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Alteration of Cu conductivity in the size effect regime
Abstract
The resistivity of thin Cu films depends on film thickness as the dimensions approach the electron mean-free-path for Cu of 39 nm. The key size-dependent contributions are from electron–surface scattering, grain boundary scattering, and surface roughness-induced scattering. Measurements with pseudoepitaxial Cu films deposited on Si have been undertaken to reduce effects of grain boundaries and surface roughness and suggest an electron-scattering parameter of p=0.12. Overlayers of metal films on the Cu generally increase the resistivity for Ta and Pt overlayers, and may reduce the resistivity for Au and Al. The resistivity increase may also be reversed if the overlayer oxidizes.
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Citations
Cited by
Potential Applications of Carbon Nanotubes
Endo, M., Strano, M. S., & Ajayan, P. M. (2007) · Topics in Applied Physics · doi:10.1007/978-3-540-72865-8_2 · Cited by 481
Size-Dependent Resistivity in Nanoscale Interconnects
Josell, D., Brongersma, S. H., & Tőkei, Z. (2009) · Annual Review of Materials Research · doi:10.1146/annurev-matsci-082908-145415 · Cited by 286
Conductance Modeling for Graphene Nanoribbon (GNR) Interconnects
Naeemi, A., & Meindl, J. D. (2007) · IEEE Electron Device Letters · doi:10.1109/led.2007.895452 · Cited by 257
Liang, J., Yeh, S., Wong, S. S., & Wong, H.-S. P. (2013) · ACM Journal on Emerging Technologies in Computing Systems · doi:10.1145/2422094.2422103 · Cited by 71
Aguirre, F. L., Pazos, S. M., Palumbo, F., Sune, J., & Miranda, E. (2020) · IEEE Access · doi:10.1109/access.2020.3035638 · Cited by 36
Metadata
- Authors
- Rossnagel, S. M., & Kuan, T. S.
- Venue
- Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
- Publisher
- American Vacuum Society
- Published
- 2004-01-01
- Volume
- 22
- Issue
- 1
- Pages
- 240-247
- ISSN
- 1071-1023 (ISSN-L)
- 1520-8567
- OpenAlex
- W2046530548
- Cited by
- 457
- References
- 0
- FWCI
- 13.91
- Type
- journal article
- Language
- en
- Open access
- closed
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- Rossnagel, S. M., & Kuan, T. S. (2004). Alteration of Cu conductivity in the size effect regime. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena. https://doi.org/10.1116/1.1642639
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