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Step and flash imprint lithography: Template surface treatment and defect analysis

Bailey, T., Choi, B. J., Colburn, M., Meissl, M., Shaya, S., Ekerdt, J. G., Sreenivasan, S. V., Willson, C. G.·2000·Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

Abstract

We have finished the construction of an automated tool for step and flash imprint lithography. The tool was constructed to allow defect studies by making multiple imprints on a 200 mm wafer. The imprint templates for this study were treated with a low surface energy, self-assembled monolayer to ensure selective release at the template-etch barrier interface. This surface treatment is very durable and survives repeated imprints and multiple aggressive physical and chemical cleanings. The imprint and release forces were measured for a number of successive imprints, and did not change significantly. The process appears to be “self-cleaning.” Contamination on the template is entrained in the polymerizing liquid, and the number of defects is reduced with repeated imprints.

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Metadata

Authors
Bailey, T., Choi, B. J., Colburn, M., Meissl, M., Shaya, S., Ekerdt, J. G., Sreenivasan, S. V., & Willson, C. G.
Venue
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
Published
2000-11-01
Volume
18
Issue
6
Pages
3572-3577
ISSN
  • 1071-1023 (ISSN-L)
  • 1520-8567
OpenAlex
W2138368127
Cited by
351
References
0
FWCI
10.78
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Step and flash imprint lithography: Template surface treatment and defect analysis. https://app.cochat.ai/papers/10.1116/1.1324618
The paper
Bailey, T., Choi, B. J., Colburn, M., Meissl, M., Shaya, S., Ekerdt, J. G., Sreenivasan, S. V., & Willson, C. G. (2000). Step and flash imprint lithography: Template surface treatment and defect analysis. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena. https://doi.org/10.1116/1.1324618

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