Cited by 733Thermal properties of materialsAdvanced Thermoelectric Materials and DevicesAdvanced MEMS and NEMS Technologies

The DOI matches its Crossref record; 23 of the 23 references it cites were found in a registry or an index.

Measuring Thermal and Thermoelectric Properties of One-Dimensional Nanostructures Using a Microfabricated Device

Shi, Li, Li, Deyu, Yu, Choongho, Jang, Wanyoung, Kim, Dohyung, Yao, Zhen, Kim, Philip, Majumdar, Arunava·2003·Journal of Heat Transfer

DOI 10.1115/1.1597619

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Abstract

We have batch-fabricated a microdevice consisting of two adjacent symmetric silicon nitride membranes suspended by long silicon nitride beams for measuring thermophysical properties of one-dimensional nanostructures (nanotubes, nanowires, and nanobelts) bridging the two membranes. A platinum resistance heater/thermometer is fabricated on each membrane. One membrane can be Joule heated to cause heat conduction through the sample to the other membrane. Thermal conductance, electrical conductance, and Seebeck coefficient can be measured using this microdevice in the temperature range of 4–400 K of an evacuated Helium cryostat. Measurement sensitivity, errors, and uncertainty are discussed. Measurement results of a 148 nm and a 10 nm-diameter single wall carbon nanotube bundle are presented.

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Research works printed but not linked: 2

Osman, M., and Srivastava, D., 2001, “Temperature Dependence of the Thermal Conductivity of Single-Wall Carbon Nanotubes,” Nanotechnology, 12, pp. 21–24.
Shi, L., 2001, “Mesoscopic Thermophysical Measurements of Microstructures and Carbon Nanotubes,” Ph.D. dissertation, University of California, Berkeley.

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Authors: Shi, L., Li, D., Yu, C., Jang, W., Kim, D., Yao, Z., Kim, P., & Majumdar, A.
Affiliations: The University of Texas at Austin (US)
University of California, Berkeley (US)
Columbia University (US)
Materials Science Division, Lawrence Berkeley National Laboratory, Department of Mechanical Engineering, University of California, Berkeley, CA 94720
ORCID: Shi, Li
Li, Deyu
Yu, Choongho
Kim, Dohyung
Kim, Philip
Venue: Journal of Heat Transfer
Publisher: ASME International
Published: 2003-09-23
Volume: 125
Issue: 5
Pages: 881-888
ISSN: 0022-1481 (ISSN-L)
1528-8943
DOI: 10.1115/1.1597619
OpenAlex: W2040661631
Semantic Scholar: 36922bc08f4caed915c364c93188d36e9f770161
Cited by: 733
References: 23
Citations by year: 2026: 19 · 2025: 21 · 2024: 36 · 2023: 25 · 2022: 34 · 2021: 35 · 2020: 46 · 2019: 40 · 2018: 49 · 2017: 41 · 2016: 38 · 2015: 40 · 2014: 38 · 2013: 44 · 2012: 37
FWCI: 8.68
Type: journal article
Language: en
Open access: closed
Locations: ASME Journal of Heat and Mass Transfer (publishedVersion)
Funders: National Science Foundation
U.S. Department of Energy
Welch Foundation
Georgia Institute of Technology
University of Texas at Austin
Basic Energy Sciences
Topics: Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
Physical Sciences › Materials Science › Materials Chemistry › Advanced Thermoelectric Materials and Devices
Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced MEMS and NEMS Technologies
Keywords: thermal conductance, thermoelectric properties, Seebeck coefficient, one-dimensional nanostructures, carbon nanotubes, nanowires, nanobelts, silicon nitride membranes, Joule heating, electrical conductance, cryogenic temperature measurement

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Measuring Thermal and Thermoelectric Properties of One-Dimensional Nanostructures Using a Microfabricated Device

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