The DOI matches its Crossref record; 3 of the 3 references it cites were found in a registry or an index.
Photonic wire bonding: a novel concept for chip-scale interconnects
Open accessAbstract
Photonic integration requires a versatile packaging technology that enables low-loss interconnects between photonic chips in three-dimensional configurations. In this paper we introduce the concept of photonic wire bonding, where polymer waveguides with three-dimensional freeform geometries are used to bridge the gap between nanophotonic circuits located on different chips. In a proof-of-principle experiment, we demonstrate the fabrication of single-mode photonic wire bonds (PWB) by direct-write two-photon lithography. First-generation prototypes allow for efficient broadband coupling with average insertion losses of only 1.6 dB in the C-band and can carry wavelength-division multiplexing signals with multi-Tbit/s data rates. Photonic wire bonding is well suited for automated mass production, and we expect the technology to enable optical multi-chip systems with enhanced performance and flexibility.
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Cites
Finer features for functional microdevices
Kawata, S., Sun, H.-B., Tanaka, T., & Takada, K. (2001) · Nature · doi:10.1038/35089130 · Cited by 2,871
Three-dimensional microfabrication with two-photon-absorbed photopolymerization
Maruo, S., Nakamura, O., & Kawata, S. (1997) · Optics Letters · doi:10.1364/ol.22.000132 · Cited by 1,952
CMOS Photonics for High-Speed Interconnects
Gunn, C. (2006) · IEEE Micro · doi:10.1109/mm.2006.32 · Cited by 471
Cited by
Hybrid integrated quantum photonic circuits
Elshaari, A. W., Pernice, W., Srinivasan, K., Benson, O., & Zwiller, V. (2020) · Nature Photonics · doi:10.1038/s41566-020-0609-x · Cited by 805
Coupling strategies for silicon photonics integrated chips [Invited]
Marchetti, R., Lacava, C., Carroll, L., Gradkowski, K., & Minzioni, P. (2019) · Photonics Research · doi:10.1364/prj.7.000201 · Cited by 635
Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding
Billah, M. R., Blaicher, M., Hoose, T., Dietrich, P.-I., Marin-Palomo, P., Lindenmann, N., Nesic, A., Hofmann, A., Troppenz, U., Moehrle, M., et al. (2018) · Optica · doi:10.1364/optica.5.000876 · Cited by 299
Self-citationSingle chip photonic deep neural network with accelerated training
Bandyopadhyay, S., Sludds, A., Krastanov, S., Hamerly, R., Harris, N., Bunandar, D., Streshinsky, M., Hochberg, M., & Englund, D. (2022) · arXiv · doi:10.48550/arxiv.2208.01623 · Cited by 265
The Emergence of Silicon Photonics as a Flexible Technology Platform
Chen, X., Milosevic, M. M., Stankovic, S., Reynolds, S., Bucio, T. D., Li, K., Thomson, D. J., Gardes, F., & Reed, G. T. (2018) · Proceedings of the IEEE · doi:10.1109/jproc.2018.2854372 · Cited by 247
Metadata
- Authors
- Lindenmann, N., Balthasar, G., Hillerkuss, D., Schmogrow, R., Jordan, M., Leuthold, J., Freude, W., & Koos, C.
- Venue
- Optics Express
- Publisher
- Optica Publishing Group
- Published
- 2012-07-19
- Volume
- 20
- Issue
- 16
- Pages
- 17667
- ISSN
- 1094-4087 (ISSN-L)
- OpenAlex
- W2038016921
- Cited by
- 423
- References
- 3
- FWCI
- 8.95
- Type
- journal article
- Language
- en
- Open access
- gold
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