Cited by 27Laser Material Processing TechniquesLaser-Matter Interactions and ApplicationsLaser-Ablation Synthesis of Nanoparticles

The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.

Femtosecond versus picosecond laser ablation (Keynote Address)

Abstract

Results of ablation of different materials by femtosecond and picosecond laser pulses are compared. Advantages and disadvantages of both laser systems are discussed. Two most important criteria, processing speed and quality of the fabricated structures, are addressed. High repetition rate picosecond lasers allow high speed cutting of thin metal foils and silicon wafers, whereas for micro-drilling it is more advantageous to use femtosecond laser systems.

Overview

Integrity signals

Registry

Crossref · 10.1117/12.597975

Cites

1 of 1 references verified0 citation errors · 0 not checkable

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Metadata

Authors
Ostendorf, A., Kamlage, G., Klug, U., Korte, F., & Chichkov, B. N.
Affiliations
Laser Zentrum Hannover (DE)
Venue
SPIE Proceedings
Publisher
SPIE
Published
2005-04-12
Volume
5713
Pages
1
ISSN
0277-786X (ISSN-L)
OpenAlex
W1987827178
Cited by
27
References
1
Citations by year
2023: 3 · 2022: 2 · 2021: 1 · 2019: 1 · 2018: 3 · 2015: 3 · 2014: 1 · 2012: 2
FWCI
6.11
Type
conference paper
Language
en
Open access
closed
Locations
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (publishedVersion)
Topics
  • Physical Sciences › Engineering › Industrial and Manufacturing Engineering › Laser Material Processing Techniques
  • Physical Sciences › Physics and Astronomy › Atomic and Molecular Physics, and Optics › Laser-Matter Interactions and Applications
  • Physical Sciences › Materials Science › Materials Chemistry › Laser-Ablation Synthesis of Nanoparticles
Keywords
laser ablation, femtosecond laser, picosecond laser, laser cutting, micro-drilling, thin metal foils, silicon wafers, processing speed, high repetition rate lasers

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