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Cited by 181

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Making sensor networks IPv6 ready

Open access
Durvy, Mathilde, Abeillé, Julien, Wetterwald, Patrick, O'Flynn, Colin, Leverett, Blake, Gnoske, Eric, Vidales, Michael, Mulligan, Geoff, Tsiftes, Nicolas, Finne, Niclas, Dunkels, Adam·2008·Proceedings of the 6th ACM conference on Embedded network sensor systems

Abstract

With emerging IPv6-based standards such as 6LowPAN and ISA100a, full IPv6 sensor networks are the next major step. With millions of deployed embedded IPv6 devices, interoperability is of major importance, both within the sensor networks and between the sensors and the Internet hosts. We present uIPv6, the first IPv6 stack for memory-constrained devices that passes all Phase-1 IPv6 Ready certification tests. This is an important step for end-to-end interoperability between IPv6 sensors and any IPv6 capable device. To allow widespread community adoption, we release uIPv6 under a permissive open source license that allows both commercial and non-commercial use.

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Metadata

Authors
Durvy, M., Abeillé, J., Wetterwald, P., O'Flynn, C., Leverett, B., Gnoske, E., Vidales, M., Mulligan, G., Tsiftes, N., Finne, N., & Dunkels, A.
Venue
Proceedings of the 6th ACM conference on Embedded network sensor systems
Publisher
ACM
Published
2008-11-05
Pages
421-422
OpenAlex
W1969477657
Cited by
181
References
0
FWCI
35.64
Type
conference paper
Language
en
Open access
green

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CoChat. (2026). Citation check: Making sensor networks IPv6 ready. https://app.cochat.ai/papers/10.1145/1460412.1460483
The paper
Durvy, M., Abeillé, J., Wetterwald, P., O'Flynn, C., Leverett, B., Gnoske, E., Vidales, M., Mulligan, G., Tsiftes, N., Finne, N., & Dunkels, A. (2008). Making sensor networks IPv6 ready. Proceedings of the 6th ACM conference on Embedded network sensor systems. https://doi.org/10.1145/1460412.1460483

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.