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Cited by 2,084

The DOI matches its Crossref record; 2 of the 2 references it cites were found in a registry or an index.

Dense dislocation arrays embedded in grain boundaries for high-performance bulk thermoelectrics

Kim, Sang Il, Lee, Kyu Hyoung, Mun, Hyeon A, Kim, Hyun Sik, Hwang, Sung Woo, Roh, Jong Wook, Yang, Dae Jin, Shin, Weon Ho, Li, Xiang Shu, Lee, Young Hee, Snyder, G. Jeffrey, Kim, Sung Wng·2015·Science

Abstract

Squeezing out efficient thermoelectrics: Thermoelectric materials hold the promise of converting waste heat into electricity. The challenge is to develop high-efficiency materials that are not too expensive. Kim et al. suggest a pathway for developing inexpensive thermoelectrics. They show a dramatic improvement of efficiency in bismuth telluride samples by quickly squeezing out excess liquid during compaction. This method introduces grain boundary dislocations in a way that avoids degrading electrical conductivity, which makes a better thermoelectric material. With the potential for scale-up and application to cheaper materials, this discovery presents an attractive path forward for thermoelectrics. Science , this issue p. 109

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Crossref · 10.1126/science.aaa4166

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Metadata

Authors
Kim, S. I., Lee, K. H., Mun, H. A., Kim, H. S., Hwang, S. W., Roh, J. W., Yang, D. J., Shin, W. H., Li, X. S., Lee, Y. H., Snyder, G. J., & Kim, S. W.
Venue
Science
Published
2015-04-03
Volume
348
Issue
6230
Pages
109-114
ISSN
  • 0036-8075 (ISSN-L)
  • 1095-9203
OpenAlex
W2013073809
Cited by
2,084
References
2
FWCI
65.42
Type
journal article
Language
en
Open access
closed

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

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