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Damascene copper electroplating for chip interconnections
Abstract
Damascene Cu electroplating for on-chip metallization, which we conceived and developed in the early 1990s, has been central to IBM's Cu chip interconnection technology. We review here the challenges of filling trenches and vias with Cu without creating a void or seam, and the discovery that electrodeposition can be engineered to give filling performance significantly better than that achievable with conformal step coverage. This attribute of superconformal deposition, which we call superfilling, and its relation to plating additives are discussed, and we present a numerical model that represents the shape-change behavior of this system.
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Cited by
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Burr, G. W., Breitwisch, M. J., Franceschini, M., Garetto, D., Gopalakrishnan, K., Jackson, B., Kurdi, B., Lam, C., Lastras, L. A., Padilla, A., et al. (2010) · Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena · doi:10.1116/1.3301579 · Cited by 916
Nanoporous Copper Films by Additive-Controlled Electrodeposition: CO2 Reduction Catalysis
Hoang, T. T. H., Ma, S., Gold, J. I., Kenis, P. J. A., & Gewirth, A. A. (2017) · ACS Catalysis · doi:10.1021/acscatal.6b03613 · Cited by 296
Metadata
- Authors
- Andricacos, P. C., Uzoh, C., Dukovic, J. O., Horkans, J., & Deligianni, H.
- Venue
- IBM Journal of Research and Development
- Publisher
- IBM
- Published
- 1998-09
- Volume
- 42
- Issue
- 5
- Pages
- 567-574
- ISSN
- 0018-8646 (ISSN-L)
- OpenAlex
- W2027228089
- Cited by
- 1,222
- References
- 0
- FWCI
- 18.44
- Type
- journal article
- Language
- en
- Open access
- closed
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- CoChat. (2026). Citation check: Damascene copper electroplating for chip interconnections. https://app.cochat.ai/papers/10.1147/rd.425.0567
- The paper
- Andricacos, P. C., Uzoh, C., Dukovic, J. O., Horkans, J., & Deligianni, H. (1998). Damascene copper electroplating for chip interconnections. IBM Journal of Research and Development. https://doi.org/10.1147/rd.425.0567
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
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