The DOI matches its Crossref record; 22 of the 22 references it cites were found in a registry or an index.
An overview of through-silicon-via technology and manufacturing challenges
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Citations
Cites
Electromigration—A brief survey and some recent results
Black, J. R. (1969) · IEEE Transactions on Electron Devices · doi:10.1109/t-ed.1969.16754 · Cited by 1,506
Recent advances on electromigration in very-large-scale-integration of interconnects
Tu, K. N. (2003) · Journal of Applied Physics · doi:10.1063/1.1611263 · Cited by 1,064
High aspect ratio silicon etch: A review
Wu, B., Kumar, A., & Pamarthy, S. (2010) · Journal of Applied Physics · doi:10.1063/1.3474652 · Cited by 749
A 90-nm logic technology featuring strained-silicon
Thompson, S. E., Armstrong, M., Auth, C., Alavi, M., Buehler, M., Chau, R., Cea, S., Ghani, T., Glass, G., Hoffman, T., et al. (2004) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2004.836648 · Cited by 671
Handbook of Semiconductor Manufacturing Technology
(2017) · CRC Press eBooks · doi:10.1201/9781420017663 · Cited by 529
8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology
Kang, U., Chung, H.-J., Heo, S., Park, D.-H., Lee, H., Kim, J. H., Ahn, S.-H., Cha, S.-H., Ahn, J., Kwon, D., et al. (2010) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2009.2034408 · Cited by 485
Niklaus, F., Stemme, G., Lu, J. Q., & Gutmann, R. J. (2006) · Journal of Applied Physics · doi:10.1063/1.2168512 · Cited by 472
Hybrid memory cube new DRAM architecture increases density and performance
Jeddeloh, J., & Keeth, B. (2012) · 2012 Symposium on VLSI Technology (VLSIT) · doi:10.1109/vlsit.2012.6242474 · Cited by 444
Pawlowski, J. T. (2011) · 2011 IEEE Hot Chips 23 Symposium (HCS) · doi:10.1109/hotchips.2011.7477494 · Cited by 391
Processor Design in 3D Die-Stacking Technologies
Loh, G. H., Xie, Y., & Black, B. (2007) · IEEE Micro · doi:10.1109/mm.2007.59 · Cited by 292
Cited by
Solid-state qubits integrated with superconducting through-silicon vias
Yost, D. R. W., Schwartz, M. E., Mallek, J., Rosenberg, D., Stull, C., Yoder, J. L., Calusine, G., Cook, M., Das, R., Day, A. L., et al. (2020) · npj Quantum Information · doi:10.1038/s41534-020-00289-8 · Cited by 128
Metadata
- Authors
- Gambino, J. P., Adderly, S. A., & Knickerbocker, J. U.
- Venue
- Microelectronic Engineering
- Publisher
- Elsevier BV
- Published
- 2015-03
- Volume
- 135
- Pages
- 73-106
- ISSN
- 0167-9317 (ISSN-L)
- OpenAlex
- W1998290008
- Cited by
- 317
- References
- 22
- FWCI
- 11.55
- Type
- journal article
- Language
- en
- Open access
- closed
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- CoChat. (2026). Citation check: An overview of through-silicon-via technology and manufacturing challenges. https://app.cochat.ai/papers/10.1016/j.mee.2014.10.019
- The paper
- Gambino, J. P., Adderly, S. A., & Knickerbocker, J. U. (2015). An overview of through-silicon-via technology and manufacturing challenges. Microelectronic Engineering. https://doi.org/10.1016/j.mee.2014.10.019
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
