Novel Silicon Carbide Integrated Power Module for EV application
Open accessAbstract
The successful penetration of Electric Vehicles (EVs) into the global automotive markets requires the developments of cost effective, high performance and high integration power electronic systems. The present work is concerned with the structural integration of power electronic converters to meet targets for increased power density, improved electrical performance and reduced cost without compromising thermal performance or reliability for EV applications. In particular, a SiC power module to integrate multiple functional elements, i.e. semiconductor devices, DC-link capacitors, output filters, current sensing, and gate driver within a single enclosure sharing a common cooling circuit has been designed and fabricated. Electrical test results showed very smooth waveforms of the outputs, verifying the high frequency switching capacity of the fabricated power module.
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Mouawad et al. present a Silicon Carbide Integrated Power Module that integrates multiple functional elements and is able to increase power density, improve electrical performance, and reduce costs without compromising thermal performance or reliability.
“In particular, they present a Silicon Carbide Integrated Power Module that integrates multiple functional elements (i.e., semiconductor devices, DC-link capacitors, output filters, current sensing, and gate driver), which is able to increase power density, improve electrical performance, and reduce the costs without compromising thermal performance or reliability.”
From A Review on Electric Vehicles: Technologies and Challenges (2021) · cites this paper as [93]
Mouawad et al. proposed cost effective and high integration, as well as performance power electronic systems.
“In the same line, other authors, such as Mouawad et al. [93], proposed cost effective and high integration, as well as performance power electronic systems.”
From A Review on Electric Vehicles: Technologies and Challenges (2021) · cites this paper as [93]
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References 10 · Cited by 23
- Authors
- Mouawad, B., Espina, J., Li, J., Empringham, L., & Johnson, C. M.
- Affiliations
- University of Nottingham (GB)
- Venue
- 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)
- Publisher
- IEEE
- Published
- 2018-05
- Pages
- 176-180
- OpenAlex
- W2888638904
- Cited by
- 23
- References
- 10
- Citations by year
- 2025: 3 · 2024: 1 · 2023: 2 · 2022: 3 · 2021: 7 · 2020: 4 · 2019: 2 · 2018: 1
- FWCI
- 5.57
- Type
- conference paper
- Language
- en
- Open access
- Licence
- cc-by
- Locations
- 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) (publishedVersion)
- Nottingham ePrints (University of Nottingham) (acceptedVersion)
- Repository@Nottingham (University of Nottingham) (submittedVersion, cc-by)
- Funders
- Engineering and Physical Sciences Research Council (EP/K035304/1)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced DC-DC Converters
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
- Keywords
- silicon carbide, integrated power module, electric vehicles, power electronics packaging, power density, DC-link capacitors, output filter, current sensing, gate driver, high switching frequency
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