The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.
Thermal Transport Mechanisms at Nanoscale Point Contacts
Abstract
We have experimentally investigated the heat transfer mechanisms at a 90±10 nm diameter point contact between a sample and a probe tip of a scanning thermal microscope (SThM). For large heated regions on the sample, air conduction is the dominant tip-sample heat transfer mechanism. For micro/nano devices with a submicron localized heated region, the air conduction contribution decreases, whereas conduction through the solid-solid contact and a liquid meniscus bridging the tip-sample junction become important, resulting in the sub-100 nm spatial resolution found in the SThM images. Using a one dimensional heat transfer model, we extracted from experimental data a liquid film thermal conductance of 6.7±1.5 nW/K. Solid-solid conduction increased linearly as contact force increased, with a contact conductance of 0.76±0.38W/m2-K-Pa, and saturated for contact forces larger than 38±11 nN. This is most likely due to the elastic-plastic contact between the sample and an asperity at the tip end.
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Citations
Cites
Cooper, M. G., Mikic, B. B., & Yovanovich, M. M. (1969) · International Journal of Heat and Mass Transfer · doi:10.1016/0017-9310(69)90011-8 · Cited by 1,069
Cited by
Cahill, D. G., Ford, W. K., Goodson, K. E., Mahan, G. D., Majumdar, A., Maris, H. J., Merlin, R., & Phillpot, S. R. (2003) · Journal of Applied Physics · doi:10.1063/1.1524305 · Cited by 2,825
Self-citationThermoelectricity in Molecular Junctions
Reddy, P., Jang, S.-Y., Segalman, R. A., & Majumdar, A. (2007) · Science · doi:10.1126/science.1137149 · Cited by 955
Self-citationMolecular transport junctions: vibrational effects
Galperin, M., Ratner, M. A., & Nitzan, A. (2007) · Journal of Physics: Condensed Matter · doi:10.1088/0953-8984/19/10/103201 · Cited by 771
Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures
Cahill, D. G., Goodson, K., & Majumdar, A. (2002) · Journal of Heat Transfer · doi:10.1115/1.1454111 · Cited by 611
Self-citationScanning thermal microscopy: A review
Gomès, S., Assy, A., & Chapuis, P.-O. (2015) · physica status solidi (a) · doi:10.1002/pssa.201400360 · Cited by 281
Metadata
- Authors
- Shi, L., & Majumdar, A.
- Venue
- Journal of Heat Transfer
- Publisher
- ASME International
- Published
- 2001-07-27
- Volume
- 124
- Issue
- 2
- Pages
- 329-337
- ISSN
- 0022-1481 (ISSN-L)
- 1528-8943
- OpenAlex
- W2047261715
- Cited by
- 239
- References
- 1
- FWCI
- 3.23
- Type
- journal article
- Language
- en
- Open access
- closed
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