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Cited by 261

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GaN-Based Trench Gate Metal Oxide Semiconductor Field-Effect Transistor Fabricated with Novel Wet Etching

Open access
Kodama, Masahito, Sugimoto, Masahiro, Hayashi, Eiko, Soejima, Narumasa, Ishiguro, Osamu, Kanechika, Masakazu, Itoh, Kenji, Ueda, Hiroyuki, Uesugi, Tsutomu, Kachi, Tetsu·2008·Applied Physics Express

Abstract

A novel method for fabricating trench structures on GaN was developed. A smooth non-polar (1100) plane was obtained by wet etching using tetramethylammonium hydroxide (TMAH) as the etchant. A U-shape trench with the (1100) plane side walls was formed with dry etching and the TMAH wet etching. A U-shape trench gate metal oxide semiconductor field-effect transistor (MOSFET) was also fabricated using the novel etching technology. This device has the excellent normally-off operation of drain current–gate voltage characteristics with the threshold voltage of 10 V. The drain breakdown voltage of 180 V was obtained. The results indicate that the trench gate structure can be applied to GaN-based transistors.

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Metadata

Authors
Kodama, M., Sugimoto, M., Hayashi, E., Soejima, N., Ishiguro, O., Kanechika, M., Itoh, K., Ueda, H., Uesugi, T., & Kachi, T.
Venue
Applied Physics Express
Published
2008-02-15
Volume
1
Pages
021104
ISSN
  • 1882-0778 (ISSN-L)
  • 1882-0786
OpenAlex
W1976769231
Cited by
261
References
0
FWCI
4.73
Type
journal article
Language
en
Open access
bronze

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CoChat. (2026). Citation check: GaN-Based Trench Gate Metal Oxide Semiconductor Field-Effect Transistor Fabricated with Novel Wet Etching. https://app.cochat.ai/papers/10.1143/apex.1.021104
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Kodama, M., Sugimoto, M., Hayashi, E., Soejima, N., Ishiguro, O., Kanechika, M., Itoh, K., Ueda, H., Uesugi, T., & Kachi, T. (2008). GaN-Based Trench Gate Metal Oxide Semiconductor Field-Effect Transistor Fabricated with Novel Wet Etching. Applied Physics Express. https://doi.org/10.1143/apex.1.021104

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

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