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Handbook of Semiconductor Manufacturing Technology
Abstract
Overview of semiconductor devices introduction to semiconductor equipment silicon materials surface preparation ion implantation dopant diffusion oxidation silicidation rapid thermal processing overview of interconnect chemical vapourdeposition alternate interlevel dielectrics polymide dielectrics physical vapour deposition chemical-mechanical polish optical lithography photoresist materials and processing x-ray lithography electron-beam lithography photomask fabrication plasma etching equipment reliability overview of process control in-line metrology in-situ metrology yield modelling yield management electrical, physical and chemical characterization failure analysis. Appendices: glossary of manufacturing terms acronyms used in semiconductor manufacturing standards and specifications units of measure and conversion tables useful constants.
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Cited by
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An overview of through-silicon-via technology and manufacturing challenges
Gambino, J. P., Adderly, S. A., & Knickerbocker, J. U. (2015) · Microelectronic Engineering · doi:10.1016/j.mee.2014.10.019 · Cited by 317
Gas identification with graphene plasmons
Hu, H., Yang, X., Guo, X., Khaliji, K., Biswas, S. R., García de Abajo, F. J., Low, T., Sun, Z., & Dai, Q. (2019) · Nature Communications · doi:10.1038/s41467-019-09008-0 · Cited by 225
Metadata
- Venue
- CRC Press eBooks
- Publisher
- CRC Press
- Published
- 2017-12-19
- OpenAlex
- W1607019360
- Cited by
- 529
- References
- 0
- FWCI
- 25.11
- Type
- book
- Language
- en
- Open access
- closed
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