, S. V. J., Mihalic, M., Moreno, G., et al. (2012) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm.2012.6231495 · Cited by 23 · see citing works
Thermofluid Design of Single-Phase Submerged-Jet Impingement Cooling for Electronic Components
Maddox, D. E., & Bar‐Cohen, A. (1994) · Journal of Electronic Packaging · doi:10.1115/1.2905692 · Cited by 21 · see citing works
Wang, C., Zheng, L., Li, H., et al. (2014) · International Conference on Electronic Packaging Technology (ICEPT) · doi:10.1109/icept.2014.6922733 · Cited by 11 · see citing works
Sahu, R., Gurpinar, E., & Ozpineci, B. (2020) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce44975.2020.9235943 · Cited by 7 · see citing works
Self-citationJet Impingement Cooling of Electric Machines with Driveline Fluids
Kekelia, B. (2021) · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · Cited by 1 · see citing works
Flagged first, then by citations
Research works printed but not linked: 2
- "Dielectric jet impingement cooling of electronic chips," in Proc. 34th ASME Nat. Heat Transfer Conf., 2000.
- C. Wang, L. Zheng, L. Han, H. Fang, and J. Xu, "Thermal performance investigation of three-dimensional structure unit in double-sided cooling IGBT module," in Proceedings of the Electronic Packaging Technology Conference, Oct. 2014, pp. 622-625, doi: 10.1109/ICEPT.2014.6922733. · DOI
Cited by
Sorted by citations
Han, G., Kim, J., Park, S., & Bae, W. (2025) · Electronics · doi:10.3390/electronics14214193 · Cited by 34 · see citing works
“…multi-chip modules [40] Jet Impingement • R th reduction: up to 64.3% (vs. indirect) [52] • Very high HTC • Effective direct hotspot cooling [52,53] • High pumping power required ( ∼ 5 × ) [52] • Increased system complexity • Potential leakage risk • Enables near-junction cooling • Shortens…”
Influential
- Authors
- Barua, H., Chowdhury, S., Wilkins, J., & Ozpineci, B.
- Affiliations
- Oak Ridge National Laboratory (US)
- Venue
- 2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)
- Publisher
- IEEE
- Published
- 2023-12-04
- Pages
- 1-6
- OpenAlex
- W4390806889
- Cited by
- 4
- References
- 15
- Citations by year
- 2026: 1 · 2025: 2 · 2024: 1
- FWCI
- 3.54
- Type
- conference paper
- Language
- en
- Open access
- green
- www.osti.gov
- Locations
- IEEE Workshop on Wide Bandgap Power Devices and Applications (publishedVersion)
- OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) (submittedVersion)
- Funders
- Vehicle Technologies Office
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Optimization
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer Mechanisms
- Keywords
- jet impingement cooling, liquid jet impingement, SiC power modules, direct bonded copper substrate, double-sided cooling, thermal management, power electronics cooling, manifold design, power density, heat removal
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
